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Chip capacitor electromagnetic interference filter

  • US 5,959,829 A
  • Filed: 02/18/1998
  • Issued: 09/28/1999
  • Est. Priority Date: 02/18/1998
  • Status: Expired due to Term
First Claim
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1. An electromagnetic interference (EMI) filter assembly disposed at a point of lead penetration through a conductive substrate, comprising:

  • at least one conductive terminal associated with the point of lead penetration through the conductive substrate;

    means for mounting the at least one conductive terminal for passage through an opening formed in the conductive substrate with the conductive terminal and the substrate in non-conductive relation; and

    a plurality of chip capacitors of differing capacitance values each having first and second sets of electrode plates, the first set of electrode plates being conductively coupled to the at least one conductive terminal, and the second set of electrode plates being conductively coupled to the conductive substrate.

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