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Method for producing encapsulated nanoparticles and carbon nanotubes using catalytic disproportionation of carbon monoxide and the nanoencapsulates and nanotubes formed thereby

  • US 5,965,267 A
  • Filed: 03/31/1998
  • Issued: 10/12/1999
  • Est. Priority Date: 02/17/1995
  • Status: Expired due to Fees
First Claim
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1. A thermal composite comprising:

  • a semiconductor component and a heat sink substrate; and

    an adhesive layer adhering said semiconductor component to said heat sink substrate, wherein said adhesive layer contains an adhesive and closed carbon nanotubes;

    wherein said closed carbon nanotubes provide a thermal bridge between said semiconductor component and said heat sink substrate.

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