Integrated circuit transformer with inductor-substrate isolation

• US 5,969,590 A
• Filed: 08/05/1997
• Issued: 10/19/1999
• Est. Priority Date: 08/05/1997
• Status: Expired due to Term

• Current Assignee: MACOM Connectivity Solutions, LLC (MACOM Technology Solutions Holdings, Inc.)
• Original Assignee: Applied Micro Circuits Corporation (MACOM Technology Solutions Holdings, Inc.)
• Inventors: Gutierrez, German R.
• Primary Examiner(s): Gellner, Michael L.
• Assistant Examiner(s): MAI, ANH T
• Application Number:
  US08/910,456
• Time in Patent Office: 805 Days
• Field of Search: 336/200, 336/223, 336/232, 336/102
• US Class Current: 336/200
• CPC Class Codes: H01F 27/2804 Printed windings

Abstract

An integrated circuit transformer includes multiple metal layers in the structure of an integrated circuit in which are formed a first spiral inductor and a second spiral inductor. The first spiral inductor is aligned with and beneath the second spiral inductor such that the first spiral inductor acts to magnetically excite the second spiral inductor, while shielding it from resistance losses to the substrate.

Claims

1. An integrated circuit transformer, comprising:

a semiconductor structure including a substrate and a plurality of material layers disposed over the substrate;

a first metallic inductor disposed in a first material layer;

a second metallic inductor having a pattern and disposed in a second material layer;

a third metallic inductor disposed in the first material layer; and

a capacitor electronically coupled in parallel with the second metallic inductor;

the first metallic inductor being a primary coil;

the first and third metallic inductors each having the pattern of the second metallic conductor;

the patterns of the first, second, and third metallic inductors being substantially aligned with respect to each other, over a surface of the substrate.

2. The integrated circuit transformer of claim 1, wherein the patterns of the first, second and third metallic inductors are square spirals.

3. The integrated circuit transformer of claim 1, further including electronic circuit components connected to the first metallic inductor for providing a current to drive the first metallic inductor.

4. The integrated circuit transformer of claim 1, wherein the second metallic inductor is positioned over the first and third metallic inductors.

5. The integrated circuit transformer of claim 1, wherein the second material layer is disposed over the first material layer.

6. An integrated circuit with a substrate and a plurality of material layers in which circuit elements are formed, the circuit elements comprising:

one or more electronic circuits comprising said circuit elements; and

a transformer in at least one of the electronic circuits, the transformer comprising;

a first metallic inductor disposed in a lower material layer; and

a second metallic inductor having a pattern and disposed in an upper material layer;

a third metallic inductor disposed in the first material layer; and

a capacitor electronically coupled in parallel with the second metallic inductor;

the first metallic inductor being a primary coil;

the first and third metallic inductors each having the pattern of the second metallic conductor;

the patterns of the first, second, and third metallic inductors being substantially aligned with respect to each other, over a surface of the substrate.

7. The integrated circuit of claim 6, further including electronic circuit elements connected to the first metallic inductor for providing a current to drive the first metallic inductor.

8. The integrated circuit of claim 6, wherein the patterns of the first, second and third metallic inductors are square spirals.

9. The integrated circuit of claim 6, wherein the second metallic inductor is positioned above the first and third metallic inductors.

10. The integrated circuit of claim 6, wherein the second material layer is disposed above the first material layer.