Surface acoustic wave device package and method

• US 5,969,461 A
• Filed: 04/08/1998
• Issued: 10/19/1999
• Est. Priority Date: 04/08/1998
• Status: Expired due to Fees

• Current Assignee: CTS Corporation
• Original Assignee: CTS Corporation
• Inventors: Christensen, Jeffrey E., Johnson, Gary C., Kennison, Gregory, Anderson, Michael J., Aday, Jon G.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US09/057,144
• Time in Patent Office: 559 Days
• Field of Search: 361/748, 361/760, 361/768, 361/772, 361/777, 361/782, 361/783, 310/313 R, 310/340, 310/348, 310/349, 333/150, 333/193, 367/140, 257/728, 257/737, 257/738, 257/778, 257/786-796, 438/124, 438/126, 438/127, 264/272.11, 264/272.16, 264/272.17, 29/25.35, 29/841, 174/52.2, 174/52.3, 174/260, 174/261
• US Class Current: 310/313.00R
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83051 Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H03H 9/059 : consisting of mounting pads or bumps
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.

Claims

1. A package for an acoustic wave device having an active area on a face thereof, the package comprising:

a substrate with a top surface and a plurality of conductive pads disposed thereon;

a plurality of stud bumps electrically connected to the face of the acoustic wave device and arranged near a periphery of the acoustic wave device, the stud bumps being aligned in proximity to the conductive pads and coupled to the conductive pads to form interconnections;

a dam disposed on the top surface of the substrate between the substrate and the acoustic wave device, the dam disposed within the periphery of the acoustic wave device and interconnections; and

an underfill material sealing the acoustic wave device to the substrate between the periphery of the acoustic wave device and the top surface of the substrate, the dam providing a boundary to the underfill material allowing the underfill material to encapsulate the interconnections and preventing the underfill material from contacting the active area on the face of the acoustic wave device so as to provide a sealed cavity within which the active area is sealed.

2. The package of claim 1, further comprising a conductive material interposed between the stud bumps and conductive pads, the conductive material forming mechanical and electrical interconnections coupling the acoustic wave device to the plurality of conductive pads on the top surface of the substrate.

3. The package of claim 2, wherein the dam abuts the face of the acoustic wave device, and wherein the stud bumps are positioned slightly above the conductive pads such that there is no direct contact therebetween.

4. The package of claim 2, wherein the dam has a height of about fifty-one micrometers and the stud bumps have a height of about forty-eight micrometers.

5. The package of claim 1, wherein the dam has a uniform height tolerance of about five micrometers and the stud bumps are planarized to have a uniform height tolerance of about ten micrometers.

6. The package of claim 1, wherein the stud bumps abut the conductive pads, and wherein the face of the acoustic wave device is positioned slightly above the dam such that there is no direct contact therebetween.

7. The package of claim 1, wherein the stud bumps abut the conductive pads and are mechanically bonded to the conductive pads, and wherein the face of the acoustic wave device abuts the dam.

8. The package of claim 1, wherein one conductive pad is interposed between the dam and the substrate, the one conductive pad substantially covering the substrate inside of the boundary defined by the dam to provide RF shielding and improved hermeticity.

9. The package of claim 1, wherein the substrate is a material chosen from one of the group of FR-4 polyimide, BT-epoxy, and alumina.

10. The package of claim 1, wherein the dam comprises a material consisting of at least one of the group of plastics, thermoplastics, epoxies, alumina, glasses, organic or inorganic material, and photoimageable organic material.

11. A method for packaging an acoustic wave device having an active area disposed on a face thereof, the method comprising the steps of:

providing a substrate with a top surface having a plurality of conductive pads disposed thereon;

disposing a dam onto the top surface of the substrate and inside of the location of the conductive pads;

bonding a plurality of stud bumps to a periphery of the face of the acoustic wave device;

aligning the stud bumps with their associated mirror image conductive pads and placing the stud bumps in proximity to the conductive pads on the top surface of the substrate;

connecting the acoustic wave device onto the substrate such that the stud bumps of the acoustic wave device and the associated conductive pads of the substrate form electrical and mechanical interconnections;

flowing an underfill material at the periphery of the acoustic wave device and around the interconnections such that the underfill material stops at a boundary defined by the dam; and

curing the underfill material to mechanically reinforce and protectively encapsulate the interconnections and provide a sealed cavity within which the active area is sealed.

12. The method of claim 11, wherein the disposing step includes disposing a dam comprising a material consisting of at least one of the group of plastics, thermoplastics, epoxies, alumina, glasses, organic or inorganic material, and photoimageable organic material.

13. The method of claim 11, wherein the connecting step includes substeps of:

at least partially coating the stud bumps with a conductive material; and

curing the conductive material to form solidified electrically conductive interconnections between the acoustic wave device and the substrate.

14. The method of claim 13, wherein the curing the conductive material substep includes heating the conductive material to a temperature near a glass transition temperature of the conductive material and less than a glass transition temperature of the dam.

15. The method of claim 13, wherein the aligning and placing step includes placing the face of the acoustic wave device to abut the dam, and includes aligning the stud bumps to be positioned slightly above the conductive pads such that there is no direct contact therebetween.

16. The method of claim 13, wherein the disposing step includes disposing the dam to have a height of about fifty-one micrometers, and wherein the bonding step includes a substep of planarizing the stud bumps to have a height of about forty-eight micrometers.

17. The method of claim 11, wherein the connecting step includes mechanically bonding the stud bumps directly to the conductive pads using one of the group consisting of thermosonic bonding and thermocompression bonding.

18. The method of claim 11, wherein the aligning and placing step includes placing the stud bumps to abut the conductive pads, and includes positioning the face of the acoustic wave device slightly above the dam such that there is no direct contact therebetween.

19. The method of claim 11, further comprising the step of overmolding the acoustic wave device with a package body material comprising one of the group consisting of thermoplastic, thermosetting plastic, and epoxy.

20. The method of claim 11, wherein the disposing step includes disposing the dam to have a uniform height tolerance of about five micrometers, and wherein the bonding step includes a substep of planarizing the stud bumps to have a uniform height tolerance of about ten micrometers.

21. A method for packaging an acoustic wave device having an active area disposed on a face thereof, the method comprising the steps of:

providing a substrate with a top surface having a plurality of conductive pads disposed thereon;

disposing a dam of photoimageable organic material onto the top surface of the substrate and inside of the location of the conductive pads;

bonding a plurality of stud bumps to a periphery of the face of the acoustic wave device;

aligning the stud bumps with their associated mirror image conductive pads and placing the stud bumps to abut the conductive pads and positioning the face of the acoustic wave device slightly above the dam such that there is no direct contact therebetween;

mechanically bonding the stud bumps directly to the conductive pads forming electrical and mechanical interconnections;

flowing an underfill material at the periphery of the acoustic wave device and around the interconnections such that the underfill material stops at a boundary defined by the dam; and

curing the underfill material to mechanically reinforce and protectively encapsulate the interconnections and provide a sealed cavity within which the active area is sealed.

22. The method of claim 21, wherein the mechanically bonding step includes one of the group consisting of thermosonic bonding and thermocompression bonding.

23. The method of claim 22, wherein the mechanically bonding step includes bonding the stud bumps into the conductive pads until the face of the acoustic wave device abuts or nearly abuts the dam to define a sealed cavity for the active area of the acoustic wave device between the top surface of the substrate and the face of the acoustic wave device.