Apparatus and method of securing a heat dissipating cover to a thermally conductive housing associated with a retail terminal
First Claim
1. A core module assembly of a retail terminal, comprising:
- a microprocessor which performs computing functions associated with operation of said retail terminal, whereby heat is generated by said microprocessor during performance of said computing functions;
a housing for containing said microprocessor, wherein (i) said housing has a first fastening surface, (ii) said housing includes a heat transfer structure positioned in thermal communication with said microprocessor, and (iii) said heat transfer structure has an elongated channel defined therein; and
a heat dissipating cover having an elongated tongue extending therefrom, wherein (i) said cover further has a second fastening surface, (ii) said cover is positionable between a non-biased position and a biased position, (iii) when said cover is positioned in said non-biased position, said first fastening surface of said housing is spaced apart from said second fastening surface of said cover and said tongue is positioned within said elongated channel, (iv) when said cover is positioned in said biased position, said first fastening surface of said housing is positioned in physical contact with said second fastening surface of said cover and said tongue is positioned within said elongated channel, and (v) when said cover is moved from said non-biased position to said biased position, said tongue is urged toward and into contact with an inner wall of said channel, whereby an efficient thermal interface is created between said tongue and said inner wall of said channel.
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Accused Products
Abstract
A core module assembly of a retail terminal includes a microprocessor which performs computing functions associated with operation of the retail terminal, whereby heat is generated by the microprocessor during performance of the computing functions. The core module assembly also includes a housing for containing the microprocessor. The housing has a first fastening surface. The housing also includes a heat transfer structure positioned in thermal communication with the microprocessor. The heat transfer structure has an elongated channel defined therein. The core module assembly further includes a heat dissipating cover having an elongated tongue extending therefrom. The cover further has a second fastening surface. The cover is positionable between a non-biased position and a biased position. When the cover is positioned in the non-biased position, the first fastening surface of the housing is spaced apart from the second fastening surface of the cover and the tongue is positioned within the elongated channel. When the cover is positioned in the biased position, the first fastening surface of the housing is positioned in physical contact with the second fastening surface of the cover and the tongue is positioned within the elongated channel. When the cover is moved from the non-biased position to the biased position, the tongue is urged toward and into contact with an inner wall of the channel, whereby an efficient thermal interface is created between the tongue and the inner wall of the channel.
37 Citations
22 Claims
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1. A core module assembly of a retail terminal, comprising:
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a microprocessor which performs computing functions associated with operation of said retail terminal, whereby heat is generated by said microprocessor during performance of said computing functions; a housing for containing said microprocessor, wherein (i) said housing has a first fastening surface, (ii) said housing includes a heat transfer structure positioned in thermal communication with said microprocessor, and (iii) said heat transfer structure has an elongated channel defined therein; and a heat dissipating cover having an elongated tongue extending therefrom, wherein (i) said cover further has a second fastening surface, (ii) said cover is positionable between a non-biased position and a biased position, (iii) when said cover is positioned in said non-biased position, said first fastening surface of said housing is spaced apart from said second fastening surface of said cover and said tongue is positioned within said elongated channel, (iv) when said cover is positioned in said biased position, said first fastening surface of said housing is positioned in physical contact with said second fastening surface of said cover and said tongue is positioned within said elongated channel, and (v) when said cover is moved from said non-biased position to said biased position, said tongue is urged toward and into contact with an inner wall of said channel, whereby an efficient thermal interface is created between said tongue and said inner wall of said channel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 21)
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9. A method of securing a heat dissipating cover to a housing of a computing device, wherein (i) the heat dissipating cover has an elongated tongue extending therefrom, and (ii) the housing includes a heat transfer structure which defines an elongated channel, comprising the steps of:
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positioning the cover in a non-biased position in which (i) the tongue is positioned within the elongated channel, and (ii) a first fastening surface of the housing is spaced apart from a second fastening surface of the cover; and moving the cover from the non-biased position to a biased position in which (i) the tongue remains positioned within the elongated channel, (ii) the first fastening surface of the housing is positioned in physical contact with the second fastening surface of the cover, and (iii) the tongue is biased against an inner wall of the channel, whereby an efficient thermal interface exists between the tongue and the inner wall of the channel. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 22)
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17. A computing device, comprising:
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an integrated circuit device which performs computing functions, whereby heat is generated by said integrated circuit device during performance of said computing functions; a heat transfer structure positioned in thermal communication with said integrated circuit device, said heat transfer structure has an elongated channel defined therein; a fastening structure having a first fastening surface; a heat dissipating member having an elongated tongue extending therefrom, wherein (i) said heat dissipating member has a second fastening surface, (ii) said heat dissipating member is positionable between a non-biased position and a biased position, (iii) when said heat dissipating member is positioned in said non-biased position, said first fastening surface of said fastening structure is spaced apart from said second fastening surface of said heat dissipating member and said tongue is positioned within said elongated channel, (iv) when said heat dissipating member is positioned in said biased position, said first fastening surface of said fastening structure is positioned in physical contact with said second fastening surface of said heat dissipating member and said tongue is positioned within said elongated channel, and (v) when said heat dissipating member is moved from said non-biased position to said biased position, said tongue is urged toward and into contact with an inner wall of said channel, whereby an efficient thermal interface is created between said tongue and said inner wall of said elongated channel. - View Dependent Claims (18, 19, 20)
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Specification