Method for the manufacture of a membrane-containing microstructure

• US 5,962,081 A
• Filed: 11/07/1997
• Issued: 10/05/1999
• Est. Priority Date: 06/21/1995
• Status: Expired due to Term

• Current Assignee: Lagrummet December 1047 AB
• Original Assignee: Pharmacia Biotech AB (Danaher Corporation)
• Inventors: Vieider, Christian, Ohman, Ove
• Primary Examiner(s): DUDASH, DIANA L
• Application Number:
  US08/945,855
• Time in Patent Office: 697 Days
• Field of Search: 427/300, 427/282, 427/272, 427/230, 427/154, 427/97, 427/105, 427/309, 427/534, 427/535, 427/555, 427/240, 427/287, 427/290, 427/271, 216/39, 216/94, 216/97, 216/51, 216/2
• US Class Current: 427/534
• CPC Class Codes: F04B 43/043 Micropumps
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits

Abstract

A method for the manufacture of a microstructure having a top face and a bottom face, at least one hole or cavity therein extending from the top face to the bottom face, and a polymer membrane which extends over a bottom opening of said hole or cavity, which method comprises the steps of: providing a substrate body having said top and bottom faces, optionally forming at least part of said at least one hole or cavity in the substrate body, providing a membrane support at the bottom face opening of said at least one hole or cavity, depositing a layer of polymer material onto the bottom face of said substrate body against said membrane support, if required, completing the formation of the at least one hole or cavity, and, if not done in this step, selectively removing said membrane support to bare said polymer membrane over the bottom opening of the at least one hole or cavity.

Claims

1. A method for the manufacture of a microstructure having a top face and a bottom face, at least one hole therein extending from the top face to the bottom face, and a polymer membrane which extends over a bottom opening of said hole, which method comprises the steps of:

a) providing a substrate body (2;

     21) having said top and bottom faces,

b) forming at most part of said at least one hole (9;

     24) in the top face of the substrate body,

c) providing a membrane support layer (13;

     25)

(i) in said part of said at least one hole formed in step (b) and completing said at least one hole from the bottom face of said substrate body, or

(ii) on the bottom face of said substrate body,

d) depositing a layer of polymer material onto the bottom face of said substrate body (2;

     21) against said membrane support layer (13;

     25) to form a polymer membrane (15;

     26),

e) completing the formation of the at least one hole (9;

     24) if step (c) is according to alternative (ii), and

f) selectively removing said membrane support layer (13;

     25) to bare said polymer membrane (15;

     26) over the bottom opening of the at least one hole.

2. The method according to claim 1, wherein the substrate body (2, 21) is of etchable material.

3. The method according to claim 1 or 2, which comprises forming a part of said at least one hole and subsequently applying membrane support layer (25).

4. The method according to claim 3, wherein step (a) comprises providing the substrate body (21) in a form having a protective layer (22;

23) on the bottom face thereof;

step (b) comprises etching said part of said at least one hole (24) from the top face of the substrate body to the protective layer (22;

     23); and

step (c) is according to alternative (i) with completing of said at least one hole by removing said protective layer.

5. The method according to claim 1, wherein step (c) is according to alternative (ii) and step (e) comprises etching said at least one hole to the polymer material layer applied in step (d).

6. The method according to claim 5, wherein the etching is performed by a dry etch.

7. The method according to claim 1, wherein a part of said holes or cavities, are preformed by laser drilling.

8. The method according to claim 1, wherein said substrate body is from silicon, glass or quartz.

9. The method according to claim 8, wherein said substrate is a silicon wafer.

10. The method according to claim 1, wherein said polymer material is an elastomer.

11. The method according to claim 2, wherein said membrane support layer (13) is silicon oxide or silicon nitride or a combination thereof.

12. The method according to claim 3, wherein said membrane support layer (25) is a photoresist material.

13. The method according to claim 1, wherein the deposition of said polymer is performed by spin deposition.

14. The method of claim 6, wherein said dry etching is a reactive ion etch.

15. The method of claim 7, wherein a majority of said holes or cavities are laser etched.

16. The method of claim 10, wherein said elastomer is a silicone rubber.

17. A method for the manufacture of a microstructure having a top face and a bottom face, at least one hole therein extending from the top face to the bottom face, and a polymer membrane which extends over a bottom opening of said hole, which method comprises the steps of:

a) providing a substrate body (2;

     21) having said top and bottom faces and having a membrane support layer (13;

     25) on the bottom face of said substrate body,

b) forming at most part of said at least one hole (9;

     24) in the top face of the substrate body,

c) depositing a layer of polymer material onto the bottom face of said substrate body (2;

     21) against said membrane support layer (13;

     25) to form a polymer membrane (15;

     26),

d) completing the formation of the at least one hole (9;

     24) to the layer of polymer material applied in step (c), and

e) selectively removing said membrane support layer (13;

     25) to bare said polymer membrane (15;

     26) over the bottom opening of the at least one hole.

18. The method according to claim 17, wherein step (b) is comprises etching down to said membrane support layer and step (d) comprises removing the membrane support layer to bare the polymer membrane in said at least one hole formed in step (b).