Polymeric compositions having a temperature-stable dielectric constant

• US 5,965,273 A
• Filed: 01/31/1997
• Issued: 10/12/1999
• Est. Priority Date: 01/31/1997
• Status: Expired due to Term

• Current Assignee: CNA Holdings Incorporated (Celanese Corporation)
• Original Assignee: Hoechst Celanese Corporation (Sanofi )
• Inventors: Walpita, Lakshaman M., Ahern, Michael R.
• Primary Examiner(s): Resan, Stevan A.
• Application Number:
  US08/792,333
• Time in Patent Office: 984 Days
• Field of Search: 428/457, 428/458, 428/460, 428/461, 428/469, 428/471, 428/212, 428/323, 428/325, 428/327, 428/901, 428/421, 428/459, 428/446, 428/402, 428/500, 428/689, 428/328, 106/600, 106/902, 106/287.35, 106/400, 106/413, 106/823, 106/286.4, 526/160, 361/321.1, 361/321.5, 361/750, 252/518, 252/520, 252/500, 264/239
• US Class Current: 428/457
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2307/204 Di-electric
• CPC Class Codes: B32B 2311/12 Copper
• CPC Class Codes: B32B 2386/00 Specific polymers obtained by polycondensation or polyaddition not provided for in a single one of index codes B32B2363/00 - B32B2383/00
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 3/00 Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
• CPC Class Codes: H01B 3/301 Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/015 Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/252 Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
• CPC Class Codes: Y10T 428/256 Heavy metal or aluminum or compound thereof
• CPC Class Codes: Y10T 428/31678 Of metal
• CPC Class Codes: Y10T 428/31692 : Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31855 : Of addition polymer from unsaturated monomers

Abstract

A polymeric composition which has a dielectric constant K'"'"' greater than 4 at 20° C. which varies little with temperature is made from a polymer or mixture of polymers and a ceramic or a mixture of ceramics, where the polymer or mixture of polymers has a dielectric constant K'"'"' in the range of about 1.5 to about 3.5 and a temperature coefficient of dielectric constant TCK'"'"' that is negative and is between 0 and about -300 ppm/degree C.; and the ceramic includes a first ceramic, which may be one ceramic or a mixture of ceramics, each having a dielectric constant in the range of about 15 to about 200 and a TCK'"'"' that is positive and is between zero and about 3000 ppm/degree C.; and an optional second ceramic, which may be one ceramic or a mixture of ceramics, each having a dielectric constant in the range from about 3 up to about 15 and a TCK'"'"' that is positive and is between zero and about 300 ppm/degree C.

Claims

1. A polymeric composition having a temperature-stable dielectric constant, consisting essentially of:

(a) a polymer having a dielectric constant K'"'"' in the range of about 1.5 to about 3.5 and a temperature coefficient of dielectric constant TCK'"'"' less than 0 but greater than about -300 ppm/degree C., wherein said polymer is selected from the group consisting of poly(phenylene sulfide), cycloolefinic copolymer, and mixtures thereof,

(b) a first ceramic, consisting of one or more ceramics selected from the group consisting of calcium zirconate, strontium zirconate, CaTiSiO₅,PbZrO₃. zirconia and mixtures thereof, each having a dielectric constant in the range of about 15 to about 200 and a TCK'"'"' greater than zero up to about 3000 ppm/degree C.; and

(c) an optional second ceramic, consisting of one or more ceramics selected from the group consisting of aluminum oxide, magnesium titanate, mica, silicon dioxide, beryllia, spinel, and thoria, each having a dielectric constant in the range of about 3 to about 15 and a TCK'"'"' greater than zero up to about 300 ppm/degree C.;

wherein the amounts of said polymer and said first and second ceramics are balanced so that the dielectric constant of the composition is greater than 4 and the dielectric constant of said composition varies by no more than 2% above or below the mean value of the dielectric constant in the temperature range from -50°

C. to a higher temperature that is the lesser of 80°

C. and 10°

C. less than the glass transition temperature of said polymeric composition;

wherein said values of K'"'"' and TCK are measured at 2.0 GHz frequency, and said value of K'"'"' is measured at 20°

C.

2. A polymeric composition as recited in claim 1, wherein said first ceramic has a TCK'"'"' greater than zero up to about 300 ppm/degree C., and said second ceramic has a TCK'"'"' greater than zero up to about 200 ppm/degree C.

3. A polymeric composition as recited in claim 1, wherein the dielectric constant of said composition varies by no more than 1% above or below the mean value of the dielectric constant of said composition in the range from -50°

C. to a higher temperature that is the lesser of 80°

C. and 10°

C. less than the glass transition temperature of said polymeric composition.

4. A polymeric composition as recited in claim 1, wherein the dielectric constant of said composition varies by no more than 0.5% above or below the mean value of the dielectric constant in the range from -50°

C. to a higher temperature that is the lesser of 80°

C. and 10°

C. less than the glass transition temperature of said polymeric composition.

5. The polymeric composition as recited in claim 1, wherein said first ceramic is included in an amount of about 2% to about 60% by volume and said optional second ceramic is included in an amount up to about 50% by volume.

6. The polymeric composition as recited in claim 1, wherein said first ceramic is calcium zirconate and said optional second ceramic is selected from the group consisting of mica, aluminum oxide, silicon dioxide, magnesium titanate and mixtures thereof.

7. The polymeric composition as recited in claim 6, wherein said optional second ceramic is not included in said composition.

8. A laminate having a temperature-stable dielectric constant, comprising:

(a) a flat substrate comprising the polymeric composition of claim 1, said substrate having two surfaces; and

(b) a layer of metal adhering to at least one surface of said substrate;

wherein the dielectric constant of said laminate is at least 4.0 at 2.0 GHz frequency and 20°

C., wherein the dielectric constant of said laminate does not vary by more than 2% above or below the mean value of the dielectric constant of said laminate measured over the temperature range from -50°

C. to a higher temperature that is the lesser of 80°

C. and 10°

C. less than the glass transition temperature of said polymeric composition.

9. A laminate as recited in claim 8, wherein said metal is copper.

10. A multichip module comprising the polymeric composition of claim 1.

11. A three-dimensional article comprising the polymeric composition of claim 1 and one or more layers of metal.

12. A polymeric composition having a temperature-stable dielectric constant, comprising:

(a) poly(phenylene sulfide);

(b) a first ceramic material selected from the group of ceramic materials consisting of calcium zirconate, strontium zirconate, CaTiSiO₅, PbZrO₃, zirconia, and mixtures thereof; and

(c) an optional second ceramic material selected from the group consisting of aluminum oxide, magnesium titanate, mica, silicon dioxide, beryllia, spinel, thoria, and mixtures thereof;

wherein the amounts of said polymer, said first ceramic, and said optional second ceramic are balanced so that said composition has a dielectric constant greater than 4, and the dielectric constant of said composition varies by not more than 2% above or below the mean value of the dielectric constant of said composition in the temperature range of -50°

C. to 80°

C.;

wherein said values of K'"'"' and TCK'"'"' are measured at 2.0 GHz frequency, and said value of K'"'"' is measured at 20°

C.

13. The polymeric composition as recited in claim 12, wherein said first ceramic is included in an amount of about 2% to about 60% by volume and said second ceramic is included in an amount up to about 50% by volume.

14. The polymeric composition as recited in claim 13, wherein said first ceramic is calcium zirconate and said second ceramic is selected from the group consisting of mica, aluminum oxide, silicon dioxide, magnesium titanate and mixtures thereof.

15. The polymeric composition as recited in claim 13, wherein said first ceramic is calcium zirconate, and said second ceramic is not present.

16. A laminate having a temperature-stable dielectric constant, comprising:

(a) a flat substrate comprising the polymeric composition of claim 12, said substrate having two surfaces; and

(b) a layer of metal adhering to at least one surface of said substrate;

wherein the dielectric constant of said laminate is at least 4.0 at 2.0 GHz frequency and 20°

C., wherein the dielectric constant of said laminate does not vary by more than 2% above or below the mean value of the dielectric constant of said laminate measured over the temperature range from -50°

C. to 80°

C.

17. A laminate as recited in claim 16, wherein said metal is copper, said copper adhering to both surfaces of said substrate.