Tamper resistant attach mechanism between plastic cover and thermal plate assembly for processor cartridges

• US 5,973,399 A
• Filed: 02/17/1998
• Issued: 10/26/1999
• Est. Priority Date: 02/17/1998
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Webb, James S., Davison, Peter A., Stark, Michael, Lieska, Bill, Rutigliano, Michael
• Primary Examiner(s): Saadat, Mahshid
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US09/024,492
• Time in Patent Office: 616 Days
• Field of Search: 257/731, 257/678, 361/600, 361/796, 361/820, 438/106, 438/110
• US Class Current: 257/731
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 7/1431 Retention mechanisms for CPU modules

Abstract

An electronic cartridge. The cartridge may include a first cover and a second cover that are adjacent to a substrate. One or more integrated circuit packages may be mounted to the substrate. The cartridge may include a pin that extends from the first cover and which has a barb that is embedded into the second cover. The embedded barb will damage the second cover if the cover is removed from the cartridge. The present invention thus prevents the removal and re-installation of the cover from the cartridge.

Claims

1. An electronic cartridge, comprising:

a substrate;

an integrated circuit package mounted to said substrate;

a first cover located adjacent to said substrate;

a second cover located adjacent to said substrate; and

,

a pin that extends from said first cover, said pin having a barb that is embedded into said second cover.

2. The cartridge as recited in claim 1, wherein said pin extends through said substrate.

3. The cartridge as recited in claim 1, wherein said first cover is a thermal element.

4. The cartridge as recited in claim 1, wherein said barb is embedded into a boss of said second cover.

5. The cartridge as recited in claim 4, wherein said boss has an oblong shape.

6. An electronic cartridge, comprising:

a substrate;

an integrated circuit package mounted to said substrate;

a thermal element attached to said substrate;

a cover that is located adjacent to said substrate;

a pin that extends from said thermal element and through said substrate, said pin having a barb that is embedded into said cover.

7. The cartridge as recited in claim 6, wherein said barb is embedded into a boss of said cover.

8. The cartridge as recited in claim 7, wherein said boss has an oblong shape.

9. A method for assembling an electronic cartridge, comprising:

a) placing a first cover adjacent to a substrate, wherein a pin with a barb extends from said first cover;

b) embedding said barb into a second cover.

10. The method as recited in claim 9, wherein said barb is deformed when embedded into said second cover.