High temperature ZrN and HfN IR scene projector pixels

• US 5,973,383 A
• Filed: 04/09/1998
• Issued: 10/26/1999
• Est. Priority Date: 04/09/1998
• Status: Expired due to Term

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Cole, Barrett E., Holmen, James O., Greenlaw, David K.
• Primary Examiner(s): Abraham, Fetsum
• Application Number:
  US09/057,734
• Time in Patent Office: 565 Days
• Field of Search: 257/536, 257/537, 338/17, 338/20, 338/71-74, 338/196, 338/197
• US Class Current: 257/536
• CPC Class Codes: B41J 2/33515 Heater layers
• CPC Class Codes: B41J 2/3355 characterised by materials
• CPC Class Codes: B41J 2/3356 Corner type resistors
• CPC Class Codes: B41J 2/33565 Edge type resistors
• CPC Class Codes: B41J 2/3357 Surface type resistors

Abstract

A structure and method of making resistive emitting members which exhibit high resistivity while at the same time providing high temperature operation significantly above that known in the art. Specifically the use of nitrides of Group IVB transition metals from the periodic table, exclusive of titanium is described.

Claims

1. A structure used for ohmic heating comprising:

one or more resistive members comprised of a IVB group metal of the periodic table having 40 or greater electrons, and a resistance above about 50 ohms per square wherein one or more of said one or more resistive members contain nitrogen.

2. The structure of claim 1 wherein one or more of said one or more resistive members are arranged to define a user-selected thermal image whereby the thermal image is formed when current is passed through one or more of said one or more resistive members.

3. The structure of claim 1 wherein said one or more resistive members are in contact with a material to be heated whereby the material is heated when current is passed through one or more of said one or more resistive members.

4. A pixel for use in an ohmic heating array of pixels comprising:

resistive member comprised of a IVB group metal of the periodic table and having 40 or greater electrons, and a resistance above about 50 ohms per square wherein said resistive members include nitrogen; and

current controlling means for selectively passing current through said resistive member in concert with other of the pixels in the ohmic heating array.

5. The pixel of claim 4 wherein said resistive member is comprised of hafnium.

6. The pixel of claim 5 wherein said resistive member is comprised of zirconium.

7. The pixel of claim 6 wherein said resistive members includes nitrogen.

8. The pixel of claim 7 wherein said resistive members is comprised of between about ten and forty percent nitrogen.

9. The pixel of claim 4 wherein said resistive members is comprised of between less than about ten percent nitrogen.

10. The pixel of claim 4 wherein:

said resistive member comprises a serpentine film mounted on a thermally isolating member; and

said current controlling means is mounted under the thermally isolating member.

11. The structure of claim 10 wherein said one or more resistive members are in contact with a material to be heated whereby the material is heated when current is passed through one or more of said one or more resistive members.

12. The structure of claim 4 wherein said one or more resistive members are in contact with a material to be heated whereby the material is heated when current is passed through one or more of said one or more resistive members.

13. An array of ohmic heating elements comprising:

a plurality of resistive members comprised of an IVB group metal of the periodic table and having 40 or greater electrons, and a resistance above about 50 ohms per square wherein said resistive members include nitrogen; and

one or more current controlling means for causing at least binary control of current flow through said plurality of resistive members.

14. The array of claim 13 wherein one current controlling means is associated with the current flow through each one of said plurality of resistive members.

15. The array of claim 13 wherein a single current controlling means is associated with current flow through all resistive members.

16. The array of claim 13 wherein the resistive members are comprised of hafnium.

17. The array of claim 13 wherein the resistive members are comprised of zirconium.

18. The array of claim 17 wherein said resistive members includes nitrogen.

19. The array of claim 13 wherein:

one or more of the plurality of resistive members comprises a serpentine film mounted on a thermally isolating member; and

said one or more current controlling means are mounted under the thermally isolating members.