Circuit board inspection apparatus and method employing a rapidly changing electrical parameter signal

• US 5,969,530 A
• Filed: 02/27/1998
• Issued: 10/19/1999
• Est. Priority Date: 02/28/1997
• Status: Expired due to Term

• Current Assignee: Nidec-Read Corporation (Nidec Corporation)
• Original Assignee: Nidec-Read Corporation (Nidec Corporation)
• Inventors: Yamashita, Munehiro
• Primary Examiner(s): Do, Diep N.
• Application Number:
  US09/032,147
• Time in Patent Office: 599 Days
• Field of Search: 324/522, 324/523, 324/527, 324/537, 324/754, 324/761
• US Class Current: 324/537
• CPC Class Codes: G01R 31/2805 Bare printed circuit boards
• CPC Class Codes: G01R 31/2812 Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance of connections G01R31/66
• CPC Class Codes: G01R 31/312 by capacitive methods
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits

Abstract

An inexpensive and reliable circuit board inspection apparatus and method requires only a short inspection time and is applicable to a densely wired circuit board. A constant voltage E is applied to a switch section SW1 from a signal source 46. A computer 44 turns on a switch section SW2 and then turns the switch section SW1 on. An equivalent circuit is then closed to cause a current (i) to flow therethrough, thereby generating a voltage Vx that is input to an amplifier 74. After the voltage Vx has been amplified by the amplifier 74, its maximum value is detected and held by a peak hold circuit 76. Based on the maximum value, the computer 44 determines the continuity of a printed pattern on a circuit board 32. The voltage Vx input to the amplifier 74 exhibits the maximum value nearly simultaneously with the activation of the switch section SW1. Thus, detection of the maximum value and continuity of the printed pattern can be determined in a very short time.

Claims

1. A printed circuit board inspection apparatus for inspecting conductivity of a plurality of electric paths printed thereon, each of the paths having a first terminal and a second terminal, the apparatus comprising:

a plurality of contact probes, each of the contact probes being adapted to be in contact with and electrically connected with each of the first terminals of the paths;

a signal generator for selectively supplying a test signal to one of the contact probes, the test signal changing its electric parameter rapidly;

a sensing probe arranged to confront the second terminals of the paths with a gap therebetween to be electrically coupled with the second terminals for allowing the test signal to pass through the gap and picked up by the sensing probe;

a detector for detecting the signal picked up by the sensing probe while the parameter of the signal is changing in one direction; and

means for determining whether the detected signal is above or below a predetermined level.

2. A printed circuit board testing apparatus as claimed in claim 1, wherein said signal generator includes a voltage generator for generating a voltage signal of which voltage changes rapidly.

3. A printed circuit board testing apparatus as claimed in claim 2, wherein said voltage generator includes means for generating a voltage signal of which voltage rises rapidly, and the detector includes a peak hold circuit for holding the maximum of the voltage signal transmitted through the electric path and detected by the sensing probe.

4. A printed circuit board testing apparatus as claimed in claim 1, wherein said signal generator includes a voltage generator and a switch for selectively connecting the voltage generator to one of the contact probes.

5. A printed circuit board testing apparatus as claimed in claim 3 wherein said voltage generator includes a constant voltage source for generating a constant voltage, and the switch is arranged to alternatively and sequentially connect the constant voltage source to one of the contact probes.

6. A printed circuit board testing apparatus as claimed in claim 1 wherein said signal generator include a pulse generator for generating rectangular wave pulses and a switch for alternatively and sequentially connecting the pulse generator to one of the contact probes in synchronization with rising of each pulse.

7. A printed circuit board testing apparatus as claimed in claim 1, wherein said sensing probe includes an electrode plate covering a plurality of second terminals.

8. A printed circuit board testing apparatus as claimed in claim 7, further comprising an insulating film disposed in the gap.

9. A printed circuit board testing apparatus as claimed in claim 1, wherein said sensing probe includes a plurality of electrode plates each of which covers a plurality of the second terminals.

10. A printed circuit board testing apparatus as claimed in claim 1, wherein said sensing probe includes a plurality of electrodes each of which confronts to one of the second terminals.

11. A printed circuit board testing apparatus as claimed in claim 10, wherein said sensing probe further includes a connection plate connected to a plurality of electrodes.

12. A printed circuit board testing apparatus as claimed in claim 10, wherein said sensing probe further includes a plurality of connection plates respectively connected with corresponding electrodes.

13. A printed circuit board inspection apparatus for inspecting conductivity of a plurality of electric paths printed thereon, each of the paths having a first terminal pad connected to the first terminal of the wiring and a second terminal pad connected to the second terminal of the wiring, the second terminal pads being arranged in a plurality of groups, the apparatus comprising:

a plurality of contact probes, each of the contact probes being adapted to be in contact with and electrically connected with each of the first terminal pads;

a signal generator for selectively supplying a test signal to one of the contact probes;

a plurality of sensing probes arranged such that each of the sensing probes respectively covers and confronts one of the groups of the second terminal pads with an insulating layer therebetween to be electrically coupled with the second terminal pads for allowing the test signal to pass through the insulating layer and picked up by the sensing probe;

a detector for detecting the signal picked up by the sensing probe; and

means for determining whether the detected signal is above or below a predetermined level.

14. A printed circuit board testing apparatus as claimed in claim 13, wherein the second terminal pads of each group align in a row, and each of said sensing probes includes an electrode plate covering the second terminal pads of its corresponding groups of second terminal pads.

15. A printed circuit board inspection apparatus for inspecting conductivity of a plurality of electric paths printed thereon, each of the paths having a first terminal and a second terminal, the apparatus comprising:

a plurality of contact probes, each of the contact probes being adapted to be in contact with and electrically connected with each of the first terminals of the paths;

a signal generator for selectively supplying a test signal to one of the contact probes, the test signal changing its electric parameter rapidly;

a sensing probe arranged to confront to the second terminals of the paths with an electrically insulating layer therebetween to be electrically coupled with the second terminals for allowing the test signal to pass through the layer and picked up by the sensing probe;

a detector for detecting a maximum value of the signal picked up by the sensing probe; and

means for determining whether the detected signal is above or below a predetermined level.

16. A printed circuit board testing apparatus as claimed in claim 15, wherein said detector includes a peak hold circuit to detect the maximum value.

17. A printed circuit board inspection apparatus for inspecting conductivity of a plurality of electric paths printed thereon, each of the paths having a first terminal and a second terminal, the apparatus comprising:

a plurality of contact probes, each of the contact probes being adapted to be in contact with and electrically connected with each of the first terminals of the paths;

a signal generator for selectively supplying a test signal to one of the contact probes, the test signal rising and lowering its electric parameter in a short time;

a sensing probe arranged to confront the second terminals of the paths with an electrically insulating layer therebetween to be electrically coupled with the second terminals for allowing the test signal to pass through the layer and picked up by the sensing probe;

a detector for detecting the signal picked up by the sensing probe; and

means for determining whether the detected signal is above or below a predetermined level.

18. A method for inspecting conductivity of a plurality of electric paths on a printed circuit board, each of the paths having a first terminal and a second terminal, the method comprising the steps of:

making a plurality of contact probes in contact with the corresponding first terminals of the electric paths;

electrically coupling a sensing probes with the second terminals through a gap;

alternatively and sequentially applying a test signal to each of the contact probes, the test signal changing its electric parameter rapidly;

detecting the test signal to be transmitted to the sensing probe via the electric path to which terminal the test signal is being applied, while the test signal making a rapid and simple change; and

determining whether the detected signal is above or lower than a predetermined level.

19. A method for inspecting conductivity of a plurality of electric paths on a printed circuit board as claimed in claim 18, wherein the electric coupling is a capacitive coupling.

20. A method for inspecting conductivity of a plurality of electric paths on a printed circuit board as claimed in claim 18, wherein the electric coupling is an electromagnetic coupling.

21. A method for inspecting conductivity of a plurality of electric paths on a printed circuit board as claimed in claim 18, wherein the step of detecting includes a step of holding a maximum value in the transmitted signal.

22. A method for inspecting conductivity of a plurality of electric paths on a printed circuit board as claimed in claim 18 wherein the step of applying the test signal includes a step of sequentially and selectively connecting the contact probes with a voltage generator.

23. A method for inspecting conductivity of a plurality of electric paths on a printed circuit board as claimed in claim 18 wherein the step of applying the test signal includes a step of sequentially and selectively connecting the contact probes with a constant voltage source.