Low voltage triggering electrostatic discharge protection circuit

• US 5,962,876 A
• Filed: 04/06/1998
• Issued: 10/05/1999
• Est. Priority Date: 04/06/1998
• Status: Expired due to Fees

• Current Assignee: Winbond Electronics Corporation
• Original Assignee: Winbond Electronics Corporation
• Inventors: Yu, Ta-Lee
• Primary Examiner(s): Ngo , Ngan V.
• Application Number:
  US09/055,619
• Time in Patent Office: 547 Days
• Field of Search: 257/133, 257/146, 257/173, 257/174
• US Class Current: 257/133
• CPC Class Codes: H01L 27/0248 for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection

Abstract

An electrostatic discharge protection circuit comprises a semiconductor layer of a first conductivity type, a floating semiconductor layer of a second conductivity type, a first doped region of the first conductivity type, a first doped region of the second conductivity type, a second doped region of the second conductivity type, a gate structure, and a second doped region of the first conductivity type. The floating semiconductor layer of a second conductivity type is in contact with the semiconductor layer of a first conductivity type to establish a junction therebetween. The first doped region of the first conductivity type is formed in the semiconductor layer of a second conductivity type and connected to a first node. The first doped region of the second conductivity type is formed in the semiconductor layer of a first conductivity type and connected to a second node. The second doped region of the second conductivity type spans the junction. The gate structure overlies a portion of the semiconductor layer of a first conductivity type between those doped regions of the second conductivity type. The second doped region of the first conductivity type is formed in the semiconductor layer of a first conductivity type and connected to the second node. The second doped region of the second conductivity type will break down to trigger the conduction of a discharge current flowing through the junction when electrostatic discharge stress occurs between the first node and the second node.

Claims

1. An electrostatic discharge protection circuit, comprising:

a semiconductor layer of a first conductivity type;

a floating semiconductor layer of a second conductivity type in contact with said semiconductor layer of a first conductivity type to establish a junction therebetween;

a first doped region of the first conductivity type formed in said semiconductor layer of a second conductivity type and connected to a first node;

a first doped region of the second conductivity type formed in said semiconductor layer of a first conductivity type and connected to a second node;

a second doped region of the second conductivity type spanning said junction;

a gate structure overlying a portion of said semiconductor layer of a first conductivity type between said doped regions of the second conductivity type; and

a second doped region of the first conductivity type formed in said semiconductor layer of a first conductivity type and connected to said second node;

wherein said second doped region of the second conductivity type enters breakdown to trigger the conduction of a discharge current flowing through said junction when electrostatic discharge stress occurs between said first node and said second node.

2. The electrostatic discharge protection circuit as claimed in claim 1, wherein the first conductivity type is P-type and the second conductivity type is N-type.

3. The electrostatic discharge protection circuit as claimed in claim 2, wherein said first node is connected to an integrated circuit pad.

4. The electrostatic discharge protection circuit as claimed in claim 3, wherein said second node is powered by a relatively low potential under normal operation.

5. The electrostatic discharge protection circuit as claimed in claim 4, wherein said gate structure comprises a dielectric layer and an electrode.

6. The electrostatic discharge protection circuit as claimed in claim 5, wherein said electrode is powered by said relatively low potential under said normal operation.

7. The electrostatic discharge protection circuit as claimed in claim 2, wherein said first node is powered by a relatively high potential under normal operation.

8. The electrostatic discharge protection circuit as claimed in claim 7, wherein said second node is powered by a relatively low potential under said normal operation.

9. The electrostatic discharge protection circuit as claimed in claim 8, wherein said gate structure comprises a dielectric layer and an electrode.

10. The electrostatic discharge protection circuit as claimed in claim 9, wherein said electrode is powered by said relatively low potential under said normal operation.

11. An electrostatic discharge protection circuit, comprising:

a P-type semiconductor layer;

a floating N-type semiconductor layer in contact with said P-type semiconductor layer to establish a junction therebetween;

a first P-type doped region formed in said N-type semiconductor layer and connected to a first node;

a first N-type doped region formed in said P-type semiconductor layer and connected to a second node;

a second N-type doped region spanning said junction;

a gate structure overlying a portion of said P-type semiconductor layer between said N-type doped regions; and

a second P-type doped region formed in said P-type semiconductor layer and connected to said second node.

12. The electrostatic discharge protection circuit as claimed in claim 11, wherein said first node is connected to an integrated circuit pad and said second node is powered by a relatively low potential under normal operation.

13. The electrostatic discharge protection circuit as claimed in claim 11, wherein said first node and said second node are powered by a relatively high potential and a relatively low potential, respectively, under normal operation.

14. The electrostatic discharge protection circuit as claimed in claim 11, wherein said gate structure comprises a dielectric layer and an electrode.

15. The electrostatic discharge protection circuit as claimed in claim 14, wherein said electrode is powered by a relatively low potential under normal operation.

16. An electrostatic discharge protection circuit, comprising:

a silicon-controlled rectifier connected between a first node and a second node, said silicon-controlled rectifier having a floating well formed in a semiconductor substrate to establish a junction therebetween; and

a MOS device connected in parallel to said silicon-controlled rectifier, said MOS transistor having one source/drain region spanning said junction;

said MOS device entering breakdown to trigger said silicon-controlled rectifier conducting a discharge current when an electrostatic discharge potential occurs between said first node and said second node.

17. The electrostatic discharge protection circuit as claimed in claim 16, wherein said first node is connected to an integrated circuit pad and said second node is powered by a relatively low voltage source under normal operation.

18. The electrostatic discharge protection circuit as claimed in claim 16, wherein said first node and said second node are powered by a relatively high voltage source and a relatively low voltage source, respectively, under normal operation.

19. The electrostatic discharge protection circuit as claimed in claim 16, wherein said gate structure comprises a dielectric layer and an electrode.

20. The electrostatic discharge protection circuit as claimed in claim 19, wherein said electrode is powered by a relatively low voltage source under normal operation.