Microelectromechanical positioning apparatus

• US 5,962,949 A
• Filed: 11/06/1997
• Issued: 10/05/1999
• Est. Priority Date: 12/16/1996
• Status: Expired due to Fees

• Current Assignee: Memscap Incorporated
• Original Assignee: MCNC, Inc.
• Inventors: Wood, Robert L., Dhuler, Vijayakumar R.
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US08/965,277
• Time in Patent Office: 698 Days
• Field of Search: 310/306, 310/307
• US Class Current: 310/307
• CPC Class Codes: B81B 2201/032 Bimorph and unimorph actuators, e.g. piezo and thermo
• CPC Class Codes: B81B 2201/054 Microvalves
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 2203/051 Translation according to an axis parallel to the substrate
• CPC Class Codes: B81B 3/0024 Transducers for transforming thermal into mechanical energy or vice versa, e.g. thermal or bimorph actuators electric motors using thermal effects H02N10/00
• CPC Class Codes: F03G 7/06 using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like using thermal expansion of non-vaporising liquids F01K
• CPC Class Codes: G02B 6/3803 Adjustment or alignment devices for alignment prior to splicing
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2001/0042 Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
• CPC Class Codes: H01H 2001/0068 with multi dimensional movement, i.e. the movable actuator performing movements in at least two different directions
• CPC Class Codes: H01H 2061/006 Micromechanical thermal relay
• CPC Class Codes: H01H 61/00 Electrothermal relays thermal switches not operated by electrical input, thermal switches with anticipating electrical input H01H37/00; thermally-sensitive members H01H37/32
• CPC Class Codes: H01H 9/14 Adaptation for built-in safety spark gaps

Abstract

A microelectromechanical (MEMS) positioning apparatus is provided that can precisely microposition an object in each of the X, Y and Z directions. The MEMS positioning apparatus includes a reference surface, a support disposed in a fixed position to the reference surface, and a stage defining an XY plane that is suspended adjacent to the support and over at least a portion of the reference surface. The MEMS positioning apparatus also includes at least one and, more typically, several actuators for precisely positioning the stage and, in turn, objects carried by the stage. For example, the MEMS positioning apparatus can include first and second MEMS actuators for moving the stage in the XY plane upon actuation. In addition, the MEMS positioning apparatus can include a Z actuator, such as a thermal bimorph structure, for moving the stage in the Z direction. As such, the MEMS positioning apparatus can precisely position the stage as well as any objects carried by the stage in each of the X, Y and Z directions. As a result of the construction of the MEMS positioning apparatus, the MEMS positioning apparatus can also be fabricated in an affordable, reliable and reproducible manner without compromising the precision alignment provided by the MEMS positioning apparatus.

Claims

1. A microelectromechanical positioning apparatus comprising:

a reference surface;

a support disposed in a fixed position relative to the reference surface;

a stage defining an XY plane and suspended from said support and over at least a portion of the reference surface; and

a first microelectromechanical actuator comprising;

spaced apart anchors disposed upon said support;

an arched beam extending between said spaced apart anchors; and

an actuator member operably coupled to said arched beam and extending outwardly therefrom for moving said stage in the XY plane upon thermal actuation of said first microelectromechanical actuator.

2. A microelectromechanical positioning apparatus according to claim 1 wherein said first microelectromechanical actuator further comprises means for heating said arched beam to cause further arching of said beam such that said actuator member operably contacts and controllably positions said stage in the XY plane.

3. A microelectromechanical positioning apparatus according to claim 1 further comprising a second microelectromechanical actuator for positioning said stage in the XY plane in a direction perpendicular to the direction of movement created by said first microelectromechanical actuator.

4. A microelectromechanical positioning apparatus according to claim 1 wherein said stage comprises a contact member disposed in a fixed position upon said stage and positioned such that an end portion of said actuator member contacts said contact member upon actuation of said first microelectromechanical actuator.

5. A microelectromechanical positioning apparatus according to claim 1 wherein said stage has opposed first and second major surfaces and is suspended such that the first major surface faces the reference surface, wherein the first major surface of said stage includes a recessed portion, and wherein the microelectromechanical positioning apparatus further comprises an actuator disposed on said stage and at least partially overlying the recessed portion of said stage such that actuation of said actuator bends said stage toward the underlying reference surface to thereby move said stage in a Z direction perpendicular to the XY plane.

6. A microelectromechanical positioning apparatus according to claim 1 further comprising at least one spring extending between said support and said stage for suspending said stage above said reference surface.

7. A microelectromechanical positioning apparatus comprising:

a reference surface;

a support disposed in a fixed position relative to the reference surface;

a stage having opposed first and second major surfaces and defining an XY plane, wherein said stage is suspended from said support and over at least a portion of the reference surface such that the first major surface faces the reference surface; and

wherein the first major surface of said stage includes a recessed portion; and

an actuator disposed on said stage and at least partially overlying the recessed portion of said stage such that actuation of said actuator bends said stage toward the underlying reference surface to thereby move said stage in a Z direction perpendicular to the XY plane.

8. A microelectromechanical positioning apparatus according to claim 7 further comprising at least one microelectromechanical actuator disposed upon said support for controllably moving said stage in the XY plane.

9. A microelectromechanical positioning apparatus according to claim 8 wherein said microelectromechanical actuator comprises:

spaced apart anchors disposed upon said support;

an arched beam extending between said spaced apart anchors;

an actuator member operably coupled to said arched beam and extending outwardly therefrom toward said stage; and

means for heating said arched beam to cause further arching of said beam such that said actuator member controllably positions said stage in the XY plane.

10. A microelectromechanical positioning apparatus according to claim 7 wherein said stage defines an elongate tongue portion, and wherein said actuator is disposed upon said elongate tongue portion such that actuation of said actuator bends said elongate tongue portion toward the underlying reference surface to thereby move said stage in the Z direction.

11. A microelectromechanical positioning apparatus according to claim 7 wherein said actuator is a thermal bimorph structure comprised of first and second layers, and wherein said first layer has a larger coefficient of expansion than the second layer.

12. A microelectromechanical positioning apparatus according to claim 7 wherein said stage defines several apertures opening through the recessed portion of the first surface of said stage to thereby improve the flexibility of said stage.

13. A microelectromechanical positioning apparatus according to claim 7 further comprising at least one spring extending between said support and said stage for suspending said stage adjacent said support and above the reference surface.

14. A microelectromechanical positioning apparatus comprising:

a reference surface;

a support disposed in a fixed position relative to the reference surface;

a stage having opposed first and second major surfaces and defining an XY plane, wherein said stage is suspended from said support and over at least a portion of the reference surface such that the first major surface faces the reference surface;

wherein said stage defines an elongate tongue portion; and

an actuator disposed on said elongate tongue portion of said stage such that actuation of said actuator bends said elongate tongue portion toward the underlying reference surface to thereby move said stage in a Z direction perpendicular to the XY plane.

15. A microelectromechanical positioning apparatus according to claim 14 further comprising at least one microelectromechanical actuator disposed in a fixed position relative to said support for controllably moving said stage in the XY plane.

16. A microelectromechanical positioning apparatus according to claim 15 wherein said microelectromechanical actuator comprises:

spaced apart anchors disposed in a fixed position relative to said support;

an arched beam extending between said spaced apart anchors;

an actuator member operably coupled to said arched beam and extending outwardly therefrom toward said stage; and

means for heating said arched beam to cause further arching of said beam such that said actuator member controllably positions said stage in the XY plane.

17. A microelectromechanical positioning apparatus according to claim 14 wherein a portion of the first major surface underlying said elongate tongue portion of said stage includes a recessed portion to thereby improve the flexibility of said elongate tongue portion.

18. A microelectromechanical positioning apparatus according to claim 14 wherein said actuator is a thermal bimorph structure comprised of first and second layers, and wherein said first layer has a larger coefficient of expansion than said second layer.

19. A microelectromechanical positioning apparatus according to claim 18 wherein the first layer of said actuator defines at least one slit.

20. A microelectromechanical positioning apparatus according to claim 14 further comprising at least one spring extending between said support and said stage for suspending said stage adjacent said support and above the reference surface.