Surface mount power supply package and method of manufacture thereof
First Claim
1. A surface mount package for containing a board-mounted power supply, comprising:
- a plurality of leads having first ends and second, surface mount ends;
a dielectric lead frame that retains said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar, said first ends couplable to said board-mounted power supply;
a shell, coupled to said lead frame, that forms a portion of a periphery of said surface mount package; and
potting material located between said lead frame and said shell and adapted to resist movement of said board-mounted power supply within said surface-mount package.
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0 Petitions
Accused Products
Abstract
A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package includes: (1) a plurality of leads having first ends and second, surface mount ends, (2) a dielectric lead frame that retains the plurality of leads in predetermined positions relative to one another such that at least some of the second, surface mount ends are co-planar, the first ends couplable to the board-mounted power supply, (3) a shell, coupled to the lead frame, that forms a portion of a periphery of the surface mount package and (4) potting material located between the lead frame and the shell.
34 Citations
21 Claims
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1. A surface mount package for containing a board-mounted power supply, comprising:
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a plurality of leads having first ends and second, surface mount ends; a dielectric lead frame that retains said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar, said first ends couplable to said board-mounted power supply; a shell, coupled to said lead frame, that forms a portion of a periphery of said surface mount package; and potting material located between said lead frame and said shell and adapted to resist movement of said board-mounted power supply within said surface-mount package. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of manufacturing a surface mount package for containing a board-mounted power supply, comprising the steps of:
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forming a plurality of leads having first ends and second, surface mount ends; retaining, with a dielectric lead frame, said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar, said first ends couplable to said board-mounted power supply; coupling a shell to said lead frame, said shell forming a portion of a periphery of said surface mount package; and introducing potting material between said lead frame and said shell, said potting material adapted to resist movement of said board-mounted power supply within said surface-mount package. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A surface mount packaged power supply, comprising:
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a plurality of leads having first ends and second, surface mount ends; a dielectric lead frame that retains said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar; a power supply having a magnetic core associated therewith and conductors coupled to at least some of said first ends; a shell, coupled to said lead frame, that forms a portion of a periphery of said surface mount package; and potting material, located between said lead frame and said shell and at least partially surrounding said power supply, that resists movement of said power supply within said surface-mount package. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification