High frequency signal processing chip having signal pins distributed to minimize signal interference
First Claim
1. A package for holding a tuner chip for converting a receive signal into a baseband signal using a tuning frequency signal generated from a tank circuit, wherein said package comprises:
- a first side having a first set of pins arrayed along said first side from a first corner to a second corner, wherein said first set of pins includes a receive signal input pin for receiving the receive signal;
a second side having a second set of pins arrayed along said second side from a third corner to a fourth corner, wherein said fourth corner is diagonally opposite said second corner, and wherein said second set of pins includes a pair of tank circuit pins positioned to minimize tank oscillation signal interference with the receive signal.
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Accused Products
Abstract
A DBS receiver front end which includes a tuner chip and a demodulator/decoder chip. The tuner chip converts a receive signal to a baseband signal using a tuning frequency signal generated from a tank circuit. The design of a package for the tuner chip maximally spaces the pins associated with high frequency signals by placing them on opposite sides of the chip (in the case of two high frequency signal sources) or (in the case of three high frequency signal sources) in a triangle formation with widely spaced vertices wherein at least two of the pins are adjacent to corners of the package. For two or more high frequency signal sources, a good determination of pin locations can be determined according to the formula Pi =C+i·.left brkt-bot.N/M.right brkt-bot., i=1, . . . , M, where Pi are the pin numbers, N is a total number of pins around the perimeter of the package, M is a total number of the high frequency signal sources, and C is an offset number. Where a high frequency signal source has more than one associated pin, one pin number is found from the above formula, and the associated pins are placed on adjacent pins.
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Citations
15 Claims
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1. A package for holding a tuner chip for converting a receive signal into a baseband signal using a tuning frequency signal generated from a tank circuit, wherein said package comprises:
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a first side having a first set of pins arrayed along said first side from a first corner to a second corner, wherein said first set of pins includes a receive signal input pin for receiving the receive signal; a second side having a second set of pins arrayed along said second side from a third corner to a fourth corner, wherein said fourth corner is diagonally opposite said second corner, and wherein said second set of pins includes a pair of tank circuit pins positioned to minimize tank oscillation signal interference with the receive signal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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- 10. A package for holding an integrated circuit chip, wherein the package comprises a four-side perimeter having a set of pins attached, wherein each of the sides has a respective subset of pins along the respective side, wherein the pins are identified by a set of pin numbers beginning in a corner and proceeding sequentially in a counter-clockwise fashion along the four sides of the package, wherein the set of pins includes one or more high frequency signal pins and a pair of high frequency oscillator pins, and wherein the high frequency signal pins and the pair of oscillator pins are evenly distributed around the perimeter of the package.
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13. A method for reducing signal interference between a plurality of high frequency signal pins on a package, wherein the method comprises:
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numbering a set of pins sequentially in a counter-clockwise fashion along a perimeter of the package; designating a group of pins in the set of pins as the plurality of high frequency signal pins, so that the plurality of high frequency signal pins has a corresponding plurality of pin numbers Pi =round(i·
N/M)+C mod N, i=1, . . . , M, wherein N is a total number of pins in the set of pins, M is a total number in the plurality of high frequency signal pins, and C is an offset number. - View Dependent Claims (14, 15)
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Specification