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Surface acoustic wave device package and method

  • US 5,969,461 A
  • Filed: 04/08/1998
  • Issued: 10/19/1999
  • Est. Priority Date: 04/08/1998
  • Status: Expired due to Fees
First Claim
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1. A package for an acoustic wave device having an active area on a face thereof, the package comprising:

  • a substrate with a top surface and a plurality of conductive pads disposed thereon;

    a plurality of stud bumps electrically connected to the face of the acoustic wave device and arranged near a periphery of the acoustic wave device, the stud bumps being aligned in proximity to the conductive pads and coupled to the conductive pads to form interconnections;

    a dam disposed on the top surface of the substrate between the substrate and the acoustic wave device, the dam disposed within the periphery of the acoustic wave device and interconnections; and

    an underfill material sealing the acoustic wave device to the substrate between the periphery of the acoustic wave device and the top surface of the substrate, the dam providing a boundary to the underfill material allowing the underfill material to encapsulate the interconnections and preventing the underfill material from contacting the active area on the face of the acoustic wave device so as to provide a sealed cavity within which the active area is sealed.

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