Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
First Claim
Patent Images
1. An electronic device comprising:
- a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, the at least one flip-chip pad of the first plurality of flip-chip pads being connected to at least one wire-bondable pad of the second plurality of wire-bondable pads;
a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base;
a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and
at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one pad of the second plurality of wire-bondable pads on the surface of the base.
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Accused Products
Abstract
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an area on the surface of the base at least partially bounded by the wire-bondable pads. A first integrated circuit (IC) die is flip-chip bonded to the flip-chip pads, and a second IC die is back-side attached to the first IC die and then wire-bonded to the wire-bondable pads. As a result, the flip-chip mounted first IC die is stacked with the second IC die in a simple, novel manner.
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Citations
18 Claims
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1. An electronic device comprising:
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a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, the at least one flip-chip pad of the first plurality of flip-chip pads being connected to at least one wire-bondable pad of the second plurality of wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one pad of the second plurality of wire-bondable pads on the surface of the base. - View Dependent Claims (2, 3, 4, 5)
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6. A memory device comprising at least two electronic devices, each memory device including:
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a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads, the at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire-bondable pad of the second plurality of wire-bondable pads; a first integrated circuit memory chip having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon connected to the at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit memory chip having opposing front-side and back-side surfaces, the back-side surface attached to the back-side surface of the first integrated circuit memory chip and the front-side surface having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit memory chip and at least one pad of the second plurality of wire-bondable pads on the surface of the base. - View Dependent Claims (7)
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8. An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input device, the output device, and the memory devices, one of the input device, the output device, the memory device, and processor device comprising:
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a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, the first plurality of flip-chip pads connected to the wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon, at least one flip-chip bumps of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface attached to the back-side surface of the first integrated circuit die and the front-side surface having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one pad of the second plurality of wire-bondable pads on the surface of the base.
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9. An electronic device comprising:
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a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to the first plurality of wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bumps of the first plurality of flip-chip bumps connected to at least one flip-chip pad of the second plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; a third integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the third integrated circuit die attached to the front-side surface of the second die and the front-side surface of the third integrated circuit die having a plurality of bond pads thereon; a first wire connected to at least one bond pad of the plurality of bond pads on the first surface of the second integrated circuit die and at least one wire-bondable pad of the second wire-bondable pads of the base; and a second wire connected to at least one bond pad of the plurality of bond pads on the first surface of the third integrated circuit die and at least one wire-bondable pad of the second wire-bondable pads of the base. - View Dependent Claims (10, 11, 12)
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13. An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input device, output device, and memory device, one of the input device, output device, memory device, and processor device comprising:
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a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire-bondable pad of the second plurality of wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon, at least one flip-chip bumps of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon a third integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the third integrated circuit die attached to the front-side surface of the second integrated circuit die and the front-side surface of the third integrated circuit die having a plurality of bond pads thereon; a first wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one wire-bondable pad of the second plurality of wire-bondable pads on the surface of the base; and a second wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the third integrated circuit die and at least one bond pad of the plurality of bond pads on the surface of the base.
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14. A base having a surface for carrying a first integrated circuit die having a plurality of flip-chip bumps on a front-side surface and having a back-side surface and a second integrated circuit die having a plurality of bond pads on a front-side surface and having a back-side surface, the base comprising:
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a first plurality of flip-chip pads arranged in a first pattern on the surface of the base, the first plurality of flip-chip pads connecting at least one flip-chip bump of the plurality of flip-chip bumps on the front-side surface of the first integrated circuit die carried on the surface of the base; and a second plurality of wire-bondable pads connected to the flip-chip pads and arranged in a pattern on the surface of the base, the wire-bondable pads and connected by a wire bonded to at least one bond pad of the second plurality of bond pads on the front-side surface of the second integrated circuit die carried on the back-side surface of the first integrated circuit die. - View Dependent Claims (15, 16)
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17. An electronic device comprising:
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a printed circuit board having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire bondable pad of the second plurality of wire-bondable pads on the surface of the printed circuit board; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one wire-bondable pad of the second plurality of wire-bondable pads on the surface of the base.
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18. An electronic device comprising:
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a printed circuit board having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire-bondable pad of the second plurality of wire-bondable pads in multiple layers of the printed circuit board such that the second plurality of flip-chip pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bump of the plurality of flip-chip bumps connected to the at least one flip chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die in and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least wire-bondable pad on the surface of the base.
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Specification