Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms

• US 5,966,941 A
• Filed: 12/10/1997
• Issued: 10/19/1999
• Est. Priority Date: 12/10/1997
• Status: Expired due to Term

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Ghoshal, Uttam Shyamalindu
• Primary Examiner(s): Doerrler, William
• Assistant Examiner(s): Jones, Melvin
• Application Number:
  US08/988,621
• Time in Patent Office: 678 Days
• Field of Search: 62/3.2, 62/3.3, 62/3.7, 62/188, 165/277
• US Class Current: 62/3.7
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/0212 of electric power, current or voltage
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H10N 10/00 Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects integrated devices or assemblies of multiple devices H10N19/00
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction

Abstract

Apparatus and method for sub-ambient cooling using thermoelectric element dynamics in conjunction with pulsed electrical power and selectively enabled thermal coupling to the cold sink. In one form, Peltier devices are dynamically enabled using pulses of electrical power while the thermal path between the cold side of the Peltier device and the cold sink is selectively switched in relative synchronism between conductive states responsive to the dynamics of the Peltier device temperatures. Switched coupling of the thermal connection between the cold sink and the Peltier device materially improves efficiency by decoupling Joule heating and conductive heat transfer losses otherwise conveyed from the Peltier device. Preferable implementations utilizes MEMS to accomplish the selective thermal switching, whereby sub-ambient cooling capacity is increased by parallel operation of multiple Peltier devices and MEMS switches.

Claims

1. A thermoelectric cooling apparatus, comprising:

a first thermal sink of a first nominal temperature;

a second thermal sink of a second nominal temperature, the second temperature being relatively greater than the first temperature;

a thermoelectric element continuously coupled to the second thermal sink;

means for selectively switching a thermal coupling of the thermoelectric element to the first thermal sink; and

means for selectively switching an electrical voltage across the thermoelectric element operable independent from the means for selectively switching the thermal coupling.

2. The apparatus recited in claim 1, wherein the second thermal sink is comprised of first and second electrically separated sections.

3. The apparatus recited in claim 2, wherein the means for selectively switching a thermal coupling and the means for selectively switching an electrical voltage are operable in functional synchronism.

4. The apparatus recited in claim 3, wherein the thermoelectric element is a Peltier device.

5. The apparatus recited in claim 4, wherein the means for selectively switching a thermal coupling is a microelectromechanical system (MEMS) device.

6. The apparatus recited in claim 5, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

7. The apparatus recited in claim 6, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

8. The apparatus recited in claim 5, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

9. The apparatus recited in claim 4, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

10. The apparatus recited in claim 9, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

11. The apparatus recited in claim 4, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

12. The apparatus recited in claim 3, wherein the means for selectively switching a thermal coupling is a microelectromechanical system (MEMS) device.

13. The apparatus recited in claim 12, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

14. The apparatus recited in claim 12, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

15. The apparatus recited in claim 3, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

16. The apparatus recited in claim 15, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

17. The apparatus recited in claim 3, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

18. The apparatus recited in claim 2, wherein the means for selectively switching a thermal coupling is a microelectromechanical system (MEMS) device.

19. The apparatus recited in claim 18, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

20. The apparatus recited in claim 2, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

21. The apparatus recited in claim 1, wherein the means for selectively switching a thermal coupling and the means for selectively switching an electrical voltage are operable in functional synchronism.

22. The apparatus recited in claim 21, wherein the thermoelectric element is a Peltier device.

23. The apparatus recited in claim 22, wherein the means for selectively switching a thermal coupling is a microelectromechanical system (MEMS) device.

24. The apparatus recited in claim 23, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

25. The apparatus recited in claim 22, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

26. The apparatus recited in claim 21, wherein the means for selectively switching a thermal coupling is a microelectromechanical system (MEMS) device.

27. The apparatus recited in claim 26, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

28. The apparatus recited in claim 21, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

29. The apparatus recited in claim 13, wherein the first and second electrically separate sections are coupled to a power supply through the means for selectively switching an electrical voltage.

30. The apparatus recited in claim 1, wherein the means for selectively switching a thermal coupling is a microelectromechanical system (MEMS) device.

31. A thermoelectric cooling apparatus, comprising:

a first thermal sink of a first nominal temperature;

a second thermal sink of a second nominal temperature, the second temperature being relatively greater than the first temperature;

a third thermal sink of the second nominal temperature, the third thermal sink being electrically separate from the second thermal sink;

a first thermoelectric element thermally coupled to the second thermal sink;

a second thermoelectric element thermally coupled to the third thermal sink;

means for selectively switching a thermal coupling of the first and second thermoelectric elements to the first thermal sink; and

means for selectively switching an electrical voltage across the first and second thermoelectric elements operable independent from the means for selectively switching the thermal coupling.

32. The apparatus recited in claim 31, wherein the means for selectively switching a thermal coupling and the means for selectively switching an electrical voltage are operable in functional synchronism.

33. The apparatus recited in claim 32, wherein the first and second thermoelectric elements are Peltier devices.

34. The apparatus recited in claim 33, wherein the first and second thermoelectric elements are of opposite and impurity type.

35. The apparatus recited in claim 34, wherein the means for selectively switching a thermal coupling is a microelectromechanical system (MEMS) device.

36. The apparatus recited in claim 35, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

37. The apparatus recited in claim 34, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

38. The apparatus recited in claim 33, wherein the means for selectively switching a thermal coupling is a microelectrical mechanical system (MEMS) device.

39. The apparatus recited in claim 38, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

40. The apparatus recited in claim 33, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

41. The apparatus recited in claim 32, wherein the means for selectively switching a thermal coupling is a microelectrical mechanical system (MEMS) device.

42. The apparatus recited in claim 41, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

43. The apparatus recited in claim 32, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

44. The apparatus recited in claim 31, wherein the means for selectively switching a thermal coupling is a microelectrical mechanical system (MEMS) device.

45. The apparatus recited in claim 44, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

46. The apparatus recited in claim 31, wherein the duty cycle of the means for selectively switching an electrical voltage correlates with the duty cycle of the means for selectively switching a thermal coupling.

47. A thermoelectric cooling apparatus operable in an ambient, comprising:

a first thermal sink means for dissipating thermal energy at a temperature above the ambient;

a second thermal sink means for absorbing thermal energy at a temperature below the ambient;

a first thermoelectric element coupled to the first thermal sink and coupled to the second thermal sink to transport thermal energy therebetween;

means for selectively switching the thermal conductance of the coupling between the first thermoelectric element and the second thermal sink; and

means for selectively enabling the first thermoelectric element independent of but in relative functional synchronism with the means for selectively switching the thermal conductance.

48. The apparatus recited in claim 47, wherein the means for selectively switching is a microelectromechanical system (MEMS) device.

49. The apparatus recited in claim 48, wherein the duty cycle of the means for selectively enabling correlates with the duty cycle of the means for selectively switching.

50. The apparatus recited in claim 49, wherein the dissipating of the thermal energy is into the ambient, and the absorbing of thermal energy is from a food refrigeration system.

51. The apparatus recited in claim 49, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from a vehicle occupant cooling system.

52. The apparatus recited in claim 49, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from an electronic integrated circuit device.

53. The apparatus recited in claim 48, wherein the dissipating of the thermal energy is into the ambient, and the absorbing of thermal energy is from a food refrigeration system.

54. The apparatus recited in claim 48, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from a vehicle occupant cooling system.

55. The apparatus recited in claim 48, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from an electronic integrated circuit device.

56. The apparatus recited in claim 47, wherein the first thermal sink means is comprised of first and second electrically separate sections.

57. The apparatus recited in claim 56, further comprising a second thermoelectric element, the first thermoelectric element being coupled to the first section of the first thermal sink means and the second thermoelectric element being coupled to the second section of the first thermoelectric element, and the second thermoelectric element also coupled to the means for selectively switching.

58. The apparatus recited in claim 56, wherein the dissipating of the thermal energy is into the ambient, and the absorbing of thermal energy is from a food refrigeration system.

59. The apparatus recited in claim 56, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from a vehicle occupant cooling system.

60. The apparatus recited in claim 56, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from an electronic integrated circuit device.

61. The apparatus recited in claim 57, wherein the means for selectively enabling switches a power supply connected across the first and second sections of the first thermal sink.

62. The apparatus recited in claim 57, wherein the dissipating of the thermal energy is into the ambient, and the absorbing of thermal energy is from a food refrigeration system.

63. The apparatus recited in claim 57, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from a vehicle occupant cooling system.

64. The apparatus recited in claim 57, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from an electronic integrated circuit device.

65. The apparatus recited in claim 61, wherein the means for selectively enabling switches a power supply connected across the first and second sections of the first thermal sink.

66. The apparatus recited in claim 61, wherein the dissipating of the thermal energy is into the ambient, and the absorbing of thermal energy is from a food refrigeration system.

67. The apparatus recited in claim 61, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from a vehicle occupant cooling system.

68. The apparatus recited in claim 61, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from an electronic integrated circuit device.

69. The apparatus recited in claim 65, wherein the means for selectively enabling switches a power supply connected across the first and second sections of the first thermal sink.

70. The apparatus recited in claim 65, wherein the dissipating of the thermal energy is into the ambient, and the absorbing of thermal energy is from a food refrigeration system.

71. The apparatus recited in claim 65, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from a vehicle occupant cooling system.

72. The apparatus recited in claim 65, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from an electronic integrated circuit device.

73. The apparatus recited in claim 69, wherein the dissipating of the thermal energy is into the ambient, and the absorbing of thermal energy is from a food refrigeration system.

74. The apparatus recited in claim 69, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from a vehicle occupant cooling system.

75. The apparatus recited in claim 69, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from an electronic integrated circuit device.

76. The apparatus recited in claim 47, wherein the dissipating of the thermal energy is into the ambient, and the absorbing of thermal energy is from a food refrigeration system.

77. The apparatus recited in claim 69, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from a vehicle occupant cooling system.

78. The apparatus recited in claim 47, wherein the dissipating of thermal energy is into the ambient and the absorbing of thermal energy is from an electronic integrated circuit device.

79. A method of operating a thermoelectric cooling apparatus having a first thermal sink operable at a first nominal temperature, a second thermal sink operable at a second nominal temperature relatively greater than the first nominal temperature, and a thermoelectric element coupled to the second thermal sink, comprising the steps of:

transmitting thermal energy from the thermoelectric element to the second thermal sink through a continuous coupling;

selectively switching the transmission of thermal energy between the thermoelectric element and the first thermal sink; and

selectively enabling an electric voltage across the thermoelectric element independent of the selective switching of the transmission of thermal energy.

80. The method recited in claim 79, wherein the steps of selectively switching and selectively enabling an electric voltage are accomplished in functional synchronism.

81. The method recited in claim 80, wherein the step of selectively switching is accomplished with a microelectromechanical system (MEMS) device.

82. The method recited in claim 81, wherein the duty cycle of the step of selectively enabling an electric voltage correlates with the duty cycle of the step of selectively switching.

83. The method recited in claim 80, wherein the duty cycle of the step of selectively enabling an electric voltage is similar to the duty cycle of the step of selectively switching.

84. The method recited in claim 79, wherein the step of selectively switching is accomplished with a microelectromechanical system (MEMS) device.

85. A method of operating a thermoelectric cooling apparatus having a first thermal sink operable at a first nominal temperature, a second thermal sink operable at a second nominal temperature relatively greater than the first nominal temperature, a third thermal sink operable at the second nominal temperature and in electric separation from the second thermal sink, a first thermoelectric element coupled to the second thermal sink, a second thermoelectric element thermally coupled to the third thermal sink, comprising the steps of:

transmitting thermal energy from the first thermoelectric element to the second thermal sink through a continuous coupling;

transmitting thermal energy from the second thermoelectric element to the third thermal sink through a continuous coupling;

selectively switching the transmission of thermal energy between the first and second thermoelectric elements and the first thermal sink; and

selectively enabling an electric voltage across the first and second thermoelectric elements independent from the selective switching of the transmission of thermal energy.

86. The method recited in claim 85, wherein the steps of selectively switching and selectively enabling an electric voltage are accomplished in functional synchronism.

87. The method recited in claim 86, the step of selectively switching is accomplished with a microelectromechanical system (MEMS) device.

88. The method recited in claim 87, the duty cycle of the step of selectively enabling an electric voltage correlates with the duty cycle of the step of selectively switching.

89. A method of operating a thermoelectric cooling apparatus having a first thermal sink for dissipating thermal energy at a temperature above an ambient, a second thermal sink for absorbing thermal energy at a temperature below the ambient, and a thermoelectric element coupled between the first and second thermal sinks to transport thermal energy therebetween, comprising the steps of:

transmitting thermal energy from the thermoelectric element to the first thermal sink through a continuous coupling;

selectively switching the thermal conductance of the coupling between the thermoelectric element and the second thermal sink; and

selectively enabling the thermoelectric element independent from but in relative functional synchronism with the selective switching of the thermal conductance.

90. The method recited in claim 89, wherein the step of selectively enabling comprises a switching of an electric voltage the thermoelectric element.

91. The method recited in claim 90, wherein the step of selectively switching the thermal conductance is accomplished with a microelectromechanical system (MEMS) device.

92. The method recited in claim 91, wherein the duty cycle of the step of selectively switching an electric voltage correlates with the duty cycle of the step of selectively switching the thermal conductance.