Enhanced security fingerprint sensor package and related methods

• US 5,956,415 A
• Filed: 01/26/1996
• Issued: 09/21/1999
• Est. Priority Date: 01/26/1996
• Status: Expired due to Term

• Current Assignee: Apple Inc.
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: van Vonno, Nicolaas W., McCalley, Karl W., Hewitt, Charles L., Setlak, Dale R., Wilson, Steven D.
• Primary Examiner(s): Kelley, Christopher S.
• Application Number:
  US08/592,472
• Time in Patent Office: 1,334 Days
• Field of Search: 382/124-127, 340/825.34, 356/71, 283/68-70, 283/74, 283/78, 380/9, 380/21, 380/23
• US Class Current: 382/124
• CPC Class Codes: G06F 21/86 Secure or tamper-resistant housings
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06V 40/12 Fingerprints or palmprints
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/67 by interactive indications to the user
• CPC Class Codes: G07C 9/26 using a biometric sensor integrated in the pass
• CPC Class Codes: G07C 9/37 using biometric data, e.g. fingerprints, iris scans or voice recognition
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A fingerprint sensor package includes a tamper-resistant housing, a fingerprint sensor mounted in the housing, and an encryption output circuit mounted within the housing and operatively connected to the fingerprint sensor for generating an encrypted output signal related to a sensed fingerprint. The fingerprint sensor package may include a processor operatively connected between the fingerprint sensor and the encryption circuit. In addition, the package may also include a reference fingerprint memory for storing reference fingerprint information. Accordingly, the processor may have the capability to determine if a sensed fingerprint matches a stored reference fingerprint. To further enhance security of the stored reference fingerprint information, the sensor package also preferably includes a removing circuit or device for removing reference fingerprint information from the reference fingerprint storage means responsive to tampering. In one embodiment of the invention, the fingerprint sensor preferably includes an electric field integrated circuit fingerprint sensor. Method aspects of the invention are also disclosed.

Claims

1. A fingerprint sensor package comprising:

a tamper-resistant housing having an opening therethrough;

an integrated circuit fingerprint sensor mounted in said housing, said integrated circuit fingerprint sensor comprising

an integrated circuit die including an array of electric field sensing electrodes thereon,

a dielectric layer adjacent said electric field sensing electrodes, said dielectric layer defining an outer surface portion exposed through the opening for contact by a finger of a user, and

drive means for applying an electric field drive signal to said electric field sensing electrodes and adjacent portions of the finger so that said electric field sensing electrodes produce a fingerprint image signal; and

encrypting output means mounted within said housing and operatively connected to said integrated circuit fingerprint sensor for generating an encrypted output signal related to a sensed fingerprint;

said tamper-resistant housing comprising a body of encapsulating material surrounding and encapsulating said integrated circuit fingerprint sensor and said encrypting output means, said body of encapsulating material being integrally molded and providing a sealing function with said integrated circuit die adjacent the outer surface portion thereof.

2. A fingerprint sensor package according to claim 1 further comprising a processor operatively connected between said fingerprint sensor and said encrypting output means.

3. A fingerprint sensor package according to claim 2 further comprising reference fingerprint storage means for storing reference fingerprint information, and wherein said processor comprises reference fingerprint matching means for determining if a sensed fingerprint matches a stored reference fingerprint.

4. A fingerprint sensor package according to claim 3 further comprising removing means for removing reference fingerprint information from said reference fingerprint storage means responsive to tampering.

5. A fingerprint sensor package according to claim 1 further comprising sealing means for sealing an interface between the outer surface portion of the integrated circuit and adjacent housing portions.

6. A fingerprint sensor package according to claim 5 wherein said sealing means comprises a bead of sealing material.

7. A fingerprint sensor package according to claim 5 wherein said body of encapsulating material comprises a plastic material, and wherein sealing means comprises a hermetic seal between the plastic material and adjacent portions of the integrated circuit.

8. A fingerprint sensor package according to claim 4 wherein said integrated circuit comprises an outermost silicon nitride layer.

9. A fingerprint sensor package according to claim 4 wherein said integrated circuit comprises an outermost layer including one of silicon carbide and diamond.

10. A fingerprint sensor package according to claim 1 wherein said drive means comprises coherent drive means for applying a coherent electric field drive signal to said array of electric field sensing electrodes.

11. A fingerprint sensor package according to claim 1 further comprising a finger electrode exposed on an outer surface of said housing.

12. A fingerprint sensor package comprising:

a tamper-resistant housing having an opening therethrough;

an integrated circuit fingerprint sensor mounted in said housing, said integrated circuit fingerprint sensor comprising

an integrated circuit die including an array of electric field sensing electrodes thereon,

a dielectric layer adjacent said electric field sensing electrodes. said dielectric layer defining an outer surface portion exposed through the opening for contact by a finger of a user, and

drive means for applying an electric field drive signal to said electric field sensing electrodes and adjacent portions of the finger so that said electric field sensing electrodes produce a fingerprint image signal;

reference fingerprint storage means positioned within said housing for storing reference fingerprint information; and

a processor operatively connected to said integrated circuit fingerprint sensor and said reference fingerprint storage means for determining if a sensed fingerprint matches a stored reference fingerprint;

said tamper-resistant housing comprising a body of encapsulating material surrounding and encapsulating said integrated circuit fingerprint sensor, said reference fingerprint storage means, and said processor, said body of encapsulating material being integrally molded and providing a sealing function with said integrated circuit die adjacent the outer surface portion thereof.

13. A fingerprint sensor package according to claim 12 further comprising removing means for removing reference fingerprint information from said reference fingerprint storage means responsive to tampering.

14. A fingerprint sensor package according to claim 12 further comprising encrypting output means mounted within said housing and operatively connected to said processor for generating an encrypted output signal related to a sensed fingerprint.

15. A fingerprint sensor package according to claim 12 further comprising sealing means for sealing an interface between the outer surface portion of the integrated circuit and adjacent housing portions.

16. A fingerprint sensor package according to claim 15 wherein said sealing means comprises a bead of sealing material.

17. A fingerprint sensor package according to claim 15 wherein said body of encapsulating material comprises a plastic material, and wherein sealing means comprises a hermetic seal between the plastic material and adjacent portions of the integrated circuit.

18. A fingerprint sensor package according to claim 12 wherein said integrated circuit comprises an outermost silicon nitride layer.

19. A fingerprint sensor package according to claim 12 wherein said integrated circuit comprises an outermost layer including one of silicon carbide and diamond.

20. A fingerprint sensor package according to claim 12 wherein said

drive means comprises coherent drive means for applying a coherent electric field drive signal to said array of electric field sensing electrodes.

21. A fingerprint sensor package according to claim 12 further comprising a finger electrode exposed on an outer surface of said housing.

22. A fingerprint sensor package comprising:

a housing having an opening therethrough;

an integrated circuit fingerprint sensor mounted in said housing and comprising

an integrated circuit die including an array of electric field sensing electrodes thereon,

a dielectric layer adjacent said electric field sensing electrodes, said dielectric layer defining an outer surface portion exposed through the opening for contact by a finger of a user, and

drive means for applying an electric field drive signal to said electric field sensing electrodes and adjacent portions of the finger so that said electric field sensing electrodes produce a fingerprint image signal; and

encrypting output means mounted within said housing and operatively connected to said integrated circuit fingerprint sensor for generating an encrypted output signal related to a sensed fingerprint;

said housing comprising a body of encapsulating material surrounding and encapsulating said integrated circuit fingerprint sensor and said encrypting output means, said body of encapsulating material being integrally molded and providing a sealing function with said integrated circuit die adjacent the outer surface portion thereof.

23. A fingerprint sensor package according to claim 22 further comprising a processor operatively connected between said fingerprint sensor and said encrypting output means.

24. A fingerprint sensor package according to claim 23 further comprising reference fingerprint storage means for storing reference fingerprint information, and wherein said processor comprises reference fingerprint matching means for determining if a sensed fingerprint matches a stored reference fingerprint.

25. A fingerprint sensor package according to claim 24 further comprising removing means for removing reference fingerprint information from said reference fingerprint storage means responsive to tampering.

26. A fingerprint sensor package according to claim 22 further comprising sealing means for sealing an interface between the outer surface portion of the integrated circuit and adjacent housing portions.

27. A fingerprint sensor package according to claim 26 wherein said sealing means comprises a bead of sealing material.

28. A fingerprint sensor package according to claim 26 wherein said body of encapsulating material comprises a plastic material, and wherein sealing means comprises a hermetic seal between the plastic material and adjacent portions of the integrated circuit.

29. A fingerprint sensor package according to claim 22 wherein said integrated circuit comprises an outermost silicon nitride layer.

30. A fingerprint sensor package according to claim 22 wherein said integrated circuit comprises an outermost layer including one of silicon carbide and diamond.

31. A fingerprint sensor package according to claim 22 wherein said

drive means comprises coherent drive means for applying a coherent electric field drive signal to said array of electric field sensing electrodes.

32. A fingerprint sensor package according to claim 26 wherein said housing is a tamper-resistant housing.

33. A fingerprint sensor package according to claim 26 further comprising a finger electrode exposed on an outer surface of said housing.

34. A method for making and securely operating a fingerprint sensor package of a type including an integrated circuit fingerprint sensor, the method comprising the steps of:

forming an integrated circuit fingerprint sensor comprising an integrated circuit die, an array of electric field sensing electrodes on the integrated circuit die, a dielectric layer adjacent said electric field sensing electrodes defining an outer surface portion for receiving a finger adjacent thereto, and drive means for applying an electric field drive signal to said electric field sensing electrodes and adjacent portions of the finger;

mounting the integrated circuit fingerprint sensor within a tamper-resistant housing so that an outer surface portion of said integrated circuit die is exposed through an opening in the housing; and

generating within the tamper-resistant housing an encrypted output signal related to a sensed fingerprint from the fingerprint sensor;

wherein the step of mounting comprises integrally molding a body of encapsulating material to surround and encapsulate the integrated circuit fingerprint sensor so that the body of encapsulating material provides a sealing function with the integrated circuit die adjacent the outer surface portion thereof.

35. A method according to claim 34 further comprising the steps of:

storing reference fingerprint information within the housing; and

determining within the tamper-resistant housing if a sensed fingerprint matches a stored reference fingerprint.

36. A method according to claim 35 further comprising the step of removing reference fingerprint information from within the tamper-resistant housing responsive to tampering.