High temperature RFID tag

• US 5,973,599 A
• Filed: 10/15/1997
• Issued: 10/26/1999
• Est. Priority Date: 10/15/1997
• Status: Expired due to Term

• Current Assignee: Datalogic IP Tech S.r.l. (Datalogic S.p.A.)
• Original Assignee: Escort Memory Systems (Datalogic S.p.A.)
• Inventors: Monahan, Brian, Nicholson, Mark
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US08/943,679
• Time in Patent Office: 741 Days
• Field of Search: 340/572.8, 340/825.54, 340/825.34, 340/825.72, 342/42, 342/44, 342/51, 364/468.22, 364/468.23, 361/719, 361/720, 361/748, 174/52.2, 257/787, 257/788, 257/792, 257/793, 235/487
• US Class Current: 340/572.8
• CPC Class Codes: B29C 2045/14852 incorporating articles with a data carrier, e.g. chips
• CPC Class Codes: B29C 45/14 incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles B29C45/1671 takes precedence
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/047 the record carrier being shaped as a coin or a gambling token
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/0773 the record carrier comprising means to protect itself against external heat sources

Abstract

A high temperature RFID tag is described which has a survival temperature in the range of approximately -40° C. to 300° C. and an operating temperature of approximately -20° C. to 200° C. The RFID tag comprises a housing comprising a first thermally resistant material and having a base and a top, and a circuit board substrate comprising a second thermally resistant material which is encapsulated within the housing.

Claims

1. A high temperature RFID tag, comprising:

a housing having base and a top, said base and said top forming a chamber therein, said housing comprising a first thermally resistant material; and

a circuit board substrate disposed within said chamber, said substrate including an integrated circuit, said substrate comprising a second thermally resistant material;

said housing and said substrate jointly having a survival temperature in the range of approximately 220°

C. to 300°

C.

2. The RFID tag of claim 1, wherein said tag has an operating temperature in the range of -18°

C. to 135°

C.

3. The RFID tag of claim 1, wherein said circuit board substrate is encapsulated in said housing.

4. The RFID tag of claim 3, wherein a high temperature epoxy is employed to encapsulate said circuit board substrate.

5. The RFID tag of claim 1, wherein said first thermally resistant material comprises Teflon®

.

6. The RFID tag of claim 1, wherein said first thermally resistant material comprises a Ryton®

PPS compound.

7. The RFID tag of claim 1, wherein said second thermally resistant material comprises a polyimid.

8. The RFID tag of claim 7, wherein said polyimid is pre-conditioned.

9. The RFID tag of claim 1, wherein said second thermally resistant material comprises a ceramic compound.

10. The RFID tag of claim 1, wherein said housing has a substantially cylindrical shape.

11. The RFID tag of claim 1, wherein said housing has a substantially square shape.

12. A RFID tag, comprising:

a housing and substrate assembly,

said housing having base and a top, said base and said top forming a chamber therein, said housing comprising a first thermally resistant material,

said substrate disposed within said housing chamber and including an integrated circuit, said substrate comprising a second thermally resistant material,

said housing and substrate assembly having a survival temperature in the range of approximately 220°

C. to 300°

C. and an operating temperature range of approximately 18°

C. to 135°

C.,

said housing and substrate assembly being capable of exposure to cyclic changes in temperature to and between said operating temperature and said survival temperature without substantially affecting the performance characteristics of the tag upon returning to an operating temperature.

13. The RFID tag of claim 12, wherein said substrate is encapsulated in said housing chamber with a high temperature epoxy.

14. The RFID tag of claim 12, wherein said first thermally resistant material comprises a Ryton®

PPS compound.

15. The RFID tag of claim 12, wherein said second thermally resistant material comprises a pre-conditioned polyimid.

16. The RFID tag of claim 12, wherein said second thermally resistant material comprises a ceramic compound.