Data carrier with electronic module and embedded coil feature

• US 5,962,840 A
• Filed: 12/22/1995
• Issued: 10/05/1999
• Est. Priority Date: 12/23/1994
• Status: Expired due to Fees

• Current Assignee: Giesecke & Devrient GmbH
• Original Assignee: Giesecke & Devrient GmbH
• Inventors: Hohmann, Arno, Hoppe, Joachim, Haghiri-Tehrani, Yahya
• Primary Examiner(s): LEE, MICHAEL GUNYOUNG
• Application Number:
  US08/577,495
• Time in Patent Office: 1,383 Days
• Field of Search: 235/492, 235/449, 235/451, 235/441, 235/487, 235/488, 902/26, 343/867, 343/788, 336/200, 336/232, 361/737
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07781 the coil being fabricated in a winding process
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A data carrier in which an electronic module comprising an integrated circuit and a coil electrically connected with the circuit is disposed in a channel in the data carrier. To permit simple manufacture of the data carrier, at least one opening for forming the channel is provided in at least one card layer, the opening being formed such that the layer is a cohesive layer.

Claims

1. A multi-layer data carrier comprising:

laminated one-piece layers having equal peripheral dimensions;

an electronic module including an integrated circuit and a coil electrically connected with the circuit;

a channel in the data carrier in which at least the coil is disposed; and

wherein a first opening is provided in a first layer of said data carrier and a second opening is provided in a second layer of said data carrier, said first and second openings being positioned such that said first and second openings together form said channel;

said first and second card layers having the peripheral dimensions of the data carrier.

2. The data carrier of claim 1, wherein a thermoplastic material having a softening point lower than that of the card layers is located at least in a partial area of the channel.

3. The data carrier of claim 1, wherein at least one layer of said data carrier additionally includes a second opening for receiving the integrated circuit of said module.

4. A multi-layer data carrier comprising;

laminated one-piece layers having equal peripheral dimensions;

an electronic module including an integrated circuit and a coil electrically connected with the circuit;

a channel in the data carrier in which at least the coil is disposed; and

wherein at least one of said card layers has at least one opening forming said channel for receiving the coil, said at least one card layer being retained in the data carrier as a one-piece layer having the peripheral dimensions of the data carrier; and

wherein said at least one opening has a width smaller than the length of said at least one opening and is provided in only one layer of the data carrier and said opening is interrupted by at least one bar, said bar spanning the opening across the width.

5. A semifinished product suitable for installation in a data carrier, comprising:

a carrier layer formed of flexible material and at least one flap of carrier layer material partially separated from said carrier layer by a slit that penetrates the carrier layer; and

a coil carried by the carrier layer clamped and positioned by said at least one flap such that the coil extends partly above and partly below the carrier layer.

6. The semifinished product according to claim 5, wherein the data carrier has peripheral dimensions and the carrier layer has the same peripheral dimensions as the data carrier.

7. A semifinished product suitable for installation in a data carrier formed of layers having first softening points, comprising at least one carrier layer formed of thermoplastic material having a softening point that is lower than any of the data carrier layers, and an electronic module comprising an integrated circuit and a coil electrically connected to the integrated circuit disposed on said one carrier layer.

8. The semifinished product according to claim 7, wherein the data carrier has peripheral dimensions and the carrier layer is a one-piece layer having the same peripheral dimensions as the data carrier.

9. The semifinished product according to claim 7, wherein the coil has a peripheral contour and wherein the carrier layer has an outer contour corresponding to the peripheral contour of the coil.

10. A method for producing a multi-layer data carrier for non-contacting data exchange, comprising the steps:

applying a parting agent to a first card layer in the area of a channel to be stamped out;

laminating a second card layer on the side of the first card layer on which the parting agent is located;

stamping through one of the two card layers up to the parting agent using a cutter so that the contour of the channel is cut in the stamped-through card layer and the card layer that is not stamped-through is not cut;

removing the material located between the cut edges from the stamped-through card layer to form a channel in said stamped-through card layer;

embedding in the channel an electronic module comprising an integrated circuit and a coil electrically connected with the circuit;

laminating on the first and second layers a third card layer so that the channel is covered by said third card layer.

11. The method according to claim 10, including spreading a liquid casting compound over the surface of the card layer containing the channel with a doctor blade after the electronic module is embedded in the channel so that the channel is filled at least partly with the casting compound.