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Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components

DC
  • US 5,974,661 A
  • Filed: 01/20/1998
  • Issued: 11/02/1999
  • Est. Priority Date: 05/27/1994
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing a thin film surface-mount circuit protection device for protection against electrostatic transient voltage damage to electrical components, comprising the steps of:

  • a. providing a substrate having a top, a bottom and opposing sides;

    b. depositing, upon the top of a substrate, a first conductive layer to simultaneously form a pair of electrodes and a first terminal pad layer, the electrodes being spaced apart by a gap having a gap width, wherein depositing the electrodes creates a gap width of less than half of the width of one of the electrodes, wherein the gap width is intricately configured through photolithography in order to obtain specific electrical characteristics for the circuit device, and wherein the gap width, at least, partially determines a triggering voltage and a clamping voltage rating for the circuit device;

    c. depositing a voltage variable polymeric material in the gap and between the electrodes, wherein the voltage variable polymer provides for a non-linear electrical response to an electrostatic overvoltage condition, for protection against electrostatic transient voltage damage to electrical components; and

    ,d. covering the voltage variable polymeric material with a protective layer by smoothing a protective material over the voltage variable polymeric material to create a substantially flat upper surface of the protective layer.

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