Die attach adhesive compositions

• US 5,973,052 A
• Filed: 01/13/1998
• Issued: 10/26/1999
• Est. Priority Date: 12/16/1996
• Status: Expired due to Fees

• Current Assignee: Shell Oil Company (Shell Plc)
• Original Assignee: Shell Oil Company (Shell Plc)
• Inventors: Wong, Pui Kwan, Iyer, Shridhar R.
• Primary Examiner(s): Cain, Edward J.
• Application Number:
  US09/006,314
• Time in Patent Office: 651 Days
• Field of Search: 523/176, 524/439, 524/440, 524/441
• US Class Current: 524/440
• CPC Class Codes: C08G 67/02 Copolymers of carbon monoxide and aliphatic unsaturated compounds
• CPC Class Codes: C09J 9/02 Electrically-conducting adhesives
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/31 Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01011 Sodium [Na]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: Y02P 20/582 : Recycling of unreacted starting or intermediate materials

Abstract

A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises

(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and

(b) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium.

Claims

1. A process for attaching a semiconductor device to a substrate comprising:

(a) providing a substrate;

(b) dispensing, on at least a portion of said substrate, a thermally reworkable die attach adhesive composition, said composition comprising

(i) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and

(ii) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium,

at a temperature which is sufficiently high to convert the die attach adhesive composition into a liquid thereby producing an adhesive-attached substrate;

(c) attaching the semiconductor device on the surface of the thermally reworkable die attach adhesive on the adhesive-attached substrate while the adhesive is in a liquid, thereby bonding the semiconductor device to the substrate; and

,

(d) cooling the die attach adhesive to a temperature which is sufficiently low to solidify the resin thereby providing an assembly.

2. The process of claim 1 wherein the crosslinked resin is heated at a temperature within the range of from about 100°

C. to about 250°

C.

3. The process of claim 1 wherein the 2,5-dialkyl substituted furan-containing polymer is produced by reacting carbon monoxide with at least one olefinically unstaturated compound.

4. The process of claim 1 wherein the dienophile is a cyclic derivative of maleic anhydride.

5. The process of claim 1 further comprising the step of (e) heating the assembly at a temperature within the range of 70°

C. to 200°

C. for a period of up to 4 hours.

6. The process of claim 1 further comprising the step of (e) heating the assembly at a temperature within the range of 150°

C. to 300°

C. for a period of up to 4 hours.

7. The process of claim 1 further comprising the steps of:

(e) heating the thermally reworkable die attach adhesive composition of the assembly at a temperature which is sufficiently high to convert the die attach adhesive composition into a liquid thereby providing a liquid die attach adhesive composition,

(f) removing the semiconductor device from the liquid die attach adhesive composition;

(g) optionally, dispensing a fresh thermally reworkable die attach adhesive composition comprising

(i) a thermally reworkable crosslinked resin produced by reacting a dienophile having a functionality greater than one and a 2,5-dialkyl substituted furan-containing polymer, and

(ii) at least one thermally or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium,

(h) optionally, providing another semiconductor device on the surface of the liquid die attach adhesive, thereby bonding another semiconductor device on the die attach adhesive; and

(i) cooling the liquid die attach adhesive to a temperature which is sufficiently low to solidify the resin thereby providing a reworked assembly.

8. The process of claim 7 wherein the crosslinked resin is heated at a temperature within the range of from about 100°

C. to about 250°

C.

9. The process of claim 7 wherein the 2,5-dialkyl substituted furan-containing polymer is produced by furanizing a copolymer of carbon monoxide and at least one olefinically unsaturated compound.

10. The process of claim 9 wherein the dienophile is a cyclic derivative of maleic anhydride.