Laser scribe and break process

• US 5,961,852 A
• Filed: 09/09/1997
• Issued: 10/05/1999
• Est. Priority Date: 09/09/1997
• Status: Expired due to Fees

• Current Assignee: Optical Coating Laboratory, Inc. (Lumentum Holdings Inc.)
• Original Assignee: Optical Coating Laboratory, Inc. (Lumentum Holdings Inc.)
• Inventors: Rafla-Yuan, Howard C., Bradley, Rick
• Primary Examiner(s): Evans, Geoffrey S.
• Application Number:
  US08/925,979
• Time in Patent Office: 756 Days
• Field of Search: 219/121.69, 219/121.67, 136/256, 136/258, 438/463, 428/428, 501/65, 225/2
• US Class Current: 219/121.69
• CPC Class Codes: B23K 2103/172 wherein at least one of the layers is non-metallic
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: C03B 33/0222 Scoring using a focussed radiation beam, e.g. laser
• CPC Class Codes: C03B 33/074 Glass products comprising an outer layer or surface coating of non-glass material
• CPC Class Codes: C03B 33/091 using at least one focussed radiation beam, e.g. laser beam C03B33/0955 takes precedence
• CPC Class Codes: C03C 17/23 Oxides C03C17/02 takes precedence
• CPC Class Codes: C03C 2217/21 Oxides
• CPC Class Codes: C03C 2218/32 After-treatment
• CPC Class Codes: C03C 23/0025 by a laser beam
• CPC Class Codes: H01L 31/02165 using interference filters, e.g. multilayer dielectric filters interference filters G02B5/28
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y02P 40/57 Improving the yield, e-g- reduction of reject rates

Abstract

A method for effectuating scribe and break of coated glass microsheets for use with satellite solar cell covers. The method improves the consistency and edge quality of scribed solar cell covers, and also adds scribe and break capabilities not available with the conventional processes, resulting in various, even complex shapes and improved yields. The laser scribe method ensures that most of the laser energy is absorbed in a thin layer that is removed during the pulse, which further ensures that virtually no heat is left behind. This method also promotes a superior and consistent edge quality in satellite solar cell covers. The smoother edges eliminate points of weakness from where cracks may originate, as frequently experienced with the conventional diamond scribe techniques. A laser source such as a KrF excimer laser is utilized for scribing the microsheets. The absorption of the laser correlates with the particular properties of the coating contained on the surface of the microsheets and the particular properties of the microsheet itself. The microsheets are broken to their final size by applying a tensile force perpendicular to the scribe line.

Claims

1. A method of scribing and breaking microsheets comprising the steps of:

a. obtaining a microsheet of glass of a predetermined physical thickness;

b. obtaining a laser source capable of producing a wavelength which is strongly absorbed by the glass, said laser source being capable of generating at least one pulse sufficiently short in time so as to avoid damaging said microsheet by generation of excessive heat;

c. scribing said microsheet with said laser source to a predetermined depth in said microsheet to form one or more scribe lines; and

d. breaking said microsheet along the one or more scribe lines.

2. A method according to claim 1, wherein said microsheet is doped with a material with strong absorption at the wavelength of said laser source.

3. A method according to claim 1, wherein said microsheet comprises borosilicate.

4. A method according to claim 1, wherein said microsheet is doped with cerium.

5. A method according to claim 1, wherein said laser source comprises an excimer laser.

6. A method according to claim 1, wherein said laser source comprises a KrF excimer laser.

7. A method according to claim 1, wherein said laser source generates a wavelength of about 248 nanometers.

8. A method according to claim 1, wherein said laser source generates an output energy of about 2.2 J/cm² -pulse.

9. A method according to claim 1, wherein said predetermined scribe depth is obtained utilizing a plurality of pulses of said laser source, each of said plurality of pulses being sufficiently short in time so as to avoid generating excessive heat.

10. A method according to claim 1, wherein said microsheet is coated with at least one reflective thin film coating on at least one side of the microsheet.

11. A method according to claim 10, wherein said at least one reflective thin film coating comprises at least one red reflective coating.

12. A method according to claim 10, wherein said at least one reflective thin film coating comprises at least one blue reflective coating.

13. A method according to claim 10, wherein said at least one reflective thin film coating comprises Ta₂ O₅.

14. A method according to claim 10, wherein said at least one reflective thin film coating comprises SiO₂.

15. A method according to claim 10, wherein said at least one reflective thin film coating comprises SiO₂ and Ta₂ O₅.

16. A method according to claim 1, wherein said microsheet is coated on at least one side with at least one thin film coating which is anti-reflective for visible light.

17. A method according to claim 1, wherein said microsheet is coated on at least one side with at least one thin film coating which is anti-reflective for visible light, and said microsheet is coated on at least one side with at least one reflective thin film coating.

18. A method according to claim 1, wherein the step of breaking said microsheet includes applying a force to said microsheet such that the resulting edges of the broken microsheet are smooth and substantially lack points of weakness from where cracks may originate.

19. A glass cover microsheet formed by scribing a microsheet of glass having a predetermined physical thickness to a predetermined depth using a laser to form one or more scribe lines, and breaking the microsheet of glass along the one or more scribe lines such that the resulting edges of the scribed and broken microsheet of glass are smooth and substantially lack points of weakness from where cracks may originate.

20. A microsheet as recited in claim 19, wherein said microsheet is doped with cerium.

21. A microsheet as recited in claim 19, wherein said microsheet comprises borosilicate.

22. A microsheet as recited in claim 19, wherein said microsheet further comprises at least one surface coated with a dielectric.

23. A microsheet according to claim 19, wherein said microsheet is coated with at least one reflective thin film coating on at least one side of the microsheet.

24. A microsheet according to claim 23, wherein said at least one reflective thin film coating comprises at least one red reflective coating.

25. A microsheet according to claim 23, wherein said at least one reflective thin film coating comprises at least one blue reflective coating.

26. A microsheet according to claim 23, wherein said at least one reflective thin film coating comprises Ta₂ O₅.

27. A microsheet according to claim 23, wherein said at least one reflective thin film coating comprises SiO₂.

28. A microsheet according to claim 23, wherein said at least one reflective thin film coating comprises SiO₂ and Ta₂ O₅.

29. A microsheet according to claim 19, wherein said microsheet is coated on at least one side with at least one thin film coating which is anti-reflective for visible light.

30. A microsheet according to claim 19, wherein said microsheet is coated on at least one side with at least one thin film coating which is anti-reflective for visible light, and said microsheet is coated on at least one side with at least one reflective thin film coating.