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Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

  • US 5,973,403 A
  • Filed: 08/19/1997
  • Issued: 10/26/1999
  • Est. Priority Date: 11/20/1996
  • Status: Expired due to Term
First Claim
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1. An electronic device comprising:

  • a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, the at least one flip-chip pad of the first plurality of flip-chip pads being connected to at least one wire-bondable pad of the second plurality of wire-bondable pads;

    a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base;

    a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and

    at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one pad of the second plurality of wire-bondable pads on the surface of the base.

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