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High temperature RFID tag

  • US 5,973,599 A
  • Filed: 10/15/1997
  • Issued: 10/26/1999
  • Est. Priority Date: 10/15/1997
  • Status: Expired due to Term
First Claim
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1. A high temperature RFID tag, comprising:

  • a housing having base and a top, said base and said top forming a chamber therein, said housing comprising a first thermally resistant material; and

    a circuit board substrate disposed within said chamber, said substrate including an integrated circuit, said substrate comprising a second thermally resistant material;

    said housing and said substrate jointly having a survival temperature in the range of approximately 220°

    C. to 300°

    C.

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