Packaging power converters

• US 5,973,923 A
• Filed: 05/28/1998
• Issued: 10/26/1999
• Est. Priority Date: 05/28/1998
• Status: Expired due to Term

• Current Assignee: DET International Holding Limited (Delta Electronics Incorporated)
• Original Assignee: Rompower, Inc. (Ascom Holding AG)
• Inventors: Jitaru, Ionel
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US09/086,365
• Time in Patent Office: 516 Days
• Field of Search: 361/683, 361/690-697, 361/700-721, 361/321.1, 361/818, 361/740, 363/147, 363/21, 257/685, 257/727, 257/668, 257/703, 165/80.3, 165/185, 165/80.1, 165/80.2, 365/37, 336/232, 336/200, 336/83, 336/198, 336/202, 336/183, 29/840, 29/602.1, 29/829, 29/852, 174/52.1, 174/252, 174/265, 205/125, 428/210, 428/131, 228/176, 228/123.1, 438/3, 438/616
• US Class Current: 361/704
• CPC Class Codes: H01F 27/06 Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09572 Solder filled plated through-hole in the final product soldering lead-in-hole components H05K3/3447
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A package for power converters in which a multilayers circuits board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portion of the bottom layer are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic elements to the footprint of the magnetic core. The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiment of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The baseplate has cutouts or cavities to accommodate the magnetic cores. A thermally conductive is placed between the magnetic core and the metal plate on the bottom of the cavity.

Claims

1. A package for electrical components, comprising:

a multilayer circuit board having a top side and a bottom side and inner layers;

windings of a magnetic element embedded in said multilayer circuit board;

a magnetic core penetrating through said multilayer circuit board through said windings;

power dissipating components placed on a first thermally conductive pad secured to the top side of said multilayer circuit board and connected to copper coated via which penetrate said multilayer circuit board to an opposing side of said multilayer circuit board to a second thermally conductive pad, a metal plate, an elevated section of metal plate attached to the bottom side of said multilayer circuit board through a thermally conductive insulated material, said elevated section of metal plate placed under said first thermally coductive pad, and thermally conductive compressible pad positioned between said magnetic core and said elevated section of metal plate.

2. The package of claim 1 wherein the said bottom side of said multilayers circuit board is attached to a metal plate through a thermally conductive insolated material, said metal plate having cutouts to accommodate said magnetic core which will penetrate through said cutouts and cutouts to accommodate the said electronic components placed on said bottom of the multilayers circuit board.

3. The package of claim 1 wherein the said bottom side of said multilayers circuit board is attached to a metal plate through a thermally conductive insolated material, said metal plate having cavities to accommodate said magnetic core which will penetrate into said cavities, a thermally conductive compressible pad in between said magnetic cores and the bottom of said cavities and cavities to accommodate the said electronic components placed on said bottom of the multilayers circuit board.

4. The package of claim 2, wherein the said metal plate has fins to increase the cooling surface.

5. The package of claim 3, wherein the said metal plate has fins to increase the cooling surface.

6. The package of claim 1, wherein the said metal plate has fins to increase the cooling surface.

7. The package of claim 1 mounted vertically on another circuit board and placed to sufficient distance to other packages of claim 1, paralleled to each other, to allow the air flow parallel with the surface of package of claim 1 to cool the surface of said multilayers circuit board.

8. The package of claim 4 mounted vertically on another circuit board and placed to sufficient distance to others packages of claim 1, parallel to each other, to allow the air flow parallel with the surface of package of claim 1 to cool the surface of said multilayers circuit board and said metal plate.

9. The package of claim 5 mounted vertically on another circuit board and placed to sufficient distance to others packages of claim 1, parallel to each other, to allow the air flow parallel with the surface of package of claim 1 to cool the surface of said multilayers circuit board and said metal plate.

10. The package of claim 6 mounted vertically on another circuit board and placed to sufficient distance to others packages of claim 1, parallel to each other, to allow the air flow parallel with the surface of package of claim 1 to cool the surface of said multilayers circuit board and said metal plate.

11. The package of claim 1 wherein the said winding of said magnetic elements are contained within the inner layers of said multilayers circuit board, some of the electrical components being placed on top layer located on top of said windings.

12. The package of claim 1, further including:

devices placed on said top side and thermally communicating with said second thermally conductive pad using a second copper coated via.