Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
First Claim
1. A method of fixturing a flexible circuit substrate and a processing carrier, comprising:
- providing plural adhesive films;
providing a flexible circuit substrate;
providing a processing carrier; and
attaching the flexible circuit substrate and the processing carrier together with the adhesive films therebetween.
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0 Petitions
Accused Products
Abstract
Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.
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Citations
38 Claims
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1. A method of fixturing a flexible circuit substrate and a processing carrier, comprising:
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providing plural adhesive films; providing a flexible circuit substrate; providing a processing carrier; and attaching the flexible circuit substrate and the processing carrier together with the adhesive films therebetween. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of processing a flexible circuit, comprising:
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providing a processing carrier having a support surface; providing a flexible circuit substrate having a first surface and a second surface; providing a unitary adhesive film comprising plural adhesive films and the unitary adhesive film having a first adherent surface and a second adherent surface; adhering the first adherent surface of the unitary adhesive film with the support surface of the processing carrier; adhering the second adherent surface of the unitary adhesive film with the first surface of the flexible circuit substrate; and processing the second surface of the flexible circuit substrate with the first adherent surface of the unitary adhesive film being adhered to the support surface of the processing carrier and the second adherent surface thereof being adhered to the first surface of the flexible circuit substrate. - View Dependent Claims (13, 14, 15)
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16. A method of processing a flexible circuit substrate relative to a processing carrier, comprising:
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providing a unitary adhesive film comprising plural adhesive films and the unitary adhesive film having a first adherent surface and a second adherent surface; adhering the processing carrier and the first adherent surface of the unitary adhesive film; adhering the flexible circuit substrate and the second adherent surface of the unitary adhesive film; and after the adherings, separating the flexible circuit substrate and the second adherent surface of the unitary adhesive film with the first adherent surface and the processing carrier remaining adhered. - View Dependent Claims (17)
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18. A method of fixturing a flexible circuit substrate and a processing carrier, comprising:
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providing a flexible circuit substrate having a first surface; providing a processing carrier having a support surface; applying a first adhesion force using a first adhesive film against the support surface of the processing carrier; and applying a second adhesion force using a second adhesive film against substantially the total surface area of the first surface of the flexible circuit substrate. - View Dependent Claims (19, 20, 21, 22)
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23. A method of fixturing a flexible circuit substrate and a processing carrier, comprising:
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providing a flexible circuit substrate having a first surface; providing a processing carrier having a support surface; and attaching substantially the total surface area of the first surface of the flexible circuit substrate and the support surface of the processing carrier using plural adhesive films intermediate the first surface of the flexible circuit substrate and the support surface of the processing carrier. - View Dependent Claims (24)
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25. A method of fixturing a flexible circuit substrate and a processing carrier, comprising:
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providing a flexible circuit substrate having a first surface and a unitary adhesive film comprising plural adhesive films attached thereto; providing a processing carrier having a support surface; and attaching the unitary adhesive film and the support surface of the processing carrier. - View Dependent Claims (26)
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27. A method of processing a flexible circuit, comprising:
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providing a processing carrier having a support surface; providing a flexible circuit substrate having a first surface and a second surface; fixturing the first surface of the flexible circuit substrate to the support surface of the processing carrier; and covering the second surface of the flexible circuit substrate with an encapsulating material. - View Dependent Claims (28, 29, 30, 31, 32)
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33. A method of fixturing a flexible circuit substrate and a processing carrier, comprising:
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providing a first film having a first adherent surface; providing a second film having a second adherent surface; joining the first and second films to form a unitary adhesive film having the first adherent surface and the second adherent surface on opposing outer sides thereof; providing a flexible circuit substrate; providing a processing carrier; and attaching the flexible circuit substrate and the processing carrier together with the adhesive film therebetween. - View Dependent Claims (34, 35, 36, 37, 38)
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Specification