Semiconductor thermal conditioning apparatus and method

• US 5,966,940 A
• Filed: 11/18/1997
• Issued: 10/19/1999
• Est. Priority Date: 11/18/1997
• Status: Expired due to Fees

• Current Assignee: MCT Worldwide, LLC
• Original Assignee: Micro Component Technology, Inc.
• Inventors: Miller, Steve, Frost, Kevin, Uekert, Ken, Kingery, John, Gower, Roger, Guthrie, J. Cameron
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): Jones, Melvin
• Application Number:
  US08/972,312
• Time in Patent Office: 700 Days
• Field of Search: 62/3.3, 62/3.7, 62/62
• US Class Current: 62/3.3
• CPC Class Codes: F25B 21/04 reversible
• CPC Class Codes: G01R 31/01 Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station testing of cables continuously passing the testing apparatus G01R31/59; testing dielectric strength or breakdown voltage G01R31/12
• CPC Class Codes: G01R 31/2865 Holding devices, e.g. chucks; Handlers or transport devices having contacts G01R31/2863
• CPC Class Codes: G01R 31/2874 related to temperature
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus for thermally conditioning a semiconductor unit is provided which includes a surface plate for receiving the semiconductor unit thereon which is connected to a thermoelectric device and a closed loop heat exchanger. At least one temperature sensor is disposed adjacent the surface plate for sensing the temperature of the surface plate. The thermoelectric device has first and second sides with the first side disposed against the surface plate. The closed loop heat exchanger is coupled to the second side of the thermoelectric device. The closed loop heat exchanger includes a chamber or cavity having an inlet and an outlet with the chamber disposed adjacent the second side of the thermoelectric device. The closed loop heat exchanger further includes conduit connected to the inlet and outlet of the chamber and a heat transfer unit connected to the conduit opposite the chamber. Heat transfer fluid is contained within the closed loop heat exchanger and a pump is provided for pumping the heat transfer fluid through the closed loop heat exchanger wherein the heat transfer unit transfers heat to or from the heat transfer fluid to control the temperature of the heat transfer fluid. The thermoelectric device transfers heat to or from the surface plate to thermally condition the semiconductor unit disposed on the surface plate while the closed loop heat exchanger transfers heat to or from the second side of the thermoelectric device which increases the range of temperature under which the semiconductor unit may be thermally conditioned.

Claims

1. An apparatus for thermal conditioning of a semiconductor unit comprising:

a surface plate for receiving the semiconductor unit thereon;

at least one temperature sensor for sensing the temperature of the surface plate;

a thermoelectric device having first and second sides with the first side disposed against the surface plate;

a closed loop heat exchanger coupled to the second side of the thermoelectric device including;

a chamber having an inlet and an outlet, the chamber disposed to and in connection with the second side of the thermoelectric device, conduit connected to the inlet and outlet of the chamber, a heat transfer unit connected to the conduit opposite the chamber, a heat transfer fluid contained within the chamber, conduit and heat transfer unit, and a pump connected to the conduit for pumping the heat transfer fluid through the closed loop heat exchanger, wherein the heat transfer unit transfers heat to or from the heat transfer fluid to control the temperature of the heat transfer fluid,

wherein the thermoelectric device transfers heat to or from the surface plate to thermally condition the semiconductor device disposed on the surface plate and the closed loop heat exchanger transfers heat to or from the second side of the thermoelectric device to increase the range of temperature under which the semiconductor unit may be thermally conditioned by the surface plate.

2. An apparatus according to claim 1 wherein the temperature sensor is coupled to a temperature control unit wherein the temperature control unit is capable of bringing the surface plate to a specified temperature and wherein the temperature control unit receives input from the temperature sensor of the temperature of the surface plate and the temperature control unit then provides energy to the thermoelectric device to bring the temperature of the surface plate to the specified temperature.

3. An apparatus according to claim 1 wherein the heat transfer unit comprises a chiller unit which can control the temperature of the heat transfer fluid flowing through the closed loop heat exchanger from -40 degrees Celsius to +60 degrees Celsius.

4. An apparatus according to claim 1 wherein the thermoelectric device coupled with the closed loop heat exchanger is able to vary the temperature of the surface plate from -40 degrees Celsius to +125 Celsius and maintain the surface plate at a temperature within that range.

5. An apparatus for thermally conditioning a semiconductor unit comprising:

a thermal conditioning block having a base with an upper surface and including a surface plate disposed to and in connection with the upper surface of the base for receiving the semiconductor unit thereon, at least one temperature sensor for sensing the temperature of the surface plate, and at least one thermoelectric device disposed on the base of the thermal conditioning block beneath the surface plate, the thermoelectric device transferring heat to or from the surface plate to thermally condition the semiconductor unit disposed on the surface plate of the thermal conditioning block through conduction from the surface plate, the base of the thermal conditioning block defining a cavity which is located to and in connection with the thermoelectric device opposite the surface plate with the cavity having an inlet and outlet; and

a heat transfer unit coupled to inlet and outlet of the cavity in the base of the thermal conditioning block wherein a heat transfer fluid is circulated through the cavity in the base of the thermal conditioning block to transfer heat to or from the thermoelectric device and the heat transfer unit transfers heat to or from the heat transfer fluid to control the temperature of the heat transfer fluid.

6. The apparatus according to claim 5 wherein the heat transfer unit constitutes a low temperature industrial chiller.

7. The apparatus according to claim 6 wherein a plurality of thermoelectric devices are disposed beneath the surface plate in the base of the thermal conditioning block for transferring heat to and from the surface plate to thermally condition the semiconductor unit disposed on the surface plate.

8. A system for controlling the temperature of a semiconductor unit at a specified temperature, comprising:

a surface plate for receiving the semiconductor unit thereon having at least one temperature sensor disposed within the surface plate for sensing the temperature of the surface plate;

a thermoelectric device having first and second sides with the first side disposed against the surface plate;

a closed loop heat exchanger coupled to the second side of the thermoelectric device including;

a chamber having an inlet and an outlet, the chamber disposed to and in connection with the second side of the thermoelectric device, conduit connected to the inlet and outlet of the chamber, a heat transfer unit connected to the conduit opposite the chamber, a heat transfer fluid contained within the chamber, conduit and heat transfer unit, and a pump connected to the conduit for pumping the heat transfer fluid through the closed loop heat exchanger, wherein the heat transfer unit transfers heat to or from the heat transfer fluid to control the temperature of the heat transfer fluid,

wherein the thermoelectric device transfers heat to or from the surface plate to thermally condition the semiconductor unit disposed on the surface plate and the closed loop heat exchanger transfers heat to or from the second side of the thermoelectric device to increase the range of temperature under which the semiconductor device may be thermally conditioned by the surface plate;

a temperature controller coupled to the temperature sensor and the thermoelectric device, wherein the temperature controller receives feedback information from the temperature sensor on the temperature of the surface plate and the temperature controller supplies power to the thermoelectric device to bring the temperature of the surface plate to the specified temperature and maintain the surface plate at the specified temperature; and

a computer controller coupled to the heat transfer unit of the closed loop heat exchanger and the temperature controller, wherein the computer controller receives an input of the specified temperature for the semiconductor unit and sets the temperature of the heat transfer fluid within the closed loop heat exchanger to bring the temperature of the surface plate to the specified temperature in conjunction with the thermoelectric device controlled by the temperature controller.

9. A system according to claim 8 wherein the temperature controller includes a high current servo amplifier for supplying power to the thermoelectric device, wherein the high current servo amplifier receives a control signal from the temperature controller based on the feedback received from the temperature sensor.

10. A system according to claim 8 wherein a plurality of thermoelectric devices are disposed against the surface plate and the thermoelectric devices are connected in series with the temperature controller.

11. A system according to claim 8 wherein a plurality of thermoelectric devices are disposed against the surface plate and the thermoelectric devices are connected in parallel with the temperature controller.

12. A method for thermally conditioning a semiconductor unit, comprising the steps of:

loading a semiconductor unit onto the surface plate of a thermal conditioning apparatus in which the surface plate is connected to a thermoelectric device coupled with a closed loop heat exchanger;

specifying a temperature to which the semiconductor device is to be thermally conditioned;

transferring heat to or from the thermoelectric device to the surface plate of the thermal conditioning apparatus while the closed loop heat exchanger transfers heat to or from the thermoelectric device to bring the surface plate to the specified temperature;

monitoring the temperature of the surface plate with a temperature sensor to determine when the surface plate has reached the specified temperature; and

maintaining the temperature of the surface plate at the specified temperature through the transfer of heat to or from the thermoelectric device to the surface plate so that the semiconductor unit on the surface plate is brought to the specified temperature through conduction from the surface plate.

13. The method of claim 12 further comprising the step of:

unloading the semiconductor unit from the surface plate of the thermal conditioning unit after the semiconductor unit has been brought to the specified temperature.