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Hybrid substrate for cooling an electronic component

  • US 5,958,572 A
  • Filed: 09/30/1997
  • Issued: 09/28/1999
  • Est. Priority Date: 09/30/1997
  • Status: Expired due to Term
First Claim
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1. A substrate for receiving and cooling an electronic component, the substrate having a first side and a second side, the substrate comprising:

  • an insert material having a first thermal conductivity in a first direction and having a second thermal conductivity in a second direction;

    a plurality of vias formed through the insert material, the vias formed in the second direction; and

    an encapsulant material surrounding the insert material,when an electronic component is disposed on the first side, heat from the electronic component conducted in the first direction by the insert material and conducted in the second direction through the plurality of vias.

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