Modular surface mount circuit device and a manufacturing method thereof

• US 5,959,846 A
• Filed: 12/23/1997
• Issued: 09/28/1999
• Est. Priority Date: 12/26/1996
• Status: Expired due to Fees

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Murano, Yosio, Miyashita, Masashi, Noguchi, Kathuhiko
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): FOSTER, DAVID A
• Application Number:
  US08/997,485
• Time in Patent Office: 644 Days
• Field of Search: 361/782, 361/762, 361/748, 361/763, 361/764, 361/760, 361/772, 361/771, 361/783, 361/807, 361/809, 361/811, 361/812, 257/690, 257/691, 257/704, 257/735, 257/736, 257/773, 257/774, 257/782, 257/784, 257/783, 336/200, 333/238, 333/246, 333/204, 174/524
• US Class Current: 361/782
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 17/062 Toroidal core with turns of coil around it
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

First and second electrically insulating substrates are joined with each other at respective joining faces thereof. Each of the first and second insulating substrates has an annular groove at the joining face, and a plurality of through holes along outer and inner peripheries of the annular groove. An annular core is mounted in the annular groove. A cylindrical connection is formed in each through hole, and a radial connection is formed on an outer surface of each insulating substrate so as to connect opposite cylindrical connections. A toroidal coil is formed by serially connecting cylindrical connections and radial connections. An IC chip is mounted on the outer surface of the first insulating substrate, and connected to the toroidal coil and electronic part. The toroidal coil and the electronic part are coated with an electrically insulating material.

Claims

1. A modular surface mount circuit device comprising:

a junction unit including first and second electrically insulating substrates which are joined with each other at respective joining faces thereof;

at least one of the first and second insulating substrates having an annular groove at the joining face;

each of the first and second insulating substrates having a plurality of through holes along outer and inner peripheries of the annular groove;

an annular member made of magnetic material mounted in the annular groove;

a cylindrical connection formed in each of the through holes;

a radial connection formed on an outer surface of each of the first and second insulating substrates so as to connect opposite cylindrical connections;

a toroidal coil formed by serially connecting cylindrical connections and radial connections;

at least one electronic part mounted on the outer surface of either of the first and second insulating substrates;

patterns mounted on the part mounted surface for connecting the toroidal coil and the electronic part; and

an electrically insulating material coating the toroidal coil and the electronic part.

2. The circuit device according to claim 1 wherein the annular groove is formed in the joining face of each of the insulating substrates.

3. The circuit device according to claim 1 further comprising a pair of terminal electrodes formed on opposite end portions of the junction unit, and both ends of the toroidal coil, are electrically connected to the terminal electrodes, respectively.

4. The circuit device according to claim 1 wherein the second insulating substrate is made of insulating film.

5. The circuit device according to claim 1 wherein the first and second insulating substrates are made of insulating films, and the annular groove is formed by a recessed groove formed in the second insulating substrate.

6. The circuit device according to claim 1 wherein the electronic part is mounted in a recess formed in the first insulating substrate.

7. The circuit device according to claim 1 wherein the annular member is a magnetic core.

8. The circuit device according to claim 4 wherein the first insulating substrate has a recess at a central portion in the toroidal coil, and the electronic part is mounted in the recess.

9. A method for manufacturing a plurality of modular surface mount circuit devices, the steps comprising:

providing first and second electrically insulating planar substrates, each having an outer surface and a joining face, and having a plurality of units defined by a plurality of crossing lines, at least one of the substrates having an annular groove in each of the units arranged in matrix on the joining face, and each of the substrates having a plurality of through holes formed along outer and inner peripheries of each of the annular grooves;

forming a cylindrical connection in each of the through holes of each of the substrates;

forming a radial connection on the outer surface of each of the substrates so as to connect opposite cylindrical connections;

mounting an annular member made of magnetic material in each of the annular grooves;

joining the first and second substrates at the joining faces;

electrically and serially connecting the cylindrical connections and radial connections at each of the units so as to form a toroidal coil;

mounting at least one electronic part on the outer surface of either of the first and second substrates at each unit;

electrically connecting the toroidal coil and the electronic part with each other at each unit;

coating the toroidal coil and the electronic part with an electrically insulating material; and

cutting the first and second substrates along the crossing lines to provide an individual circuit device.

10. The method according to claim 9 further comprising each of the first and second substrates has a plurality of elongated through holes formed along parallel lines between arrays of units, and forming a terminal electrode along each of the elongated through holes.

11. The method according to claim 10 wherein opposite terminal electrodes are connected to both ends of the toroidal coil.