Anti-microbial materials

• US 5,958,440 A
• Filed: 11/18/1993
• Issued: 09/28/1999
• Est. Priority Date: 05/19/1992
• Status: Expired due to Term

• Current Assignee: NUCRYST Pharmaceuticals Corp. (The Westaim Corporation)
• Original Assignee: Westaim Technologies Inc.
• Inventors: Apte, Prasad Shrikrishna, Burrell, Robert Edward, Morris, Larry Roy, Sant, Sudhindra Bharat, Gill, Kashmir Singh
• Primary Examiner(s): Levy, Neil S.
• Application Number:
  US08/154,694
• Time in Patent Office: 2,140 Days
• Field of Search: 424/405, 424/408, 424/409, 424/421, 424/618
• US Class Current: 424/409
• CPC Class Codes: A01N 59/16 Heavy metals; Compounds thereof
• CPC Class Codes: A61B 2018/00119 with metal oxide nitride
• CPC Class Codes: A61L 17/145 Coating
• CPC Class Codes: A61L 2300/102 Metals or metal compounds, e.g. salts such as bicarbonates, carbonates, oxides, zeolites, silicates
• CPC Class Codes: A61L 2300/104 Silver, e.g. silver sulfadiazine
• CPC Class Codes: A61L 2300/404 Biocides, antimicrobial agents, antiseptic agents
• CPC Class Codes: A61L 2300/602 Type of release, e.g. controlled, sustained, slow
• CPC Class Codes: A61L 2300/606 Coatings
• CPC Class Codes: A61L 2300/63 Crystals
• CPC Class Codes: A61L 27/306 Other specific inorganic materials not covered by A61L27/303 - A61L27/32
• CPC Class Codes: A61L 27/54 Biologically active materials, e.g. therapeutic substances A61L27/227 takes precedence
• CPC Class Codes: A61L 29/106 Inorganic materials other than carbon
• CPC Class Codes: A61L 29/16 Biologically active materials, e.g. therapeutic substances A61L29/048 takes precedence
• CPC Class Codes: A61L 31/16 Biologically active materials, e.g. therapeutic substances A61L31/047 takes precedence
• CPC Class Codes: C23C 14/0036 Reactive sputtering
• CPC Class Codes: C23C 14/025 Metallic sublayers
• CPC Class Codes: C23C 14/06 characterised by the coating material C23C14/0021 , C23C14/04 take precedence
• CPC Class Codes: C23C 14/0688 Cermets, e.g. mixtures of metal and one or more of carbides, nitrides, oxides or borides
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 14/14 Metallic material, boron or silicon
• CPC Class Codes: C23C 14/16 : on metallic substrates or on substrates of boron or silicon
• CPC Class Codes: C23C 14/205 : by cathodic sputtering
• CPC Class Codes: C23C 14/225 : Oblique incidence of vaporised material on substrate
• CPC Class Codes: C23C 14/35 : by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: C23C 14/588 : by mechanical treatment
• CPC Class Codes: H01H 2300/014 : Application surgical instrument
• CPC Class Codes: Y10S 977/899 : Electrolytic
• CPC Class Codes: Y10S 977/915 : Therapeutic or pharmaceutical composition

Abstract

Anti-microbial coatings and method of forming same on medical devices are provided. The coatings are preferably formed by depositing an anti-microbial, biocompatible metal by vapour deposition techniques to produce atomic disorder in the coating such that a sustained release of metal ions sufficient to produce an anti-microbial effect is achieved. Preferred deposition conditions to achieve atomic disorder include a lower than normal substrate temperature, and one or more of a higher than normal working gas pressure and a lower than normal angle of incidence of coating flux. Anti-microbial powders formed by vapour deposition or altered by mechanical working to produce atomic disorder are also provided. Novel anti-microbial silver materials are defined, characterized by having a positive rest potential, a T_rec /T_m less than 0.33, and a grain size less than 200 nm. Anti-microbial fine grain or nanocrystalline materials are provided, together with methods of preparation, wherein the anti-microbial metal if deposited in a matrix with atoms or molecules of a different material such as other biocompatible metals (ex. Ta), trapped or absorbed oxygen, or compounds of anti-microbial metals or biocompatible metals (ex. Ag0 or TaO).

Claims

1. An anti-microbial form of silver material, comprising:

silver metal, or an alloy or compound thereof, in a crystalline form having sufficient atomic disorder such that the material, in contact with an alcohol or a water based electrolyte, releases atoms, ions, molecules or clusters containing silver on a sustained basis at a concentration sufficient to provide a localized anti-microbial effect, said material having a positive rest potential, when measured against a saturated calomel reference electrode, in 1M potassium hydroxide, wherein the atomic disorder in the material provides irregularities in surface topography and inhomogeneities in structure on a nanometer scale and is caused by high concentrations of one or more of point defects in a crystal lattice, vacancies, line defects, dislocations, interstitial atoms, amorphous regions and grain and sub grain boundaries, relative to a normal ordered crystalline state for silver metal, and wherein the anti-microbial effect is sufficient to generate a zone of inhibition of greater than 5 mm.

2. The material as set forth in claim 1, wherein the material has a ratio of its temperature of recrystallization to its melting temperature, in degrees K, T_rec /T_m, of less than about 0.33.

3. The material as set forth in claim 1, wherein the material has a ratio of its temperature of recrystallization to its melting temperature, in degrees K, T_rec /T_m, of less than about 0.3.

4. The material as set forth in claim 2, wherein the material has a temperature of recrystallization less than about 140°

C.

5. The material as set forth in claim 4, wherein the material has a grain size less than about 200 nm.

6. The material as set forth in claim 4, wherein the material has a grain size less than about 140 nm.

7. The material as set forth in claim 4, wherein the material has a grain size less than about 90 nm.

8. The material as set forth in claim 5, in the form of a powder, or flakes.

9. The material as set forth in claim 6, in the form of a nanocrystalline powder.

10. The material as set forth in claim 5, in the form of a foil.

11. The material as set forth in claim 5, in the form of a coating.

12. The material as set forth in claim 5, in the form of a film having a thickness of about 1 micron or less.

13. The material as set forth in claim 7, in the form of a coating having a thickness of about 1 micron or less.

14. The material as set forth in claim 8, 9 or 13 in the form of silver metal which is greater than 99% pure.

15. The material as set forth in claim 8, 9 or 13, in the form of a mixture of silver metal which is greater than 99% pure and silver oxide.

16. The material as set forth in claim 8, 9 or 13, in the form of silver metal which is greater than 99% pure, and absorbed, trapped, or reacted atoms or molecules of oxygen.

17. The material as set forth in claim 16, which further includes silver oxide.

18. The material as set forth in claim 1, wherein the atomic disorder is created in the coating under conditions which limit diffusion such that sufficient atomic disorder is retained in the coating to provide release of atoms, ions, molecules or clusters containing silver into the alcohol or water based electrolyte at an enhanced rate relative to its normal ordered crystalline state.

19. An anti-microbial form of silver material, comprising:

silver metal, or an alloy or compound thereof, in a crystalline form, having irregularities in surface topography, and having a positive rest potential, when measured against a saturated calomel reference electrode, in 1M potassium hydroxide and having a ratio of its temperature of recrystallization to its melting temperature, in degrees K, Trec/Tm, less than 0.33, and which, in contact with an alcohol or a water based electrolyte, releases atoms, ions, molecules or clusters containing silver on a sustained basis at a concentration sufficient to provide a localized anti-microbial effect which is sufficient to generate a zone of inhibition of at least 5 mm.

20. The material as set forth in claim 19, wherein the material has a ratio of its temperature of recrystallization to its melting temperature, in degrees K, T_rec /T_m, of less than about 0.3.

21. The material as set forth in claim 19, wherein the material has a temperature of recrystallization less than about 140°

C.

22. The material as set forth in claim 21, wherein the material has a grain size less than about 200 nmn.

23. The material as set forth in claim 21, wherein the material has a grain size less than about 140 nm.

24. The material as set forth in claim 21, wherein the material has a grain size less than about 90 nm.

25. The material as set forth in claim 22, in the form of a powder, or flakes.

26. The material as set forth in claim 21, in the form of a nanocrystalline powder.

27. The material as set forth in claim 22, in the form of a foil.

28. The material as set forth in claim 22, in the form of a coating.

29. The material as set forth in claim 22, in the form of a film having a thickness of about 1 micron or less.

30. The material as set forth in claim 22, in the form of a coating having a thickness of about 1 micron or less.

31. The material as set forth in claim 25, 26 or 30 in the form of silver metal which is greater than 99% pure.

32. The material as set forth in claim 25, 26 or 30, in the form of a mixture of silver metal which is greater than 99% pure and silver oxide.

33. The material as set forth in claim 25, 26 or 30, in the form of silver metal which is greater than 99% pure, and absorbed, trapped, or reacted atoms or molecules of oxygen.

34. The material as set forth in claim 33, which further includes silver oxide.