Microstructure suspended by a microsupport

• US 5,962,909 A
• Filed: 09/12/1996
• Issued: 10/05/1999
• Est. Priority Date: 09/12/1996
• Status: Expired due to Term

• Current Assignee: Institut national d'optique
• Original Assignee: Institut national d'optique
• Inventors: Renaud, Martin, Jerominek, Hubert, Swart, Nicholas R.
• Primary Examiner(s): Saadat, Mahshid
• Assistant Examiner(s): Wilson, Allan R.
• Application Number:
  US08/711,915
• Time in Patent Office: 1,118 Days
• Field of Search: 257/53, 257/440, 257/446, 257/419, 257/467, 257/469, 257/621, 257/522, 257/773, 257/774, 250/338.1, 250/338.4, 250/342, 250/349, 250/370.01
• US Class Current: 257/522
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81C 1/00142 Bridges deformable micromirrors G02B26/0841
• CPC Class Codes: B81C 2201/053 Depositing a protective layers
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices

Abstract

The microbridge structure comprises a substrate layer provided with two first electrical contacts, a microstructure provided with two second electrical contacts, and a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer. The micro support extends along a vertical axis. The micro support has a central upper cavity extending along the vertical axis within the micro support. The micro support has a lower end connected to the substrate layer and an upper end connected to the microstructure for supporting the microstructure with respect to the substrate layer. The micro support is a multilayer micro support comprising two conductive paths and a layer made of dielectric material. The conductive paths and the layer of the micro support extend from the upper end to the lower end thereof. The two conductive paths connect respectively the two first contacts to the two second contacts. The present invention is also concerned with a method for forming a microstructure suspended by a micro support.

Claims

1. A multilayer microbridge structure comprising:

a substrate layer provided with two first electrical contacts;

a microstructure provided with two second electrical contacts;

a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer, the micro support extending along a vertical axis, the micro support having a lower end connected to the substrate layer and an upper end connected to the microstructure for supporting the microstructure with respect to the substrate layer, the micro support being a multilayer micro support having two first layers of electrically conductive material constituting two conductive paths, and a second layer made of dielectric material, the first and second layers of the micro support extending from the upper end to the lower end thereof, the two conductive paths connecting respectively the two first contacts to the two second contacts.

9. A multilayer microbridge structure according to claim 1, wherein the microstructure has an underside, a top side opposite to the underside, and at least one sensing layer lying between the underside and the top side, the sensing layer having two distal points constituting respectively the two second electrical contacts of the microstructure.

10. A multilayer microbridge structure according to claim 1, wherein the sensing layer is responsive to infrared radiations.

11. A multilayer microbridge structure according to claim 9, wherein the microstructure further comprises upper and lower dielectric layers, the upper and lower dielectric layers embedding the sensing layer and being located between the top side and the underside.

12. A multilayer microbridge structure according to claim 11, wherein:

the sensing layer is made of a material exhibiting a substantially high temperature coefficient of resistivity;

the sensing layer has a thickness of substantially 0.1 to 0.5 μ

m, and a surface dimension of about 50 μ

m by 50 μ

m; and

the dielectric layers of the microstructure are made of a material selected from the group consisting of Si₃ N₄ and SiO₂.

13. A multilayer microbridge structure according to claim 12, wherein the material of the sensing layer exhibiting a substantially high temperature coefficient of resistivity is selected from the group consisting of VO₂, V₂ O₃ and a-Si, whereby the microbridge structure forms an uncooled infrared bolometric detector.

2. A multilayer microbridge structure comprising:

a substrate layer provided with two first electrical contacts;

a microstructure provided with two second electrical contacts;

a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer, the micro support having two distal legs each extending along a vertical axis, each of the legs having a lower end connected to the substrate layer and an upper end connected to the microstructure for supporting the microstructure with respect to the substrate layer, each of the legs being a multilayer leg comprising a first layer made of electrically conductive material and a second layer made of dielectric material, the first layers of the legs constituting two conductive paths, the first and second layers of each leg extending from the upper end thereof to the lower end thereof, the two conductive paths connecting respectively the two first contacts to the two second contacts.

3. A multilayer microbridge structure according to claim 2, wherein each of the legs further comprises a third layer made of dielectric material which, in combination with the second layer, embeds the first layer, except for the lower and upper ends of the leg where openings are provided in the dielectric layers for allowing electrical connections between the first layer and the corresponding first and second electrical contacts, the first layer being an inner layer with respect to the second and third layers which are outer layers.

4. A multilayer microbridge structure according to claim 3, wherein:

the dielectric material of the micro support is made of a material selected from the group consisting of Si₃ N₄ and SiO₂.

5. A multilayer microbridge structure according to claim 3, wherein:

the inner layer is made of a material selected from the group consisting of Al, Au, Ti and V; and

the inner layer is a patterned metal film having a thickness of substantially 0.1μ

Mm.

6. A multilayer microbridge structure according to claim 2, wherein each of the legs is substantially shaped as an upside down hollow truncated pyramid.

7. A multilayer microbridge structure according to claim 3, wherein each of the legs has an upper portion made of upper parts of the first, second and third layers and shaped as a collar with a width of substantially 1 to 2 μ

ms.

8. A multilayer microbridge structure according to claim 2, wherein the two legs support-diagonal opposite corners of the microstructure.