Ink jet channel wafer for a thermal ink jet printhead

• US 5,971,527 A
• Filed: 10/29/1996
• Issued: 10/26/1999
• Est. Priority Date: 10/29/1996
• Status: Expired due to Term

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Peeters, Eric, Kubby, Joel Alan, Mantell, David Allen, Viturro, R. Enrique, Thornton, Constance J., O'Neill, James F.
• Primary Examiner(s): Fuller, Benjamin R.
• Assistant Examiner(s): Stephens, Juanita
• Application Number:
  US08/741,422
• Time in Patent Office: 1,092 Days
• Field of Search: 347/63, 347/56, 347/54, 347/20, 347/1, 347/67, 347/65, 216/27, 216/99, 438/733
• US Class Current: 347/65
• CPC Class Codes: B41J 2/14032 Structure of the pressure chamber
• CPC Class Codes: B41J 2/14129 Layer structure
• CPC Class Codes: B41J 2/1604 of the edge shooter type
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]

Abstract

An ink jet channel wafer for an ink jet printer has a first surface in which a plurality of anisotropically etched ink channels and an anisotropically etched ink reservoir are directly connected to one another. The ink jet channel wafer is etched using an admixture of at least one alkali metal hydroxide and at least one alcohol compound.

Claims

1. An ink jet channel wafer for an ink jet printer comprising a surface comprising:

a) a plurality of anisotropically etched ink channels, and

b) an anisotropically etched ink reservoir;

said ink reservoir being directly connected to said ink channels by convex corners, said convex corners being defined by at least one crystal {221} plane and wherein walls of said ink channels are on a crystal {111} plane.

2. An ink jet channel wafer according to claim 1, wherein said ink reservoir is directly connected to an ink inlet in a second backside surface of said ink jet channel wafer.

3. An ink jet channel wafer according to claim 1, where in said wafer comprises silicone.

4. An ink jet channel wafer according to claim 1, wherein said ink jet channel wafer comprises a heater pit anisotropically etched in said first surface.

9. An ink jet channel wafer according to claim 1, wherein said convex corners are defined by two crystal {221} planes.

10. An ink jet channel wafer according to claim 1, wherein said convex corners are defined by at least two crystal {221} planes.

5. An ink jet printhead for an ink jet printer comprising:

a) an upper ink jet channel wafer comprising on a surface a plurality of anisotropically etched ink channels directly connected to an anisotropically etched ink reservoir by convex corners, said convex corners being defined by at least one crystal {221} plane, and wherein walls of said ink channels are on a crystal { 111} plane, and

b) a lower heater wafer comprising heater elements wherein said upper ink jet channel wafer is on said lower heater wafer.

6. A ink jet printhead according to claim 5, wherein said upper ink jet channel wafer comprises an anisotropically etched heater pit formed in said first surface.

7. An ink jet channel wafer according to claim 5, wherein said wafer comprises silicon.

8. A method of ink jet printing comprising:

a) providing a substrate; and

b) printing on said substrate using the ink jet printhead of claim 5.

11. An ink jet printhead according to claim 5, wherein said convex corners are defined by two crystal {221} planes.

12. An ink jet printhead according to claim 5, wherein said convex corners are defined by at least two crystal {221} planes.