Temperature sensor integral with microprocessor and methods of using same

• US 5,961,215 A
• Filed: 09/26/1997
• Issued: 10/05/1999
• Est. Priority Date: 09/26/1997
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Lee, Thomas H., Johnson, Mark G., Crowley, Matthew P.
• Primary Examiner(s): Bennett, G. Bradley
• Application Number:
  US08/938,392
• Time in Patent Office: 739 Days
• Field of Search: 374/141, 374/170, 374/172, 374/176, 374/178, 257/467, 257/470
• US Class Current: 374/178
• CPC Class Codes: G01K 7/01 using semiconducting elements having PN junctions G01K7/02, G01K7/16, G01K7/30 take precedence

Abstract

A temperature sensor includes a bandgap reference circuit for providing a temperature-independent reference voltage, a biasing circuit that mirrors a current in the bandgap reference circuit for providing a temperature-dependent biasing voltage, and an amplifier responsive to the reference voltage and the biasing voltage for providing a temperature-dependent output voltage. Preferably, the temperature sensor is integral with a microprocessor and implemented in CMOS technology. The temperature sensor can be used, for instance, to reduce the clock speed of the microprocessor when the microprocessor temperature exceeds a predetermined temperature, or to store temperature-indicating data in non-volatile memory of the microprocessor to provide a thermal history of the microprocessor.

Claims

1. A temperature sensor, comprising:

a bandgap reference circuit for providing a temperature-independent reference voltage;

a biasing circuit that mirrors a current in the bandgap reference circuit for providing a temperature-dependent biasing voltage; and

an amplifier responsive to the reference voltage and the biasing voltage for providing a temperature-dependent output voltage.

2. The temperature sensor of claim 1, wherein:

the bandgap reference circuit includes first, second and third current paths between a power supply terminal and ground;

the first current path includes a field effect transistor with an input terminal coupled to a node and an output terminal coupled to the power supply terminal, a diode-connected bipolar transistor with a control terminal and output terminal coupled to ground, and is devoid of a resistor;

the second current path includes a field effect transistor with an input terminal coupled to the node and an output terminal coupled to the power supply terminal, a diode-connected bipolar transistor with a control terminal and output terminal coupled to ground, and a resistor coupled to another output terminal of the diode-connected bipolar transistor in the second current path; and

the third current path includes a field effect transistor with an input terminal coupled to the node and an output terminal coupled to the power supply terminal, a diode-connected bipolar transistor with a control terminal and output terminal coupled to ground, and a resistor coupled to another output terminal of the diode-connected bipolar transistor in the third current path.

3. The temperature sensor of claim 2, wherein:

a base-emitter voltage of the diode-connected bipolar transistor in the first current path provides a first voltage that decreases as temperature increases;

a base-emitter voltage of the diode-connected bipolar transistor in the second current path and a voltage across the resistor in the second current path in combination provide a second voltage that is essentially identical to the first voltage; and

a base-emitter voltage of the diode-connected bipolar transistor in the third current path and a voltage across the resistor in the third current path in combination provide the reference voltage.

4. The temperature sensor of claim 3, wherein the biasing circuit includes a current path between the power supply terminal and ground that includes a field effect transistor with a control terminal coupled to the node and an output terminal coupled to the power supply terminal, a resistor coupled to ground, and is devoid of a diode-connected bipolar transistor.

5. The temperature sensor of claim 4, wherein a voltage across the resistor in the biasing circuit provides the biasing voltage.

6. The temperature sensor of claim 5, wherein the amplifier includes inverting and non-inverting input terminals and an output terminal, a feedback resistor is coupled between the inverting terminal and the output terminal, and the non-inverting terminal is coupled to the field effect channel transistor and the resistor in the biasing circuit.

7. The temperature sensor of claim 6, further including a unity-gain buffer and an input resistor, wherein:

the unity-gain buffer includes an input terminal coupled to the field effect transistor and the resistor in the third current path; and

the input resistor is coupled between an output terminal of the unity-gain buffer and the inverting input terminal of the amplifier.

8. The temperature sensor of claim 1, wherein the output voltage is proportional to absolute temperature.

9. The temperature sensor of claim 1, implemented in CMOS technology.

10. A single integrated circuit chip including the temperature sensor of claim 1 and a microprocessor.

11. A temperature sensor, comprising:

a bandgap reference circuit for providing a temperature-independent reference voltage;

a biasing circuit that mirrors a current in the bandgap reference circuit for providing a temperature-dependent biasing voltage that is proportional to absolute temperature;

a first operational amplifier responsive to the reference voltage for providing a temperature-independent buffered reference voltage; and

an amplifier responsive to the buffered reference voltage and the biasing voltage for providing a temperature-dependent output voltage that is proportional to absolute temperature.

12. The temperature sensor of claim 11, wherein:

the bandgap reference circuit includes first, second and third current paths between a power supply terminal and ground;

the first current path includes a P-channel transistor with a gate coupled to a node and a source coupled to the power supply terminal, a diode-connected PNP transistor with a base and collector coupled to ground, and is devoid of a resistor;

the second current path includes a P-channel transistor with a gate coupled to the node and a source coupled to the power supply terminal, a diode-connected PNP transistor with a base and collector coupled to ground, and a resistor coupled to an emitter of the diode-connected PNP transistor in the second current path; and

the third current path includes a P-channel transistor with a gate coupled to the node and a source coupled to the power supply terminal, a diode-connected PNP transistor with a base and collector coupled to ground, and a resistor coupled to an emitter of the diode-connected PNP transistor in the third current path.

13. The temperature sensor of claim 12, wherein:

a base-emitter voltage of the diode-connected PNP transistor in the first current path provides a first voltage that decreases as temperature increases;

a base-emitter voltage of the diode-connected PNP transistor in the second current path and a voltage across the resistor in the second current path in combination provide a second voltage that is essentially identical to the first voltage; and

a base-emitter voltage of the diode-connected PNP transistor in the third current path and a voltage across the resistor in the third current path in combination provide the reference voltage.

14. The temperature sensor of claim 13, wherein the biasing circuit includes a current path between the power supply terminal and ground that includes a P-channel transistor with a gate coupled to the node and a source coupled to the power supply terminal, a resistor coupled to ground, and is devoid of a diode-connected PNP transistor.

15. The temperature sensor of claim 14, wherein a voltage across the resistor in the biasing circuit provides the biasing voltage.

16. The temperature sensor of claim 15, wherein the first amplifier includes first inverting and non-inverting input terminals and a first output terminal, the first inverting and output terminals are coupled to one another, and the first non-inverting input terminal is coupled to the P-channel transistor and the resistor in the third current path.

17. The temperature sensor of claim 16, wherein the second amplifier includes second inverting and non-inverting input terminals and a second output terminal, a feedback resistor is coupled between the second inverting and output terminals, the second non-inverting terminal is coupled to the P-channel transistor and the resistor in the biasing circuit, and an input resistor is coupled between the second inverting terminal and the first output terminal.

18. The temperature sensor of claim 11, wherein currents through the first, second and third current paths in the bandgap reference circuit and the current path in the biasing circuit are proportional to absolute temperature.

19. The temperature sensor of claim 11, implemented in CMOS technology.

20. A single integrated circuit chip including the temperature sensor of claim 11 and a microprocessor.

21. A temperature sensor, comprising:

a bandgap reference circuit, including;

first, second and third field effect transistors with control terminals coupled to a first node and output terminals coupled to a first power supply terminal, wherein the second field effect transistor includes another output terminal coupled to the first node;

fourth and fifth field effect transistors with control terminals coupled to a second node, wherein the fourth field effect transistor includes an output terminal coupled to the second node;

first, second and third diode-connected bipolar transistors with control terminals and output terminals coupled to a second power supply terminal; and

first and second resistors, wherein the first resistor is coupled between output terminals of the fifth field effect transistor and the second diode-connected bipolar transistor, and the second resistor is coupled between output terminals of the third field effect transistor and the third diode-connected bipolar transistor;

wherein

a first current path between the first and second power supply terminals includes the first and fourth field effect transistors and the first diode-connected bipolar transistor;

a second current path between the first and second power supply terminals includes the second and fifth field effect transistors and the first resistor and the second diode-connected bipolar transistor;

a third current path between the first and second power supply terminals includes the third field effect transistor and the second resistor and the third diode-connected bipolar transistor; and

a temperature-independent reference voltage is provided at a third node in the third current path between the third field effect transistor and the second resistor;

a biasing circuit, including;

a sixth field effect transistor with a control terminal coupled to the first node and an output terminal coupled to the first power supply terminal; and

a third resistor coupled between another output terminal of the sixth field effect transistor and the second power supply terminal;

wherein

a fourth current path between the first and second power supply terminals includes the sixth field effect transistor and the third resistor; and

a temperature-dependent biasing voltage is provided at a fourth node in the fourth current path between the sixth field effect transistor and the third resistor;

a buffering stage with an input terminal coupled to the third node and an output terminal coupled to a fifth node;

an amplifying stage, including;

an operational amplifier with a non-inverting input terminal coupled to the fourth node, an inverting input terminal, and an output terminal;

a fourth resistor coupled to the inverting input terminal and the fifth node; and

a fifth resistor coupled to the inverting input terminal and the output terminal of the operational amplifier;

wherein

a temperature-dependent output voltage is provided at the output terminal of the operational amplifier.

22. The temperature sensor of claim 21, wherein:

the first, second, third and sixth field effect transistors are P-channel transistors;

the fourth and fifth field effect transistors are N-channel transistors; and

the first, second and third diode-connected bipolar transistors are PNP transistors.

23. The temperature sensor of claim 21, wherein at least one of the second and third resistors, and at least one of the fourth and fifth resistors, include a plurality of programmably interconnected diffused resistors.

24. The temperature sensor of claim 21, wherein the first diode-connected bipolar transistor consists of a single bipolar transistor, and the second and third diode-connected bipolar transistors each include a plurality parallel-connected bipolar transistors.

25. The temperature sensor of claim 21, wherein currents through the first, second, third and fourth current paths are proportional to absolute temperature.

26. A temperature sensor, comprising:

a bandgap reference circuit, including;

first, second and third P-channel transistors with gates coupled to a first node and sources coupled to a power supply terminal, wherein the second P-channel transistor includes a drain coupled to the first node;

first and second N-channel transistors with gates coupled to a second node, wherein the first N-channel transistor includes a drain coupled to the second node;

first, second and third diode-connected PNP transistors with bases and collectors coupled to ground; and

first and second resistors, wherein the first resistor is between a source of the second N-channel transistor and an emitter of the second PNP transistor, and the second resistor is between a source of the third P-channel transistor and an emitter of the third PNP transistor;

wherein

a first current path between the power supply terminal and ground includes the first P-channel transistor and the first N-channel transistor and the first PNP transistor;

a second current path between the power supply terminal and ground includes the second P-channel transistor and the second N-channel transistor and the first resistor and the second PNP transistor;

a third current path between the power supply terminal and ground includes the third P-channel transistor and the second resistor and the third PNP transistor; and

a temperature-independent reference voltage is provided at a third node in the third current path between the third P-channel transistor and the second resistor;

a biasing circuit, including;

a fourth P-channel transistor with a gate coupled to the first node and a source coupled to the power supply terminal; and

a third resistor coupled between a drain of the fourth P-channel transistor and ground;

wherein

a fourth current path between the power supply terminal and ground includes the fourth P-channel transistor and the third resistor; and

a temperature-dependent biasing voltage is provided at a fourth node in the fourth current path between the fourth P-channel transistor and the third resistor;

a first operational amplifier with a non-inverting input terminal coupled to the third node; and

a second operational amplifier with a non-inverting input terminal coupled to the fourth node, wherein a fourth resistor is coupled between an inverting input terminal and an output terminal of the second operational amplifier, a fifth resistor is coupled between an output terminal of the first operational amplifier and the inverting input terminal of the second operational amplifier, and the output terminal of the second operational amplifier provides a temperature-dependent output voltage.

27. The temperature sensor of claim 26, wherein:

a drain of the first P-channel transistor is coupled to the second node;

a drain of the second N-channel transistor is coupled to the first node;

a source of the first N-channel transistor is coupled to an emitter of the first PNP transistor;

the first resistor is coupled to a source of the second N-channel transistor and an emitter of the second PNP transistor;

the second resistor is coupled to a source of the third P-channel transistor and an emitter of the third PNP transistor; and

the third resistor is coupled to a drain of the fourth P-channel transistor and ground.

28. The temperature sensor of claim 27, wherein:

at least one of the second and third resistors, and at least one of the fourth and fifth resistors, include a plurality of programmably interconnected diffused resistors;

the first PNP transistor consists of a single PNP transistor;

the second PNP transistor is a compound transistor that includes a plurality parallel-connected PNP transistors; and

the third PNP transistor is a compound transistor that includes a plurality of parallel-connected PNP transistors.

29. The temperature sensor of claim 27, wherein currents through the first, second, third and fourth current paths are proportional to absolute temperature.

30. A temperature sensor integral with a microprocessor in a single integrated circuit chip, wherein the temperature sensor comprises:

a bandgap reference circuit for providing a temperature-independent reference voltage,

a biasing circuit that mirrors a current in the bandgap reference circuit for providing a temperature-dependent biasing voltage, and

an amplifier responsive to the reference voltage and the biasing voltage for providing an output signal.

31. A method of sensing temperature, comprising:

providing a temperature-independent reference voltage using a bandgap reference circuit;

providing a temperature-dependent biasing voltage using a biasing circuit that mirrors a current in the bandgap reference circuit; and

providing a temperature-dependent output voltage using an amplifier responsive to the reference voltage and the biasing voltage.

32. The method of claim 31, including:

providing the current through the bandgap reference circuit that is proportional to absolute temperature; and

providing a mirror current through the biasing circuit that mirrors the current through the bandgap reference circuit and is proportional to absolute temperature.

33. The method of claim 31, including:

providing the reference voltage across a series combination of a resistor and a diode-connected bipolar transistor in the bandgap reference circuit; and

providing the biasing voltage across a resistor in the biasing circuit.

34. The method of claim 31, performed by a temperature sensor implemented in CMOS technology.

35. The method of claim 31, performed by a temperature sensor integral with and sensing the temperature of a microprocessor.

36. A method of using a temperature sensor integral with a microprocessor, comprising:

operating the microprocessor at an operating temperature;

using the temperature sensor to generate a temperature-dependent output signal indicative of the operating temperature, where the temperature sensor includes

a bandgap reference circuit for providing a temperature-independent reference voltage,

a biasing circuit that mirrors a current in the bandgap reference circuit for providing a temperature-dependent biasing voltage, and

an amplifier responsive to the reference voltage and the biasing voltage for providing the output signal; and

issuing a warning signal to a user in response to the output signal indicating that the operating temperature exceeds a predetermined temperature.

37. The method of claim 36, wherein the warning signal is a warning message visually displayed on a monitor.

38. The method of claim 36, wherein the microprocessor and the temperature sensor are embedded in a single integrated circuit chip.

39. The method of claim 38, wherein the output signal is proportional to absolute temperature.

40. The method of claim 39, wherein the temperature sensor is implemented in CMOS technology.

41. A method of using a temperature sensor integral with a microprocessor, comprising:

operating the microprocessor at an operating temperature;

using the temperature sensor to generate a temperature-dependent output signal indicative of the operating temperature; and

reducing a clock speed of the microprocessor in response to the output signal indicating that the operating temperature exceeds a predetermined temperature.

42. The method of claim 41, wherein reducing the clock speed of the microprocessor cools down the microprocessor while the microprocessor continues to operate.

43. The method of claim 41, wherein the microprocessor and the temperature sensor are embedded in a single integrated circuit chip.

44. The method of claim 43, wherein the output signal is proportional to absolute temperature.

45. The method of claim 44, wherein the temperature sensor is implemented in CMOS technology.

46. The method of claim 44, wherein the temperature sensor includes:

a bandgap reference circuit for providing a temperature-independent reference voltage;

a biasing circuit that mirrors a current in the bandgap reference circuit for providing a temperature-dependent biasing voltage; and

an amplifier responsive to the reference voltage and the biasing voltage for providing the output signal.

47. A method of using a temperature sensor integral with a microprocessor, comprising:

operating the microprocessor at an operating temperature;

using the temperature sensor to generate a temperature-dependent output signal indicative of the operating temperature, where the temperature sensor includes

a bandgap reference circuit for providing a temperature-independent reference voltage,

a biasing circuit that mirrors a current in the bandgap reference circuit for providing a temperature-dependent biasing voltage, and

an amplifier responsive to the reference voltage and the biasing voltage for providing the output signal;

providing digital temperature-indicating data in response to the output signal; and

storing the temperature-indicating data in non-volatile memory of the microprocessor.

48. The method of claim 47, wherein the temperature-indicating data stored in the non-volatile memory provides a thermal history of the microprocessor.

49. The method of claim 47, wherein the temperature-indicating data stored in the non-volatile memory can not be altered by a user.

50. The method of claim 47, wherein the microprocessor and the temperature sensor are embedded in a single integrated circuit chip.

51. The method of claim 50, wherein the output signal is proportional to absolute temperature.

52. The method of claim 51, wherein the temperature sensor is implemented in CMOS technology.