Spherical shaped semiconductor integrated circuit

• US 5,955,776 A
• Filed: 05/16/1997
• Issued: 09/21/1999
• Est. Priority Date: 12/04/1996
• Status: Expired due to Fees

• Current Assignee: AAKI Holdings, LLC
• Original Assignee: Ball Semiconductor, Inc.
• Inventors: Ishikawa, Akira
• Primary Examiner(s): Hardy, David B.
• Application Number:
  US08/858,004
• Time in Patent Office: 858 Days
• Field of Search: 257/1, 257/618, 257/627, 257/531, 257/532, 257/536, 438/382, 438/393, 438/396, 438/900
• US Class Current: 257/618
• CPC Class Codes: C30B 25/18 characterised by the substrate
• CPC Class Codes: G03B 27/50 with slit or like diaphragm moving over original for progressive exposure G03B27/34 takes precedence ; projection optics per se G03B27/525
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 27/0203 Particular design considerations for integrated circuits
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1017 being a sphere
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10S 438/947 Subphotolithographic processing

Abstract

A spherical shaped semiconductor integrated circuit ("ball") and a system and method for manufacturing same. The ball replaces the function of the flat, conventional chip. The physical dimensions of the ball allow it to adapt to many different manufacturing processes which otherwise could not be used. Furthermore, the assembly and mounting of the ball may facilitates efficient use of the semiconductor as well as circuit board space.

Claims

1. An integrated circuit comprising a semiconductive material formed into a solid, substantially spherical shape and at least one electrical circuit disposed on the outer surface of the material.

2. The integrated circuit of claim 1 wherein at least one component of the electrical circuit is a transistor.

3. The integrated circuit of claim 2 wherein the semiconductive material provides a well for the transistor.

4. An integrated circuit manufactured by forming a substantially spherical shaped semiconductor single crystal and processing a plurality of electronic components on a surface of the crystal.

5. An integrated circuit comprising:

a substantially spherical shaped semiconductor crystal core;

a plurality of circuits processed onto an outer surface of the semiconductor crystal core, at least one of the circuits being an inductor formed by wrapping a conductor around the semiconductor crystal core.

6. A VLSI circuit comprised of a plurality of smaller integrated circuits each integrated circuit comprising a semiconductive material formed into a solid and substantially spherical shape, at least one electrical circuit disposed on the outer surface of the material, and at least one lead for electrically connecting to another of the integrated circuits.

7. The VLSI circuit of claim 6 further comprising one or more discrete devices, each discrete device comprising a semiconductive material formed into a substantially spherical shape.

8. An integrated circuit comprising:

a substantially spherical shaped semiconductor core; and

a plurality of different components processed onto an outer surface of the semiconductor core.

9. The integrated circuit of claim 8 further comprising:

an insulation layer wrapped around at least a portion of the semiconductor core; and

a conductor positioned outside of the insulation layer;

wherein at least one of the components is an inductor formed by the conductor.

10. The integrated circuit of claim 8 wherein at least one of the components is a transistor formed on the surface of the semiconductor core.

11. The integrated circuit of claim 8 wherein at least one of the components is a capacitor formed on the surface of the semiconductor core.

12. The integrated circuit of claim 8 wherein at least one of the components is a resistor formed on the surface of the semiconductor core.

13. An apparatus comprising:

a homogenous and substantially spherical shaped semiconductor substrate;

an integrated circuit processed onto an outer surface of the spherical shaped semiconductor substrate;

a plurality of pads formed on the outer surface of the semiconductor substrate for providing external connections for the integrated circuit.

14. The apparatus of claim 13 wherein at least one component of the integrated circuit is from a group consisting of an inductor, a transistor, a capacitor, and a resistor.