Package for a magnetic field sensing device

• US 5,963,028 A
• Filed: 08/19/1997
• Issued: 10/05/1999
• Est. Priority Date: 08/19/1997
• Status: Expired due to Fees

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Vig, Ravi, Engel, Raymond W, Gagnon, Jay Gagnon J
• Primary Examiner(s): STRECKER, GERARD R
• Application Number:
  US08/916,746
• Time in Patent Office: 777 Days
• Field of Search: 324/173, 324/174, 324/207.2, 324/207.21, 324/207.25, 324/207.26, 324/235, 324/251, 324/252, 29/595, 73/514.39, 360/113, 338/32 R, 338/32 H, 174/52.2, 264/272.11, 264/272.14, 264/272.15, 264/272.17, 123/406.58, 123/617, 188/181 R, 303/138
• US Class Current: 324/207.2
• CPC Class Codes: G01R 33/07 Hall effect devices
• CPC Class Codes: G01V 3/08 operating with magnetic or electric fields produced or modified by objects or geological structures or by detecting devices with electromagnetic waves G01V3/12
• CPC Class Codes: Y10T 29/49007 Indicating transducer

Abstract

A magnetic field sensor assembly has a magnet, a semiconductor sensor and a metal leadframe encapsulated in a plastic package to form a semiconductor integrated circuit. A metal leadframe has a die attach pad on which the sensor is secured and an assembly having one or more projections for securing the magnet in close proximity to the sensor. The leadframe is made from a metal having sufficient spring tension so that the assembly having the projections will secure the magnet. The sensor is adjacent to a ferromagnetic object and will detect a change in magnetic field caused by the ferromagnetic object. Only a thin layer of the plastic package covers the sensor thus reducing the distance between the sensor and the ferromagnetic object but still maintaining an air gap between the plastic package and the ferromagnetic object sufficient to allow passage of the ferromagnetic object.

Claims

1. A magnetic field sensor assembly comprising:

a magnet for creating a magnetic field,

an unencapsulated semiconductor sensor located within said magnetic field for sensing the strength of said magnetic field, said sensor adapted to allow the detection of a ferromagnetic object passing through said magnetic field,

a metal leadframe having a die attach pad on which said sensor is secured and an assembly for securing said magnet in close proximity to said sensor, and said magnet, sensor and leadframe assembled to form a semiconductor integrated circuit encapsulated in a plastic package in one molding operation said assembly for securing said magnet having one or more projections to secure said magnet.

2. The magnetic field sensor assembly of claim 1 in which said leadframe is made from a metal having sufficient spring tension so that said assembly for securing said magnet will secure said magnet.

3. The magnetic field sensor assembly of claim 2 in which said magnet is press fitted into said one or more projections to be secured.

4. A magnetic field sensor assembly comprising:

a magnet for creating a magnetic field,

an unencapsulated semiconductor sensor located within said magnetic field for sensing the strength of said magnetic field, said sensor adapted to allow the detection of a ferromagnetic object passing through said magnetic field, said sensor having one or more magnetic field sensing elements.

a metal leadframe having a die attach pad on which said sensor is secured and an assembly for securing said magnet in close proximity to said sensor, and said magnet, sensor and leadframe assembled to form a semiconductor integrated circuit encapsulated in a plastic package in one molding operation said assembly for securing said magnet having one or more projections to secure said magnet.

5. The magnetic field sensor assembly of claim 4 in which one or more magnetic field sensing elements are Hall effect elements.

6. The magnetic field assembly of claim 5 in which said multiple magnetic field sensing elements are adapted to detect the edges of said ferromagnetic objects.

7. A magnetic field sensor assembly comprising:

a magnet for creating a magnetic field,

an unencapsulated semiconductor sensor located within said magnetic field for sensing the strength of said magnetic field, said sensor adapted to allow the detection of a ferromagnetic object passing through said magnetic field,

a metal leadframe having a die attach pad on which said sensor is secured and an assembly having one or more projections making tensional contact with said magnet for securing said magnet in close proximity to said sensor, said leadframe made from a metal having sufficient spring tension so that said assembly having one or more projections will secure said magnet,

said magnet, sensor and leadframe encapsulated in a plastic package in one molding operation to form a semiconductor integrated circuit in which a thin layer of said plastic package covers said sensor, said sensor adapted to be adjacent to said ferromagnetic object, said sensor so dimensioned from said ferromagnetic object to reduce the distance between said sensor and said ferromagnetic object and to maintain an air gap between said plastic package and said ferromagnetic object to allow passage of said ferromagnetic object.

8. The magnetic field assembly of claim 7 in which said semiconductor sensor has one or more Hall effect magnetic field sensing elements.