Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits

• US 5,958,466 A
• Filed: 03/18/1998
• Issued: 09/28/1999
• Est. Priority Date: 06/04/1997
• Status: Expired due to Fees

• Current Assignee: OSE USA, Inc. (Orient Semiconductor Electronics Limited)
• Original Assignee: IPAC, Inc. (Specified Air Solutions LLC)
• Inventors: Ong, E. C.
• Primary Examiner(s): DAVIS, ROBERT B
• Application Number:
  US09/044,448
• Time in Patent Office: 559 Days
• Field of Search: 425/116, 425/117, 425/125, 425/127, 425/183, 425/544, 425/588, 249/102, 249/93, 249/95, 264/272.15, 264/272.17
• US Class Current: 425/127
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A mold system for encapsulating substrate-mounted ICs comprises a split mold having a lower cavity adapted for positioning the substrate and an upper cavity adapted for providing a volume space around the IC. The lower cavity is provided with a compressible shim plate adapted to lie on a bottom surface of the lower cavity such that a substrate of a substrate-mounted IC placed in the lower cavity will extend above the upper limit of the lower cavity, which is the split surface of the mold. As the split mold is closed, a lower surface of the upper mold portion encounters first an upper surface of the substrate, then the compressible shim plate is compressed until the mold is fully closed, at which time the lower surface of the upper mold portion is in intimate contact with both the substrate and the upper surface of the lower mold portion. The IC mounted on the substrate is then presented in the upper cavity for encapsulation. This apparatus and method allows a lower mold portion having a single cavity depth to be used to encapsulate substrate-mounted ICs wherein the substrate thickness may vary from part-to-part.

Claims

1. A mold system for encapsulating substrate-mounted integrated circuits (ICs), comprising:

a lower mold portion including a first cavity with a bottom surface and a first depth for containing and positioning the substrate;

an upper mold portion including a second cavity of a second depth for surrounding the IC to be encapsulated with a volume space for injecting molding material; and

a compressible pressure plate of substantially constant thickness adapted to be positioned wholly within the first cavity lying against the bottom surface;

wherein the thickness of the pressure plate is less than the depth of the first cavity.

2. The system of claim 1 further comprising a non-compressible shim plate of substantially constant thickness adapted for lying upon the compressible pressure plate in the first cavity, to cooperate with the compressible pressure plate in spacing a substrate from the bottom surface, and wherein the total thickness of the compressible pressure plate and the non-compressible shim plate is less than the depth of the first cavity.

3. The system of claim 1 wherein the upper mold portion and the lower mold portion are each comprised of separable flat plates.

4. The system of claim 2 wherein the non-compressible shim plate is a metal plate.

5. The system of claim 1 wherein the lower mold portion comprises a plurality of first cavities arranged in a matrix pattern and the upper mold portion comprises a plurality of second cavities arranged in the same pattern, such that, with the mold closed each first cavity mates with a second cavity, providing a plurality of positions for encapsulating.

6. The system of claim 1 wherein the compressible pressure plate is made of a silicon rubber material.