Method of planarizing tips of probe elements of a probe card assembly

• US 5,974,662 A
• Filed: 11/09/1995
• Issued: 11/02/1999
• Est. Priority Date: 11/16/1993
• Status: Expired due to Term

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Mathieu, Gaetan L., Eldridge, Benjamin N., Grube, Gary W., Khandros, Igor Y.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US08/554,902
• Time in Patent Office: 1,454 Days
• Field of Search: 29/842, 29/423, 29/424, 29/843, 29/844, 29/845, 29/418, 439/60, 439/482, 174/261, 324/754, 324/761, 324/758, 361/772, 361/774, 361/776, 361/769, 361/789, 361/790, 361/791, 361/807, 361/809, 361/779
• US Class Current: 29/842
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: C25D 21/02 Heating or cooling
• CPC Class Codes: C25D 5/605 Surface topography of the layers, e.g. rough, dendritic or nodular layers
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4889 Connection or disconnection of other leads to or from wire-like parts, e.g. wires
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05184 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13639 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13644 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13647 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13655 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13657 : Cobalt [Co] as principal constituent
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 2224/45014 : Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 : being circular
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/4554 : Coating
• CPC Class Codes: H01L 2224/456 : with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48 : of an individual wire connector
• CPC Class Codes: H01L 2224/49109 : outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73203 : Bump and layer connectors
• CPC Class Codes: H01L 2224/78301 : Capillary
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/85043 : using a flame torch, e.g. hydrogen torch
• CPC Class Codes: H01L 2224/851 : the connector being supplied to the parts to be connected in the bonding apparatus
• CPC Class Codes: H01L 2224/85201 : Compression bonding
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06555 : Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15312 : being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/206 : Length ranges
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01R 12/52 : connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0397 : Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/068 : wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/1031 : Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10719 : Land grid array [LGA]
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10757 : Bent leads
• CPC Class Codes: H05K 2201/10878 : Means for retention of a lead in a hole
• CPC Class Codes: H05K 2201/10909 : Materials of terminal, e.g. of leads or electrodes of components
• CPC Class Codes: H05K 2201/10946 : Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/24 : Reinforcing the conductive pattern by solder coating H05K3/3457
• CPC Class Codes: H05K 3/308 : Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/3426 : characterised by the leads
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 7/1069 : with spring contact pieces
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49151 : by deforming or shaping

Abstract

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are "stacked up" so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer'"'"'s range of adjustment, by virtue of the interposer'"'"'s inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Claims

1. In a probe card assembly, a method of altering the orientation of probe elements for probing semiconductor devices, comprising:

providing a probe card;

providing a support substrate with plurality of probe elements for probing semiconductor devices;

mounting the support substrate on the probe card; and

altering the orientation of the support substrate relative to the probe card.

2. Method, according to claim 1, further comprising:

providing an interposer component having resilient contact structures on opposite surfaces thereof between the support substrate and the probe card.

3. Method, according to claim 1, wherein:

the support substrate is a space transformer.

4. Method, according to claim 1, wherein:

the probe elements are resilient contact structures.

5. Method, according to claim 1, wherein:

the probe elements are composite interconnection elements.

6. Method, according to claim 1, wherein:

the probe elements are elongate; and

further comprising;

joining pre-fabricated tip structures to the tips of the probe elements.

7. Method, according to claim 6, wherein:

prior to joining, the pre-fabricated tip structures are resident on a sacrificial substrate; and

further comprising;

after joining, removing the sacrificial substrate.

8. Method, according to claim 1, wherein:

arranging the probe elements in groups on the support substrate, each group of probe elements corresponding to a plurality of die sites on a semiconductor wafer.

9. Method, according to claim 1, wherein the orientation of the support substrate is adjusted by:

altering the orientation of the support substrate so that the probe elements make substantially simultaneous contact with a flat metal plate which is gradually urged against the probe elements.

10. Method, according to claim 1, further comprising:

providing resilient contact structures between the support substrate and the probe card.

11. Method, according to claim 1, wherein:

the probe elements are positioned approximately in a first plane having an orientation relative to the support substrate;

the probe card is positioned approximately in a second plane; and

altering the orientation of the support substrate relative to the probe card adjusts the orientation of the first plane of the probe elements relative to the second plane of the probe card.

12. Method, according to claim 1, wherein:

the semiconductor devices are resident on a semiconductor wafer.

13. In a probe card assembly, a method of altering the orientation of probe elements for probing semiconductor devices, comprising:

providing a probe card;

providing a support substrate with plurality of free-standing resilient probe elements for probing semiconductor devices;

mounting the support substrate on the probe card; and

altering the orientation of the support substrate relative to the probe card.

14. Method, according to claim 13, further comprising:

providing an interposer component having resilient contact structures on opposite surfaces thereof between the support substrate and the probe card.

15. Method, according to claim 13, further comprising:

providing resilient contact structures between the support substrate and the probe card.

16. Method, according to claim 13, wherein:

the support substrate is a space transformer.

17. Method, according to claim 13, wherein:

the probe elements are elongate; and

further comprising;

joining pre-fabricated tip structures to the tips of the probe elements.

18. Method, according to claim 13, wherein:

arranging the probe elements in groups on the support substrate, each group of probe elements corresponding to a plurality of die sites on a semiconductor wafer.

19. Method, according to claim 13, wherein:

the semiconductor devices are resident on a semiconductor wafer.

20. In a probe card assembly, a method of altering the orientation of probe elements for probing semiconductor devices, comprising:

providing a probe card;

providing a support substrate with plurality of free-standing composite probe elements for probing semiconductor devices;

mounting the support substrate on the probe card; and

altering the orientation of the support substrate relative to the probe card.

21. Method, according to claim 20, further comprising:

providing an interposer component having resilient contact structures on opposite surfaces thereof between the support substrate and the probe card.

22. Method, according to claim 20, further comprising:

providing resilient contact structures between the support substrate and the probe card.

23. Method, according to claim 20, wherein:

the support substrate is a space transformer.

24. Method, according to claim 20, wherein:

the probe elements are elongate; and

further comprising;

joining pre-fabricated tip structures to the tips of the probe elements.

25. Method, according to claim 20, wherein:

arranging the probe elements in groups on the support substrate, each group of probe elements corresponding to a plurality of die sites on a semiconductor wafer.

26. Method, according to claim 20, wherein:

the semiconductor devices are resident on a semiconductor wafer.

27. In a probe card assembly, a method of altering the orientation of probe elements for probing semiconductor devices, comprising:

providing a probe card;

providing a support substrate with plurality of probe elements for probing semiconductor devices;

mounting the support substrate on the probe card; and

altering the orientation of the probe elements relative to the probe card by altering the orientation of the support substrate relative to the probe card.

28. Method, according to claim 27, wherein:

the probe elements are free-standing and resilient.

29. Method, according to claim 27, wherein:

the probe elements are free-standing and composite.

30. Method, according to claim 27, further comprising:

providing an interposer component having resilient contact structures on opposite surfaces thereof between the support substrate and the probe card.

31. Method, according to claim 27, further comprising:

providing resilient contact structures between the support substrate and the probe card.

32. Method, according to claim 27, wherein:

the support substrate is a space transformer.

33. Method, according to claim 27, wherein:

the probe elements are elongate; and

further comprising;

joining pre-fabricated tip structures to the tips of the probe elements.

34. Method, according to claim 27, wherein:

arranging the probe elements in groups on the support substrate, each group of probe elements corresponding to a plurality of die sites on a semiconductor wafer.

35. Method, according to claim 27, wherein:

the semiconductor devices are resident on a semiconductor wafer.