Adjusting operating characteristics of micromachined torsional oscillators

• US 5,969,465 A
• Filed: 04/01/1998
• Issued: 10/19/1999
• Est. Priority Date: 04/01/1997
• Status: Expired due to Fees

• Current Assignee: Xros, Inc. (Nortel Networks Corporation)
• Original Assignee: Xros, Inc. (Nortel Networks Corporation)
• Inventors: Slater, Timothy G., Neukermans, Armand P., Downing, Philip
• Primary Examiner(s): Ramirez, Nestor
• Assistant Examiner(s): Mullins, B.
• Application Number:
  US09/053,232
• Time in Patent Office: 566 Days
• Field of Search: 267/154, 248/901, 359/877, 359/878, 359/199, 359/223, 359/224, 359/226, 310/40 MM, 310/333, 310/36, 310/68 C
• US Class Current: 310/333
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 3/0078 Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
• CPC Class Codes: B81C 2201/0167 by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 26/085 the reflecting means being moved or deformed by electromagnetic means
• CPC Class Codes: G02B 26/0858 the reflecting means being moved or deformed by piezoelectric means
• CPC Class Codes: G02B 26/0866 the reflecting means being moved or deformed by thermal means
• CPC Class Codes: G02B 26/101 with both horizontal and vertical deflecting means, e.g. raster or XY scanners colour television using laser beams scanning a display screen H04N9/3129
• CPC Class Codes: H02K 33/18 with coil systems moving upon intermittent or reversed energisation thereof by interaction with a fixed field system, e.g. permanent magnets

Abstract

An improved micromachined structure used for beam scanners, gyroscopes, etc. includes a reference member from which project a first pair of axially aligned torsion bars. A first dynamic member, coupled to and supported from the reference member by the torsion bars, oscillates in one-dimension about the torsion bar'"'"'s axis. A second dynamic member may be supported from the first dynamic member by a second pair of axially aligned torsion bars for two-dimensional oscillation. The dynamic members respectively exhibit a plurality of vibrational modes each having a frequency and a Q. The improvement includes means for altering a characteristic of the dynamic member'"'"'s frequency and Q. Coupling between dynamic members permits altering the second dynamic member'"'"'s frequency and Q by techniques applied to the first dynamic member. Some techniques disclosed also increase oscillation amplitude or reduce driving voltage, and also increase mechanical ruggedness of the structure.

Claims

1. In an integrated, micromachined structure that includes:

a frame-shaped reference member;

a pair of diametrically opposed, axially aligned torsion bars projecting from the reference member;

a dynamic member that is coupled by the torsion bars to the reference member to be thereby supported from the reference member for rotation about an axis of the torsion bars;

the reference member, the torsion bars and the dynamic member all monolithically fabricated from a stress-free semiconductor layer of a silicon substrate;

the dynamic member thus supported within the reference member by the torsion bars exhibiting a plurality of vibrational modes including a principal torsional vibrational mode about the axis of the torsion bars, a vertical shaking vibrational mode, a vertical rocking vibrational mode, a lateral shaking vibrational mode, and a lateral rocking vibrational mode, each such vibrational mode of the dynamic member having characteristics including a vibrational frequency and a Q; and

drive means for imparting oscillatory motion to the dynamic member about the axis of the torsion bars;

wherein the improvement comprises;

characteristic adjusting means, included in at least one of the torsion bars, for tailoring a characteristic of the principal torsional vibrational mode of the dynamic member.

2. The micromachined structure of claim 1 wherein the characteristic adjusting means tailors the vibrational frequency of the principal torsional vibrational mode.

3. The micromachined structure of claim 2 wherein tailoring the vibrational frequency of the principal torsional vibrational mode is effected by removing material from the torsion bars that support the dynamic member.

4. The micromachined structure of claim 2 wherein tailoring the vibrational frequency of the principal torsional vibrational mode is effected by a memory alloy film applied to at least one of the torsion bars that support the dynamic member, the memory alloy film being processed to establish a controlled stress in the torsion bar.

5. The micromachined structure of claim 2 wherein a heater is formed on a surface of at least one of the torsion bars that support the dynamic member for tailoring the vibrational frequency of the principal torsional vibrational mode.

6. The micromachined structure of claim 2 wherein a resistor is diffused into silicon forming at least one of the torsion bars that support the dynamic member for tailoring the vibrational frequency of the principal torsional vibrational mode.

7. The micromachined structure of claim 2 wherein a resistor is diffused into silicon forming at least one of the torsion bars that support the dynamic member and a lead, formed from a material having a coefficient of thermal expansion which differs from that of silicon, is formed on a surface of that torsion bar for tailoring the vibrational frequency of the principal torsional vibrational mode.

8. The micromachined structure of claim 2 wherein tailoring the vibrational frequency of the principal torsional vibrational mode is effected by a piezoelectric film applied to at least one of the torsion bars, application of a voltage across said piezoelectric film controllably altering stress in the torsion bars.

9. The micromachined structure of claim 1 wherein the characteristic adjusting means tailors the Q of the principal torsional vibrational mode.

10. The micromachined structure of claim 9 wherein tailoring the Q is effected by applying a layer of a damping material to at least one of the torsion bars.

11. The micromachined structure of claim 10 wherein the damping material applied to at least one of the torsion bars is a polymeric material.

12. The micromachined structure of claim 10 wherein the damping material applied to at least one of the torsion bars is a lossy metallic material.

37. The micromachined structure of claim 2 wherein alteration of the vibrational frequency of the principal torsional vibrational mode is effected by removing material from the dynamic member.

13. In an integrated, micromachined structure that includes:

a frame-shaped reference member;

a first pair of diametrically opposed, axially aligned torsion bars projecting from the reference member;

a first, frame-shaped first dynamic member that is coupled by the first torsion bars to the reference member to be thereby supported from the reference member for rotation about an axis of the first torsion bars;

a second pair of diametrically opposed, axially aligned torsion bars projecting from the first dynamic member;

a second dynamic member that is coupled by the second torsion bars to the first dynamic member to be thereby supported from the first dynamic member for rotation about an axis of the second torsion bars;

the reference member, the first and second torsion bars and the first and second dynamic members being all monolithically fabricated from a stress-free semiconductor layer of a silicon substrate;

the first and second dynamic members thus supported within the reference member respectively by the first and second torsion bars each respectively exhibiting a plurality of vibrational modes including a principal torsional vibrational mode about the axis of the torsion bars, a vertical shaking vibrational mode, a vertical rocking vibrational mode, a lateral shaking vibrational mode, and a lateral rocking vibrational mode, each such vibrational mode of the dynamic member having characteristics including a vibrational frequency and a Q; and

drive means for imparting oscillatory motion to the second dynamic member about the axis of the second torsion bars;

wherein the improvement comprises;

characteristic adjusting means for tailoring a characteristic of the principal torsional vibrational mode of the second dynamic member by controlling a characteristic of the first dynamic member.

14. The micromachined structure of claim 13 wherein the characteristic adjusting means tailors the vibrational frequency of the principal torsional vibrational mode of the second dynamic member.

15. The micromachined structure of claim 14 wherein tailoring the vibrational frequency of the principal torsional vibrational mode is effected by an electrostatic tuning plate that is disposed adjacent to the rotatable first dynamic member, a voltage applied across the first dynamic member and the electrostatic tuning plate tailoring a characteristic of the principal torsional vibrational mode of the second dynamic member.

16. The micromachined structure of claim 15 wherein the axis of the first torsion bars is not aligned with the axis of the second torsion bars.

17. The micromachined structure of claim 15 wherein the axis of the first torsion bars is aligned with the axis of the second torsion bars.

18. The micromachined structure of claim 13 wherein the characteristic adjusting means tailors the Q of the principal torsional vibrational mode of the second dynamic member.

19. The micromachined structure of claim 18 wherein tailoring the Q is effected by forming a ridge that projects outward from the first dynamic member and is aligned with the axis of rotation established by the first torsion bars, the ridge being received into a trough formed into a bearing block that is disposed immediately adjacent to the first dynamic member.

20. The micromachined structure of claim 18 wherein tailoring the Q is effected by increasing mass of the first dynamic member near the axis of the first torsion bars about which the first dynamic member may rotate.

21. The micromachined structure of claim 18 wherein tailoring the Q is effected by clamping the first torsion bars to prevent movement of the first dynamic member in the rocking vibratory mode.

22. An integrated, micromachined structure comprising:

a frame-shaped reference member;

a first pair of diametrically opposed, axially aligned torsion bars projecting from the reference member;

a first, frame-shaped first dynamic member that is coupled by the first torsion bars to the reference member to be thereby supported from the reference member for rotation about an axis of the first torsion bars, the first dynamic member having a thickness substantially the same as that of the first pair of torsion bars;

a second pair of diametrically opposed, axially aligned torsion bars projecting from the first dynamic member;

a second dynamic member that is coupled by the second torsion bars to the first dynamic member to be thereby supported from the first dynamic member for rotation about an axis of the second torsion bars;

the reference member, the first and second torsion bars and the first and second dynamic members being all monolithically fabricated from a stress-free semiconductor layer of a silicon substrate; and

drive means for imparting oscillatory motion to the second dynamic member about the axis of the second torsion bars.

23. The micromachined structure of claim 22 wherein the first dynamic member includes a reinforcing frame that projects outward from a surface of the first dynamic member thereby stiffening the first dynamic member.

24. The micromachined structure of claim 22 wherein the first dynamic member includes a reinforcement that projects outward from a surface of the first dynamic member adjacent to where the second pair of torsion bars couple to the first dynamic member thereby stiffening the first dynamic member thereabout.

25. The micromachined structure of claim 22 further comprising drive means for imparting oscillatory motion to the first dynamic member about the axis of the first torsion bars.

26. An integrated, micromachined structure comprising:

a frame-shaped reference member;

a first pair of diametrically opposed, axially aligned torsion bars projecting from the reference member;

a first, frame-shaped first dynamic member that is coupled by the first torsion bars to the reference member to be thereby supported from the reference member for rotation about an axis of the first torsion bars, the first dynamic member having a thickness that is only slightly greater than that of the first pair of torsion bars;

a second pair of diametrically opposed, axially aligned torsion bars projecting from the first dynamic member;

a second dynamic member that is coupled by the second torsion bars to the first dynamic member to be thereby supported from the first dynamic member for rotation about an axis of the second torsion bars;

the reference member, the first and second torsion bars and the first and second dynamic members being all monolithically fabricated from a stress-free semiconductor layer of a silicon substrate; and

drive means for imparting oscillatory motion to the second dynamic member about the axis of the second torsion bars.

27. The micromachined structure of claim 26 wherein the first dynamic member includes a reinforcing frame that projects outward from a surface of the first dynamic member thereby stiffening the first dynamic member.

28. The micromachined structure of claim 26 wherein the first dynamic member includes a reinforcement that projects outward from a surface of the first dynamic member adjacent to where the second pair of torsion bars couple to the first dynamic member thereby stiffening the first dynamic member thereabout.

29. The micromachined structure of claim 26 further comprising drive means for imparting oscillatory motion to the first dynamic member about the axis of the first torsion bars.

30. In an integrated, micromachined structure that includes:

a frame-shaped reference member;

a pair of diametrically opposed, axially aligned torsion bars projecting from the reference member;

a dynamic member that is coupled by the torsion bars to the reference member to be thereby supported from the reference member for rotation about an axis of the torsion bars;

the reference member, the torsion bars and the dynamic member all monolithically fabricated from a stress-free semiconductor layer of a silicon substrate;

the dynamic member thus supported within the reference member by the torsion bars exhibiting a plurality of vibrational modes including a principal torsional vibrational mode about the axis of the torsion bars, a vertical shaking vibrational mode, a vertical rocking vibrational mode, a lateral shaking vibrational mode, and a lateral rocking vibrational mode, each such vibrational mode of the dynamic member having characteristics including a vibrational frequency and a Q;

drive means for imparting oscillatory motion to the dynamic member about the axis of the torsion bars; and

a gas-filled hermetic enclosure that envelopes the reference member, the torsion bars, the dynamic member and at least a portion of the drive means, the gas which fills the hermetic enclosure having a composition different from that of an atmosphere that surrounds the hermetic enclosure.

31. The micromachined structure of claim 30 wherein the gas filling the hermetic enclosure has a viscosity which is lower than the atmosphere surrounding the hermetic enclosure thereby increasing the Q of the principal torsional vibrational mode of the dynamic member.

32. The micromachined structure of claim 31 wherein the gas filling the hermetic enclosure is selected from a group consisting of hydrogen, propane, ethane, methane or butane.

33. The micromachined structure of claim 30 wherein the drive means for imparting oscillatory motion to the dynamic member operates electrostatically, and the gas filling the hermetic enclosure is an electron capturing gas thereby improving the breakdown voltage of the electrostatically operated drive means.

34. The micromachined structure of claim 33 wherein the gas filling the hermetic enclosure is SF₆.

35. In an integrated, micromachined structure that includes:

a frame-shaped reference member;

a pair of diametrically opposed, axially aligned torsion bars projecting from the reference member;

a dynamic member that is coupled by the torsion bars to the reference member to be thereby supported from the reference member for rotation about an axis of the torsion bars;

the reference member, the torsion bars and the dynamic member all monolithically fabricated from a stress-free semiconductor layer of a silicon substrate;

the dynamic member thus supported within the reference member by the torsion bars exhibiting a plurality of vibrational modes including a principal torsional vibrational mode about the axis of the torsion bars, a vertical shaking vibrational mode, a vertical rocking vibrational mode, a lateral shaking vibrational mode, and a lateral rocking vibrational mode, each such vibrational mode of the dynamic member having characteristics including a vibrational frequency and a Q; and

drive means for imparting oscillatory motion to the dynamic member about the axis of the torsion bars;

wherein the improvement comprises;

characteristic adjusting means for tailoring a characteristic of the principal torsional vibrational mode of the dynamic member by altering the dynamic member.

36. The micromachined structure of claim 35 wherein the characteristic adjusting means tailors the vibrational frequency of the principal torsional vibrational mode.

38. The micromachined structure of claim 36 wherein tailoring the vibrational frequency of the principal torsional vibrational mode is effected by removing tabs from about a periphery of the dynamic member.

39. The micromachined structure of claim 35 wherein the characteristic adjusting means tailors the Q of the principal torsional vibrational mode.

40. The micromachined structure of claim 39 wherein tailoring the Q is effected by forming the dynamic member with a cross-sectional shape that maximizes inertia of the dynamic member while minimizing viscous drag.

41. In an integrated, micromachined structure that includes:

a frame-shaped reference member;

a pair of diametrically opposed, axially aligned torsion bars projecting from the reference member;

a dynamic member that is coupled by the torsion bars to the reference member to be thereby supported from the reference member for rotation about an axis of the torsion bars;

the reference member, the torsion bars and the dynamic member all monolithically fabricated from a stress-free semiconductor layer of a silicon substrate;

the dynamic member thus supported within the reference member by the torsion bars exhibiting a plurality of vibrational modes including a principal torsional vibrational mode about the axis of the torsion bars, a vertical shaking vibrational mode, a vertical rocking vibrational mode, a lateral shaking vibrational mode, and a lateral rocking vibrational mode, each such vibrational mode of the dynamic member having characteristics including a vibrational frequency and a Q; and

drive means for imparting oscillatory motion to the dynamic member about the axis of the torsion bars;

wherein the improvement comprises;

characteristic adjusting means added to the micromachined structure to mechanically tailor the frequency of the principal torsional vibrational mode of the dynamic member.

42. The micromachined structure of claim 41 wherein tailoring the vibrational frequency of the principal torsional vibrational mode is effected by at least one memory alloy ribbon formed parallel to one of the torsion bars that support the dynamic member, said memory alloy ribbon extending between the dynamic member and the reference member substantially parallel to the immediately adjacent torsion bar, the memory alloy film being processed to establish a controlled stress in the torsion bar.

43. The micromachined structure of claim 41 wherein tailoring of the vibrational frequency of the principal torsional vibrational mode is effected by at least one metallic ribbon formed parallel to one of the torsion bars that support the dynamic member, said metallic ribbon extending between the dynamic member and the reference member substantially parallel to the immediately adjacent torsion bar, an electric current applied to the metallic ribbon establishing a controlled stress in the torsion bar.

44. The micromachined structure of claim 41 wherein tailoring of the vibrational frequency of the principal torsional vibrational mode is effected by an actuator disposed outside of the reference member, application of a voltage across said actuator controllably altering stress in the torsion bars.

45. The micromachined structure of claim 44 wherein the actuator is a piezoelectric actuator.

46. The micromachined structure of claim 44 wherein the actuator is a magneto-restrictive actuator.