Integrated lead suspension electrostatic discharge protector

• US 5,959,827 A
• Filed: 07/01/1998
• Issued: 09/28/1999
• Est. Priority Date: 07/01/1998
• Status: Expired due to Term

• Current Assignee: Western Digital Technologies Incorporated (Western Digital Corporation)
• Original Assignee: International Business Machines Corporation
• Inventors: Smith, Darrick T., Hughbanks, Timothy Scott
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): HUYNH, KIM NGOC
• Application Number:
  US09/108,730
• Time in Patent Office: 454 Days
• Field of Search: 361/212, 361/220, 361/816, 361/818, 369/126, 369/99, 307/100, 174/51, 174/35
• US Class Current: 361/212
• CPC Class Codes: H05F 3/02 by means of earthing connections

Abstract

An electrically conductive grounding unit is situated between the integrated lead suspension and the tool block which is used to assemble it to the transducer head. The grounding unit grounds the uninsulated traces on the integrated lead suspension, thereby eliminating the danger of imparting static electricity to the transducer head during the assembly process. The grounding unit carries unwanted charges from the electrical traces on the suspension to the grounded tool block. The grounding unit is preferably fabricated from ceramic materials.

Claims

1. The method, further comprising the step of forming the grounding body from a semi-conductive material.

2. The apparatus of claim 1 wherein the grounding body has a protrusion for limiting movement of the grounding body through the hole in the base;

and wherein

an upper surface of the grounding body contacts the integrated electrical lead and the spring contacts a lower surface of the grounding body.

3. The apparatus of claim 1 wherein the grounding body is formed from a semi-conductive material.

4. The apparatus of claim 1 wherein the grounding body is a flat rectangular member having an orthogonal flange extending from a lower end.

5. The apparatus of claim I wherein the spring further comprises:

a leaf spring body having a central hole; and

an inner tab extending from one end of the leaf spring body inward into the central hole for contacting the grounding body.

6. The apparatus of claim 5 wherein the spring further comprises an outer tab extending away from an opposite end of the leaf spring body.

7. The apparatus of claim 5 wherein the leaf spring body lies flat against one surface of the base and is secured to the base with a fastener;

and wherein

the grounding body protrudes from an opposite surface of the base.

8. An apparatus for processing an integrated lead suspension having a suspension body and at least one integrated electrical lead extending across the suspension body for connection to a slider, comprising:

a base;

an arm pivotally mounted to the base and having a platform on an upper surface for receiving the suspension body;

a grounding body formed from an electrically conductive material and slidably mounted in a hole in the arm, the grounding body having an upper surface for contacting the integrated electrical lead above the platform while the suspension body is located on the platform, and a protrusion on a lower end for limiting upward movement of the grounding body through the hole in the arm; and

a spring mounted to a lower surface of the arm adjacent to the hole in the arm for contacting a lower surface of the grounding body and urging the upper surface of the grounding body against the integrated electrical lead of the integrated lead suspension for protecting the slider against electrostatic discharge.

9. The apparatus of claim 8 wherein the grounding body is formed from a semi-conductive material.

10. The apparatus of claim 8 wherein the grounding body is a flat rectangular member and wherein the protrusion is an orthogonal flange extending from a lower end of the grounding body.

11. The apparatus of claim 8 wherein the spring further comprises:

a leaf spring body having a central hole; and

an inner tab extending from one end of the leaf spring body inward into the central hole for contacting the lower surface of the grounding body.

12. The apparatus of claim 11 wherein the spring further comprises an outer tab extending away from an opposite end of the leaf spring body for contacting the lower surface of the arm.

13. The apparatus of claim 11 wherein the leaf spring body lies flat against the lower surface of the arm and the inner tab is flexed away from the lower surface of the arm by the grounding body;

and wherein

an upper end of the grounding body protrudes from the hole in the arm above the platform.

14. A method for processing an integrated lead suspension having a suspension body and at least one integrated electrical lead extending across the suspension body for connection to a slider, comprising:

(a) mounting the suspension body on an upper surface platform of a base;

(b) contacting the integrated electrical lead above the platform with an upper surface of a grounding body which is slidably mounted in a hole in the base;

(c) contacting a lower surface of the grounding body with a spring which is mounted to a lower surface of the base such that the upper surface of the grounding body is biased against and contacts the integrated electrical lead while the suspension body is mounted on the upper surface platform for protecting the slider against electrostatic discharge.

15. The method of claim 14, further comprising the step of limiting upward movement of the grounding body through the hole in the arm with a protrusion on a lower end of the grounding body.

16. The method of claim 14, further comprising the step of forming the grounding body from a semi-conductive material.