Resin composition and resin-molded type semiconductor device

• US 5,965,663 A
• Filed: 05/24/1996
• Issued: 10/12/1999
• Est. Priority Date: 06/06/1995
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Hayase, Rumiko
• Primary Examiner(s): YOON, TAE H
• Application Number:
  US08/653,467
• Time in Patent Office: 1,236 Days
• Field of Search: 524/609, 524/611, 524/534-537, 525/391
• US Class Current: 524/609
• CPC Class Codes: C08G 2261/312 Non-condensed aromatic systems, e.g. benzene
• CPC Class Codes: C08G 75/23 Polyethersulfones
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 71/00 Compositions of polyethers obtained by reactions forming an ether link in the main chain of polyacetals C08L59/00; of epoxy resins C08L63/00; of polythioether-ethers C08L81/02; of polyether-sulfones C08L81/06; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 81/06 Polysulfones; Polyethersulfones
• CPC Class Codes: H01B 3/427 Polyethers

Abstract

A resin composition comprising (a) polyarylene polyether represented by the general formula of Z₁ -(polyarylene polyether) chain-Z₁ '"'"' (wherein Z₁ and Z₁ '"'"' denote individually a monovalent organic group containing a cross-linkable unsaturated carbon-carbon linkage), and (b) an inorganic filler.

Claims

1. A resin composition comprising:

(a) polyarylene polyether represented by the general formula of Z₁ -(polyarylene polyether) chain-Z_1'"'"' wherein Z₁ and Z_1'"'"' denote individually a monovalent organic group containing a cross-linkable unsaturated carbon-carbon linkage;

(b) an inorganic filler; and

(c) a compound containing at least one organic group having a cross-linkable unsaturated carbon-carbon linkage in its molecule, said compound having a molecular weight of 5,000 or less;

wherein the content of alkaline metal in said (a) component is 50 ppm or less, and the content of halogen in said (a) component is 500 ppm or less.

2. The resin composition according to claim 1, wherein a melting point of said (c) component is 200°

C. or less.

3. The resin composition according to claim 1, which further comprises an adhesion-promoting agent.

9. The resin composition according to claim 1, wherein said inorganic filler is at least one selected from the group consisting of quartz glass, crystalline silica, fused silica, zircon, alumina, calcium silicate, barium sulfate, magnesite, clay, kaolin, talc, mica, glass fibers, ceramic fibers, silicon carbide, silicon nitride, aluminum nitride, titanium white, calcium carbonate, and gypsum.

11. The resin composition according to claim 9, wherein said inorganic filler is selected from the group consisting of alumina and silicon.

12. The resin composition of claim 1, wherein said inorganic filler is present in an amount of 40-95 parts by weight per 100 parts by weight of the entire resin composition.

13. The resin composition according to claim 1, which further comprises an adhesion-promoting agent.

4. A resin composition for sealing a semiconductor chip, comprising:

(a) a polyarylene polyether represented by the general formula of Z₁ -(polyarylene polyether) chain-Z_1'"'"' wherein Z₁ and Z_1'"'"' denote individually a monovalent organic group containing a cross-linkable unsaturated carbon-carbon linkage; and

(b) an inorganic filler,

wherein a content of alkaline metal in said (a) component is 50 ppm or less, and a content of halogens in said (b) component is 500 ppm or less.

5. The resin composition according to claim 4, which further comprises a maleimide resin.

6. The resin composition according to claim 5, which further comprises a curing agent for the maleimide resin.

7. The resin composition according to claim 4, which further comprises an adhesion-promoting agent.

8. The resin composition according to claim 4, wherein said inorganic filler is at least one selected from the group consisting of quartz glass, crystalline silica, fused silica, zircon, alumina, calcium silicate, barium sulfate, magnesite, clay, kaolin, talc, mica, glass fibers, ceramic fibers, silicon carbide, silicon nitride, aluminum nitride, titanium white, calcium carbonate, and gypsum.

10. The resin composition according to claim 8, wherein said inorganic filler is selected from the group consisting of alumina and silicon.

14. The resin composition according to claim 4, wherein said inorganic filler is present in an amount of 80-95 parts by weight of the entire resin composition.