Apparatus and method for in-situ monitoring of chemical mechanical polishing operations

• US 5,964,643 A
• Filed: 02/22/1996
• Issued: 10/12/1999
• Est. Priority Date: 03/28/1995
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Pyatigorsky, Grigory, Birang, Manoocher
• Primary Examiner(s): Eley, Timothy V.
• Assistant Examiner(s): Banks, Derris Holt
• Application Number:
  US08/605,769
• Time in Patent Office: 1,328 Days
• Field of Search: 451/6, 451/7, 451/285-289, 451/5, 156/636.1, 156/626, 437/7, 437/225
• US Class Current: 451/6
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 37/205 provided with a window for inspecting the surface of the work being lapped
• CPC Class Codes: B24B 47/12 by mechanical gearing or electric power B24B47/16 takes precedence
• CPC Class Codes: B24B 49/04 involving measurement of the workpiece at the place of grinding during grinding operation
• CPC Class Codes: B24B 49/12 involving optical means
• CPC Class Codes: B24B 51/00 Arrangements for automatic control of a series of individual steps in grinding a workpiece if applicable to other machine tools, G05B takes precedence
• CPC Class Codes: G01B 11/06 for measuring thickness ; e.g. of sheet material thickness measurement by thermal means G01B21/085
• CPC Class Codes: G01B 11/0683 measurement during deposition or removal of the layer

Abstract

An in-situ method of measuring uniformity of a layer on a substrate during polishing of said layer, where the method includes the steps of directing a light beam toward the layer during polishing; monitoring an interference signal produced by the light beam reflecting off of the substrate; and computing a measure of uniformity from the interference signal.

Claims

1. A substrate polishing system comprising:

a platen which during processing holds a polishing pad;

a polishing head which during processing holds the substrate against the polishing pad on the platen;

an interferometer capable of generating a collimated light beam which during processing is directed at and impinges on a side of said substrate that is being polished, said interferometer generating an interference signal; and

a data processor programmed to compute a measure of uniformity from said interference signal.

2. The polishing system of claim 1 wherein said polishing head is rotatable so that it rotates during processing.

3. The polishing system of claim 2 wherein said platen is rotatable so that it rotates during processing.

4. The polishing system of claim 3 wherein said interferometer is a laser interferometer.

5. The polishing system of claim 3 wherein said data processor is further programmed to:

extract feature information from said interference signal; and

compute said measure of uniformity from said extracted feature information.

6. The polishing system of claim 5 wherein said data processor is further programmed to:

compare said measure of uniformity to a reference; and

generate an alert when said measure of uniformity diverges from the reference by more than a predetermined amount.

7. The polishing system of claim 6 wherein said interference signal includes a low frequency component and wherein said data processor is programmed to extract feature information by:

measuring a first characteristic of said low frequency component; and

deriving said extracted information from said first characteristic.

8. The polishing system of claim 7 wherein said interference signal includes a high frequency component and wherein said data processor is programmed to extract feature information by:

measuring a second characteristic of said high frequency signal; and

deriving said extracted information from said first and second characteristics.

9. The polishing system of claim 8 wherein said first characteristic is an amplitude of said high frequency signal and said second characteristic is an amplitude of said low frequency signal, and wherein said data processor is programmed to derive said extracted information by computing a ratio of the amplitudes of said high and low frequency signals.

10. An apparatus for polishing a substrate, said apparatus comprising:

a platen which during processing holds a polishing pad, said platen including a passage therethrough;

a polishing head which during processing holds the substrate against the polishing pad on the platen; and

an interferometer capable of generating a collimated light beam, said interferometer arranged to direct said light beam at least during part of the polishing operation through said passage so that it impinges on said substrate;

a window aligned with said passage and through which the light beam passes on its way to the substrate, said window having a diffuse surface receiving the arriving light beam from the interferometer.

11. The apparatus of claim 10 further comprising the polishing pad mounted on said platen and wherein said window is formed in said polishing pad and is aligned with said passage.

12. A substrate polishing system comprising:

a platen which during a polishing operation holds a polishing pad;

a polishing head which during the polishing operation holds the substrate against the polishing pad on the platen;

an interferometer capable of generating a collimated light beam which during the polishing operation is directed at and impinges on a side of said substrate that is being polished, said interferometer generating an interference signal, wherein the interference signal at least for some part of the polishing operation has an amplitude that is cyclical in nature;

a display device; and

a processor which during the polishing operation receives the interference signal and is programmed to generate therefrom a characterizing waveform which characterizes the polishing operation, said processor further programmed to display the characterizing waveform on the display device for an operator to see, said characterizing waveform presenting data for a period of time that extends over multiple cycles of the interference signal.

13. The polishing system of claim 12 wherein said polishing head is rotatable so that it rotates during processing.

14. The polishing system of claim 13 wherein said platen is rotatable so that it rotates during processing.

15. The polishing system of claim 14 wherein said interferometer is a laser interferometer.