Method of modifying an exposed surface of a semiconductor wafer
First Claim
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1. A method of modifying a processed semiconductor wafer containing topographical features comprising the steps of:
- (a) contacting an exposed surface of the processed semiconductor wafer with a three-dimensional, textured, fixed abrasive article comprising a plurality of abrasive particles and a binder arranged in the form of a pattern; and
(b) relatively moving said wafer and said fixed abrasive article in the presence of a liquid medium to chemically and mechanically modify said surface of said wafer.
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Abstract
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of:
(a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abrasive particles and a binder in the form of a pre-determined pattern; and
(b) relatively moving the wafer and the fixed abrasive article to modify said surface of the wafer.
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Citations
60 Claims
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1. A method of modifying a processed semiconductor wafer containing topographical features comprising the steps of:
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(a) contacting an exposed surface of the processed semiconductor wafer with a three-dimensional, textured, fixed abrasive article comprising a plurality of abrasive particles and a binder arranged in the form of a pattern; and (b) relatively moving said wafer and said fixed abrasive article in the presence of a liquid medium to chemically and mechanically modify said surface of said wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 58, 59, 60)
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52. A method of modifying an exposed surface of a semiconductor wafer comprising the steps of:
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(a) contacting said surface with a three-dimensional, textured, fixed abrasive article comprising a plurality of precisely shaped abrasive composites and a binder; and (b) relatively moving said wafer and said fixed abrasive article to modify said surface of said wafer. - View Dependent Claims (54, 55)
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53. A method of modifying an exposed surface of a semiconductor wafer comprising the steps of:
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(a) contacting said surface with a three-dimensional, textured, fixed abrasive article comprising a plurality of abrasive particles and a binder comprising a resin and a plasticizer in an amount sufficient to increase the erodibility of said abrasive article relative to the same abrasive article in the absence of said plasticizer; and (b) relatively moving said wafer and said fixed abrasive article to modify said surface of said wafer.
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56. A method of modifying an exposed surface of a semiconductor wafer comprising a metal oxide,
said method comprising the steps of: -
(a) contacting said surface with a three-dimensional, textured, erodible, fixed abrasive article comprising a plurality of abrasive particles and a binder arranged in the form of a pre-determined pattern; and (b) relatively moving said wafer and said fixed abrasive article to modify said surface of said wafer. - View Dependent Claims (57)
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Specification
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Current AssigneeMinnesota Mining and Manufacturing Co (3M Company)
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Original AssigneeMinnesota Mining and Manufacturing Co (3M Company)
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InventorsKlun, Thomas P., Culler, Scott R., Webb, Richard J., Kessel, Carl R., Kranz, Heather K., Kaisaki, David A., Bruxvoort, Wesley J., Messner, Robert P., Ho, Kwok-Lun, Williams, Julia P.
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Primary Examiner(s)Breneman, Bruce
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Assistant Examiner(s)ALANKO, ANITA KAREN
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Application NumberUS08/694,014Time in Patent Office1,146 DaysField of Search438/692, 438/633, 438/747, 438/754, 438/756, 216/88, 216/90, 451/41, 451/532, 451/921, 451/539, 156/345 LPUS Class Current438/692CPC Class CodesB24B 21/04 for grinding plane surfacesB24B 37/042 operating processes thereforB24B 53/017 Devices or means for dressi...B24B 7/228 for grinding thin, brittle ...B24D 11/00 Constructional features of ...B24D 3/28 Resins or natural or synthe...H01L 21/31053 involving a dielectric remo...
