Photoelectric conversion device having flexible cable fixed to chassis

• US 5,965,872 A
• Filed: 06/30/1998
• Issued: 10/12/1999
• Est. Priority Date: 02/22/1996
• Status: Expired due to Term

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Mochizuki, Chiori, Watanabe, Minoru, Takeda, Shinichi, Endo, Tadao, Morishita, Masakazu, Hayashi, Shinichi, Tamura, Toshikazu, Takami, Eiichi, Tago, Akira, Funakoshi, Akira
• Primary Examiner(s): ALLEN, STEPHONE B
• Application Number:
  US09/107,283
• Time in Patent Office: 469 Days
• Field of Search: 250/208.1, 250/484.2, 257/712, 257/469, 257/720, 257/706, 257/707, 378/28, 378/141, 378/142, 378/143, 358/471
• US Class Current: 250/208.1
• CPC Class Codes: H01L 27/1446 in a repetitive configuration
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14663 Indirect radiation imagers, e.g. using luminescent members
• CPC Class Codes: H01L 27/14676 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/02 Details
• CPC Class Codes: H01L 31/02322 comprising luminescent members, e.g. fluorescent sheets upon the device
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 31/085 the device being sensitive to very short wavelength, e.g. X-ray, Gamma-rays
• CPC Class Codes: H01L 31/115 Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
• CPC Class Codes: H04N 5/32 Transforming X-rays cameras or camera modules for generating image signals from X-rays H04N23/30; circuitry of SSIS for transforming X-rays into image signals H04N25/30

Abstract

In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

Claims

1. A photoelectric conversion device comprising:

photoelectric conversion means having plural pixels arranged two-dimensionally;

a chassis; and

a flexible cable fixed to said chassis transmitting an electric signal to an integrated circuit for processing from said photoelectric conversion means.

2. A device according to claim 1, said chassis housing said photoelectric conversion means.

3. The device according to claim 1, having the integrated circuit on the flexible cable.

4. A device according to claim 1, said flexible cable being fixed to said chassis through said integrated circuit.

5. A device according to claim 4, said flexible cable being fixed to said chassis through a heat conductor.

6. A device according to claim 1, said integrated circuit contacting and being capable of conducting heat to said chassis.

7. A device according to claim 6, said integrated circuit being fixed to said chassis through a heat conductor.

8. A device according to claim 7, said heat conductor operating to fix said integrated circuit to said chassis.

9. A photoelectric conversion device comprising:

photoelectric conversion means having a two-dimensional light-receiving region;

a chassis;

a flexible cable for transmitting an electrical signal from said photoelectric conversion means to a processing circuit; and

an integrated circuit element provided on said flexible cable,

wherein said flexible cable is arranged fixedly to said chassis at the portion of provision of said integrated circuit element thereof.

10. The device according to claim 9, wherein said integrated circuit element is for processing the signal from said photoelectric conversion means.

11. The device according to claim 10, wherein said two-dimensional light-receiving region comprises a plurality of light-receiving elements arranged in a matrix array.