Contactless chip card

• US 5,955,723 A
• Filed: 11/03/1997
• Issued: 09/21/1999
• Est. Priority Date: 05/03/1995
• Status: Expired due to Term

• Current Assignee: Infineon Technologies AG
• Original Assignee: Siemens AG
• Inventors: Reiner, Robert
• Primary Examiner(s): Le, Thien Minh
• Assistant Examiner(s): SHERR, DANIEL H
• Application Number:
  US08/963,183
• Time in Patent Office: 687 Days
• Field of Search: 235/492, 235/384, 235/451
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive

Abstract

A data carrier configuration includes a semiconductor chip. A first conductor loop is connected to the semiconductor chip and has at least one winding and a cross-sectional area with approximately the dimensions of the semiconductor chip. At least one second conductor loop has at least one winding, a cross-sectional area with approximately the dimensions of the data carrier configuration and a region forming a third loop with approximately the dimensions of the first conductor loop. The third loop inductively couples the first conductor loop and the at least one second conductor loop to one another. The first and third conductor loops are disposed substantially concentrically.

Claims

1. In a data carrier configuration having predetermined dimensions, the improvement comprising:

a semiconductor chip having given dimensions;

a first conductor loop connected to said semiconductor chip, said first conductor loop having at least one winding and a cross-sectional area with approximately the given dimensions;

at least one second conductor loop having at least one winding, a cross-sectional area with approximately the predetermined dimensions and a region forming a third loop with approximately the given dimensions;

said third loop inductively coupling said first conductor loop and said at least one second conductor loop to one another; and

said first and third conductor loops disposed substantially concentrically.

2. The data carrier configuration according to claim 1, including a carrier element carrying said semiconductor chip, said first conductor loop disposed on said carrier element.

3. The data carrier configuration according to claim 1, wherein said first conductor loop is disposed on said semiconductor chip.

4. The data carrier configuration according to claim 1, wherein said first conductor loop and said at least one second conductor loop have different numbers of windings.

5. The data carrier configuration according to claim 1, wherein said conductor loops have inductances to be used in frequency filters.