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Resin composition and resin-molded type semiconductor device

  • US 5,965,663 A
  • Filed: 05/24/1996
  • Issued: 10/12/1999
  • Est. Priority Date: 06/06/1995
  • Status: Expired due to Fees
First Claim
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1. A resin composition comprising:

  • (a) polyarylene polyether represented by the general formula of Z1 -(polyarylene polyether) chain-Z1'"'"' wherein Z1 and Z1'"'"' denote individually a monovalent organic group containing a cross-linkable unsaturated carbon-carbon linkage;

    (b) an inorganic filler; and

    (c) a compound containing at least one organic group having a cross-linkable unsaturated carbon-carbon linkage in its molecule, said compound having a molecular weight of 5,000 or less;

    wherein the content of alkaline metal in said (a) component is 50 ppm or less, and the content of halogen in said (a) component is 500 ppm or less.

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