LOC semiconductor assembled with room temperature adhesive

• US 5,959,347 A
• Filed: 10/22/1998
• Issued: 09/28/1999
• Est. Priority Date: 08/14/1997
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Farnworth, Warren M., Grigg, Ford B.
• Primary Examiner(s): Arroyo, Teresa M.
• Application Number:
  US09/177,000
• Time in Patent Office: 341 Days
• Field of Search: 257/668, 257/310, 257/643, 257/783
• US Class Current: 257/668
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/743 Apparatus for manufacturing layer connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/92 Specific sequence of method steps
• CPC Class Codes: H01L 2224/92147 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/92247 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/4951 : Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49513 : having bonding material between chip and die pad
• CPC Class Codes: H01L 24/27 : Manufacturing methods
• CPC Class Codes: H01L 24/28 : Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/743 : Apparatus for manufacturing layer connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/078 : Adhesive characteristics other than chemical
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: Y10T 428/24207 : with strand[s] or strand-portion[s] between layers [e.g., upholstery trim, etc.]

Abstract

A semiconductor device assembly has a lead frame and a semiconductor device configured to be attached to each other. An adhesive is applied at room temperature through a stencil to the lead frame. The semiconductor device is urged against the adhesive to effect the attachment between the semiconductor device and the lead frame. The adhesive preferably is from about 75 percent to about 95 percent isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent, respectively, of titanium oxide.

Claims

1. A semiconductor device assembly comprising:

a lead frame having a plurality of lead fingers thereon, at least one lead finger of said plurality of lead fingers having an attaching surface;

a semiconductor device having an active surface having at least one bond pad thereon configured for electrical connection to said at least one lead finger of said plurality of lead fingers of said lead frame; and

a non-conductive polymer adhesive selected from the group of adhesives that is tacky and compliant at a room temperature in the range of about 50°

F. to 95°

F., said non-conductive polymer adhesive applied to one of said attaching surface of said at least one lead finger of said plurality of lead fingers of said lead frame and a portion of said active surface of said semiconductor device for compression therebetween to electrically connect said at least one bond pad of said semiconductor device to said at least one lead finger of said plurality of lead finger of said lead frame.

2. The semiconductor device of claim 1 wherein a portion of said non-conductive polymer adhesive has a first copolymer material from the group of copolymers that includes isobutyl compounds.

3. The semiconductor device of claim 1 wherein a first portion of said non-conductive polymer adhesive is isobutyl acetal diphenol copolymer.

4. The semiconductor device of claim 1 wherein said non-conductive polymer adhesive includes a first material from a group of copolymers that includes isobutyl acetal diphenol copolymer and a second material that is from a group of metal oxides that includes titanium dioxide.

5. The semiconductor device of claim 4 wherein said non-conductive polymer adhesive has from about 75 percent to about 95 percent by weight of isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent by weight, respectively, of titanium dioxide.

6. A semiconductor device assembly comprising:

a lead frame having a plurality of lead fingers thereon, each lead finger of said plurality of lead fingers having an attaching surface;

a semiconductor device having an active surface having bond pads thereon configured for electrical connection to each said lead finger of said plurality of lead fingers of said lead frame; and

a non-conductive polymer adhesive selected from the group of adhesives that is tacky and compliant at a room temperature in the range of about 50°

F. to 95°

F. and is applicable to a substrate through a stencil, said non-conductive polymer adhesive being applied to one of said attaching surfaces of said plurality of lead fingers of said lead frame and a portion of said active surface of said semiconductor device for compression therebetween to electrically connect said bond pads of said semiconductor device to said plurality of lead fingers of said lead frame.

7. The semiconductor device of claim 6, wherein a portion of said non-conductive polymer adhesive has a first copolymer material from the group of copolymers that includes isobutyl compounds.

8. The semiconductor device of claim 6, wherein a first portion of said non-conductive polymer adhesive is isobutyl acetal diphenol copolymer.

9. The semiconductor device of claim 6, wherein said non-conductive polymer adhesive includes a first material from a group of copolymers that includes isobutyl acetal diphenol copolymer and a second material that is from a group of metal oxides that includes titanium dioxide.

10. The semiconductor device of claim 9, wherein said non-conductive polymer adhesive has from about 75 percent to about 95 percent by weight of isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent by weight, respectively, of titanium dioxide.

11. A semiconductor device assembly comprising:

a lead frame having a plurality of lead fingers having attaching surfaces thereon;

a semiconductor device having an active surface having at least one bond pad thereon configured for electrical connection to at least one lead finger of said plurality of lead fingers of said lead frame; and

a non-conductive polymer adhesive which includes a first material from a group of copolymers that includes isobutyl acetal diphenol copolymer and a second material that is from a group of metal oxides that includes titanium dioxide, said non-conductive polymer adhesive being applied at a temperature in the range of about 50°

F. to 95°

F. to one of said attaching surfaces of said plurality of lead fingers and a portion of said active surface of said semiconductor device for compression therebetween to connect said semiconductor device to said at least one lead finger of said plurality of lead fingers of said lead frame.

12. A semiconductor device comprising:

a lead frame having an attaching surface thereon;

a semiconductor device having at least one bond pad on an active surface thereof, and

an adhesive that includes from about 75 percent to about 95 percent of isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent, respectively, of titanium dioxide, said adhesive being applied at a temperature in the range of about 50°

F. to 95°

F. to one of said attaching surface of said lead frame and said at least one bond pad of said semiconductor device for compression therebetween to electrically connect said at least one bond pad of said semiconductor device to said attaching surface of said lead frame.

13. A semiconductor device assembly comprising:

a lead frame having a plurality of lead hinges thereon, each lead finger of said plurality of lead fingers having an attaching surface thereon;

a semiconductor device having an active surface having a plurality of bond pads thereon configured for electrical connection to said plurality of lead fingers of said lead frame; and

a non-conductive polymer adhesive which includes a first material from a group of copolymers that includes isobutyl acetal diphenol copolymer and a second material that is from a group of metal oxides that includes titanium dioxide, said non-conductive polymer adhesive being applied at a temperature in the range of about 50°

F. to 95°

F. to one of said attaching surfaces of said lead fingers of said plurality of lead fingers and said active surface of said semiconductor device for compression therebetween to connect said active surface of said semiconductor device to said attaching surfaces of said plurality of lead fingers of said lead frame.

14. A semiconductor device comprising:

a lead frame having an attaching surface;

a semiconductor device having bond pads on an active surface thereof configured for electrical connection to said lead frame; and

an adhesive that includes from about 75 percent to about 95 percent of isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent, respectively, of titanium dioxide, said adhesive being applied at a temperature in the range of about 50°

F. to 95°

F. to one of said attaching surface of said lead frame and said semiconductor device for compression therebetween to connect said active surface of said semiconductor device to said attaching surface of said lead frame.