Integrated electromagnetic device and method

• US 5,959,522 A
• Filed: 02/03/1998
• Issued: 09/28/1999
• Est. Priority Date: 02/03/1998
• Status: Expired due to Term

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Andrews, James A.
• Primary Examiner(s): Gellner, Michael L.
• Assistant Examiner(s): MAI, ANH T
• Application Number:
  US09/017,929
• Time in Patent Office: 602 Days
• Field of Search: 336/223, 336/200, 336/84 M
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 7/08 with armatures

Abstract

An integrated electromagnetic device (112) provides increased inductance in a smaller area on a semiconductor substrate (130). A conduction path (140) is disposed on the substrate for developing the inductance. A first magnetic shield (142) is disposed between the substrate and the conduction path to concentrate the magnetic flux induced by current flowing along the conduction path, which increases the inductance. Inductance is further increased by shielding the magnetic flux from the substrate with the first magnetic shield, which reduces substrate eddy currents that oppose the applied current. A second magnetic shield (144) overlaying the conduction path is coupled to the first magnetic shield, further concentrating the magnetic flux and increasing the inductance.

Claims

1. An electromagnetic device, comprising:

a substrate;

a conduction path overlaying the substrate and having first and second electrodes for developing an inductance of the electromagnetic device;

a first magnetic shield disposed between the substrate and the conduction path wherein an opening is formed in the first magnetic shield and wherein the opening is suitable for running perpendicular to any applied current flow to reduce any eddy current within the first magnetic shield; and

a second magnetic shield overlaying the conduction path and coupled to the first magnetic shield to enclose the conduction path wherein the first and second magnetic shields are suitable to increase magnetic fields generated by current flow along the conduction path.

2. The electromagnetic device of claim 1, wherein the substrate comprises a semiconductor substrate.

3. The electromagnetic device of claim 2, wherein the electromagnetic device is formed on an integrated circuit.

4. The electromagnetic device of claim 1, wherein the conduction path is formed as a planar spiral and the opening is defined by first and second projections of the first magnetic shield that are disposed radially from an axis of the planar spiral.

5. The electromagnetic device of claim 4, wherein an opening of the second magnetic shield is defined by first and second projections of the second magnetic shield that are disposed radially from the axis of the planar spiral to reduce an eddy current in the second magnetic shield induced by the magnetic flux.

6. The electromagnetic device of claim 5, wherein the first and second magnetic shields are coupled for receiving a power supply voltage to maintain the first and second magnetic shields at a constant potential.

7. The electromagnetic device of claim 1, wherein the first and second magnetic shields are conductive, further comprising:

a first dielectric layer disposed for electrically isolating the first magnetic shield from the conduction path; and

a second dielectric layer disposed for electrically isolating the second magnetic shield from the conduction path.

8. The electromagnetic device of claim 1, wherein the electromagnetic device operates as an inductor, a transformer or a transmission line.

9. The electromagnetic device of claim 1, wherein the first magnetic shield has a relative permeability greater than 1.1 and the second magnetic shield has a relative permeability greater than 1.1.

10. The electromagnetic device of claim 9, wherein the first and second magnetic shields include iron, nickel, cobalt or permalloy.

12. The electromagnetic device of claim 9, wherein the conduction path is formed as a planar spiral and the opening is defined by first and second portions of the magnetic shield that are disposed radially from an axis of the planar spiral.

11. An electromagnetic device, comprising:

a semiconductor substrate;

a conduction path overlaying the semiconductor substrate and having first and second electrodes for receiving an applied current to develop an inductance of the electromagnetic device; and

a magnetic shield disposed between the semiconductor substrate and the conduction path and patterned with an opening that runs perpendicular to the applied current to reduce an eddy current in the semiconductor substrate.