Micromechanical memory sensor

• US 5,966,066 A
• Filed: 06/04/1997
• Issued: 10/12/1999
• Est. Priority Date: 06/10/1994
• Status: Expired due to Fees

• Current Assignee: Case Western Reserve University
• Original Assignee: Case Western Reserve University
• Inventors: Goldman, Kenneth G., Dhuler, Vijayakumar R., Mehregany, Mehran
• Primary Examiner(s): SCOTT, JAMES R
• Application Number:
  US08/868,705
• Time in Patent Office: 860 Days
• Field of Search: 337/2, 337/3, 337/13, 337/36, 337/40, 337/41-50, 337/70-78, 337/85, 337/123-129, 337/140, 337/298, 337/333-340, 337/356-359, 307/112, 307/116, 257/414-420, 257/798
• US Class Current: 337/70
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/0891 with indication of predetermined acceleration values G01P15/135 takes precedence
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2001/0047 operable only by mechanical latching
• CPC Class Codes: H01H 2037/008 Micromechanical switches operated thermally
• CPC Class Codes: H01H 2061/006 Micromechanical thermal relay
• CPC Class Codes: H01H 35/14 Switches operated by change of acceleration, e.g. by shock or vibration, inertia switch wherein the liquid constitutes a contact of the switch H01H29/002
• CPC Class Codes: H01H 35/34 actuated by diaphragm
• CPC Class Codes: H01H 37/52 actuated due to deflection of bimetallic element
• CPC Class Codes: H01H 37/74 Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
• CPC Class Codes: H01H 61/02 wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively

Abstract

A micromechanical memory sensor. The sensor comprises a latch member mechanically latching upon detection of a threshold value of a variable condition and circuitry for detecting such latching. A sensor further includes a resetting mechanism for electrically unlatching the latch member whereby the sensor latched purely mechanically is electrically reset for repeat use.

Claims

1. A micromechanical sensor comprising:

a mechanical latch being latched upon detection of a threshold value of a variable temperature condition, latching occurring by movement of components of the latch induced by the variable temperature condition;

a readout mechanism operatively connected to the latch for detecting whether the latch is latched; and

a resetting mechanism operatively connected to the latch electrically unlatching the latch by inducing movement of the components electrically whereby the sensor latched purely mechanically is electrically reset for repeat use.

2. A micromechanical memory sensor comprising:

a latch member having a sensing mechanism and a resetting mechanism mechanically latching upon detection of a predetermined temperature extreme;

a readout mechanism operatively connected to the latch member for detecting whether the latch member is latched, and,

a mechanism operatively connected to the latch member for electrically resetting the latch member.

3. A micromechanical memory sensor comprising:

a first beam supported at a first end thereof by a first support and having a second end;

a second beam supported at a first end thereof by a second support and having a second end having flexibility greater than the first beam, the first and second beam being disposed in a first arrangement so that the second end of the second beam engages a first surface of the first beam at the second end of the first beam,

an increase in ambient temperature facilitating a first deflection in the first beam and a second deflection in the second beam in accordance with the difference in the flexibility of the first and second beams, and,

a decrease in the ambient temperature facilitating movement of the first and second beams to a second arrangement, the second beam engaging a second surface of the first beam in the second arrangement so that the second beam is latched on the first beam;

a readout mechanism positioned on the sensor to detect whether the second beam is latched on the first beam; and

,

a means for electrically resetting the first and second beams to the first arrangement.

4. A micromechanical memory sensor comprising:

a first beam formed of a first material having a first thermal coefficient of expansion and a second material having a second thermal coefficient of expansion, the second coefficient being different than the first coefficient, the first and second materials being disposed in layers having a terminal end and formed on a substrate, the substrate extending beyond the terminal end; and

,

a second beam having flexibility greater than the first beam disposed in a first arrangement such that the second beam opposes a first surface of the substrate, the second beam being formed of the first material and the second material,

an increase in ambient temperature facilitating a first deflection in the first beam and a second deflection in the second beam in accordance with the difference in the first and second coefficients and the flexibility of the first and second beams, and,

a decrease in the ambient temperature facilitating movement of the first and second beams to a second arrangement, the second beam engaging a second surface of the substrate in the second arrangement so that the second beam is latched on the first beam; and

,

a means for electrically resetting the first and second beams to the first arrangement.