Process for forming a semiconductor device

• US 5,961,373 A
• Filed: 06/16/1997
• Issued: 10/05/1999
• Est. Priority Date: 06/16/1997
• Status: Expired due to Term

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Lai, Lei Ping, Kim, Sung C.
• Primary Examiner(s): Scherbel, David A.
• Assistant Examiner(s): NGUYEN, GEORGE BINH MINH
• Application Number:
  US08/876,461
• Time in Patent Office: 841 Days
• Field of Search: 451/41, 451/56, 451/443, 451/444, 451/285-289, 451/5, 451/21
• US Class Current: 451/41
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

A process for conditioning a polishing pad has been developed that incorporates in-situ conditioning where the conditioning is performed while the substrate (27, 40) is on the polishing pad (22) but terminates before the polishing of the substrate (27, 40) is completed. In one embodiment, ex-situ conditioning of the polishing pad (22) is used on the polishing pad between substrates (27, 40). The process has benefits of both in-situ and ex-situ conditioning.

Claims

1. A process for forming a semiconductor device comprising the steps of:

placing a substrate onto a polishing pad within an apparatus, wherein a layer overlies the substrate;

polishing the layer and conditioning the polishing pad using a first conditioner during a first time period;

polishing the layer without conditioning the polishing pad using the first conditioner for a second time period after the first time period and before depositing an additional layer; and

removing the substrate from the apparatus after the steps of polishing.

2. A process as in claim 1, wherein the substrate is a patterned semiconductor device substrate.

3. A process as in claim 1, wherein the layer includes an insulating layer.

4. A process as in claim 1, wherein the layer comprises a first film and a second film that overlies the first film, and wherein the first film has a slower polishing rate compared to the second film.

5. A process as in claim 1, wherein the first time period is at least approximately equal to the second time period.

6. A process as in claim 5, wherein the first time period is at most approximately seven times the second time period.

7. A process as in claim 1, wherein the first time period is at most approximately seven times the second time period.

8. A process as in claim 1, wherein the step of polishing the layer without conditioning the polishing pad using the first conditioner for a second time period after the first time period, further comprises a step of conditioning the polishing pad using a second conditioner that is different from the first conditioner, wherein this step is performed after the step of removing the substrate.

9. A process as in claim 8, further comprising the step of conditioning the polishing pad using the second conditioner, wherein this step is performed before the step of placing the substrate.

10. A process as in claim 1, wherein the layer comprises a conductive, metal-containing material.

11. A process as in claim 1, wherein the step of polishing the layer without conditioning the polishing pad using the first conditioner for a second time period after the first time period, further comprises a step of polishing the layer and conditioning the polishing pad using a second conditioner during the second time period, wherein the first conditioner has a conditioning surface that is rougher than a conditioning surface of the second conditioner.

12. A process for forming a semiconductor device comprising the steps of:

conditioning a polishing pad using a first conditioner;

placing a substrate onto a polishing pad within an apparatus, wherein a layer overlies the substrate after the step of conditioning;

polishing the layer and conditioning the polishing pad using a second conditioner during a first time period;

polishing the layer without conditioning the polishing pad for a second time period after the first time period and before depositing an additional layer; and

removing the substrate from the apparatus after the steps of polishing.

13. A process as in claim 12, wherein the substrate is a patterned semiconductor device substrate.

14. A process as in claim 13, wherein the patterned semiconductor device substrate has a first channel that is at least approximately 10 microns wide and a second channel that is at most approximately 1 micron wide.

15. A process as in claim 14, further comprising the step of patterning the substrate before the step of polishing the layer and conditioning the polishing pad using the second conditioner during the first time period.

16. A process as in claim 15, wherein the patterned semiconductor device substrate has a first region and a second region adjacent to the first region within a substrate area, wherein each of the first and second regions occupy at least approximately 10 percent of the substrate area, and an uppermost surface of the layer overlying the first region lies at an elevation higher than the uppermost surface of the layer overlying the second region.

17. A process as in claim 16, wherein the first region includes a cache memory region and the second region includes a logic region.

18. A process as in claim 17, wherein the layer is at most approximately 4000 Å

thick and the layer is an interlevel dielectric layer.

19. A process as in claim 12, wherein the first time period is at least approximately equal to the second time period.

20. A process as in claim 12, wherein the first time period is at most approximately seven times the second time period.

21. A process for forming a semiconductor device comprising the steps of:

placing a substrate onto a polishing pad within an apparatus, wherein a layer overlies the substrate;

polishing the layer and conditioning the polishing pad using a first conditioner during a first time period, wherein the conditioning is performed using a first conditioning parameter having a first type and a first value;

polishing the layer and conditioning the polishing pad using the first conditioner during a second time period after the first time period, wherein;

the conditioning is performed using a second conditioning parameter having a second type and second value that is different from the first value; and

the substrate remains on the polishing pad between the first time period and the second time period; and

removing the substrate from the apparatus after the steps of polishing.

22. A process as in claim 21, wherein the first type of the first conditioning parameter is of a same type as the second type of the second conditioning parameter and is a type selected from a group consisting of down force pressure, rotational speed, and linear velocity.

23. A process as in claim 22, wherein the second value of the second conditioning parameter is less than the first value of the first conditioning parameter.

24. A process as in claim 21, wherein the first time period is at least approximately equal to the second time period.

25. A process as in claim 21, wherein the first time period is at most approximately seven times the second time period.