Encapsulated electronic component and method for encapsulating an electronic component

• US 5,973,263 A
• Filed: 08/18/1997
• Issued: 10/26/1999
• Est. Priority Date: 02/08/1996
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Communications, Inc. (Micron Technology, Inc.)
• Inventors: Tuttle, Mark E., Cirino, Clay L., Mousseau, Joseph P.
• Primary Examiner(s): Sough, Hyung-Sub
• Assistant Examiner(s): Ngo, Hung V
• Application Number:
  US08/914,308
• Time in Patent Office: 799 Days
• Field of Search: 174/250, 174/255, 174/256, 174/258, 174/260, 174/52.2, 174/52.3, 174/52.4, 361/760, 361/761, 361/762, 361/764, 361/765, 361/812, 29/855, 29/856, 29/841, 29/885, 257/782, 257/783, 257/784, 257/787, 257/790
• US Class Current: 174/523
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

An encapsulation body for enclosing an electronic element is disclosed and which includes a first layer of a slow curing two-part epoxy which is in a flowable state; a second layer of material positioned outwardly of the first layer and which substantially retains the first layer of material on the electronic element while the first layer of material is in a flowable state; and a dam surrounding the electronic element, the first and second layers of material received within the dam.

Claims

1. An encapsulation body for enclosing an electronic element which rests on a substrate, comprising:

a first layer of material positioned in covering relation relative to the electronic component, the first layer of material comprising a slow curing two part epoxy which is in a flowable state;

a second layer of material positioned outwardly of the first layer of material and which substantially retains the first layer of material on the electronic element while the first layer of material is in the flowable state; and

a dam surrounding the electronic element, the first and second layers of material received within the dam.

2. An encapsulation body for enclosing an electronic element which rests on a substrate, comprising:

a first layer of material positioned in covering relation relative to the electronic component, the first layer of material comprising a slow curing two part epoxy which is in a flowable state, and wherein the first layer two part epoxy has an exterior surface;

a second layer of material positioned outwardly of the first layer of material and which substantially retains the first layer of material on the electronic element while the first layer of material is in the flowable state, and wherein the second layer comprises a material which accelerates the hardening of the exterior surface of the first layer two part epoxy; and

a dam surrounding the electronic element, the first and second layers of material received within the dam.

3. An encapsulation body as claimed in claim 2 wherein the second layer of material comprises a catalyst which accelerates hardening and a fast curing two part epoxy.

4. An encapsulation body as claimed in claim 2, wherein the second layer of material comprises a catalyst, and a light curable coating.

5. A method for encapsulating an electronic component which is supported on a substrate, comprising:

providing a first flowable two part epoxy layer on the electronic component, the first flowable two part epoxy layer having a first curing rate;

providing a second two part epoxy layer atop the first two part epoxy layer, the second two part epoxy layer having a second curing rate which is faster than the first curing rate, the second two part epoxy layer retaining the first flowable two part epoxy layer on the electronic component while the first flowable two part epoxy layer cures; and

providing an enclosure dam around the electronic component, the first flowable layer and second layer received within the dam.

6. A method as claimed in claim 5, wherein the first flowable two part epoxy layer has an exterior surface, and wherein a catalyst is applied to the exterior surface of the first flowable two part epoxy layer.