Apparatus for use in cleaning wafers

• US 5,974,680 A
• Filed: 08/22/1997
• Issued: 11/02/1999
• Est. Priority Date: 03/11/1996
• Status: Expired due to Fees

• Current Assignee: SunEdison, Inc.
• Original Assignee: SunEdison, Inc.
• Inventors: Wilson, Keith, Anderson, Gary L.
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): GRAVINI, STEPHEN MICHAEL
• Application Number:
  US08/917,206
• Time in Patent Office: 802 Days
• Field of Search: 34/58, 34/60, 34/61, 34/236, 34/573, 34/202, 34/238, 210/774, 134/902
• US Class Current: 34/58
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

A semiconductor wafer scrubbing and drying apparatus is capable processing wafers in a vertical orientation from start to finish. The apparatus moves the wafers in a generally vertical direction from an entry station of the apparatus to a dryer of the apparatus. The wafers enter the apparatus in a cassette and exit in another cassette in the same order as they were in the entry cassette to preserve individual wafer identity. The apparatus is constructed so that the compartment in which the wafers are handled is isolated and the components handling the wafers in that compartment are made of a fluorinated plastic. The actuators driving the motion of the wafer handling components are located in another compartment. A rinsing device in the wafer handling compartment is activated and deactivate for rinsing one of the wafers without the use of valves in the rinse line.

Claims

1. Apparatus for use in automatically cleaning semiconductor wafers, the apparatus comprising:

a wafer entry station for receiving multiple wafers held in a vertical orientation;

first wafer transfer means for transferring one wafer at a time from the wafer entry station without changing the vertical orientation of said one wafer;

a spin dryer constructed for receiving said one wafer from said first wafer transfer means and holding said one wafer in a vertical orientation, the spin dryer being rotatable about an axis passing generally through the center of said one wafer received from said first wafer transfer means at a rate of rotation selected to throw liquid on said one wafer off of the wafer;

second wafer transfer means for transferring said one wafer from the spin dryer in a vertical orientation;

a wafer exit station for receiving said one wafer from said second wafer transfer means in a vertical orientation.

2. Apparatus as set forth in claim 1 wherein said first and second wafer transfer means are constructed for holding said one wafer solely along a lower edge margin of said one wafer.

3. Apparatus as set forth in claim 2 wherein said first wafer transfer means comprises a wafer picker including an arm and finger means on an end of the arm, the wafer picker being movable generally vertically downwardly to position said finger means at a level below the wafers in the wafer entry station, movable generally horizontally to position said finger means under said lower edge margin of said one wafer and movable vertically upwardly to lift said one wafer out of the wafer entry station.

4. Apparatus as set forth in claim 3 wherein said first wafer transfer means further comprises first and second wafer transports for receiving said one wafer from the wafer picker and transporting the wafer to the spin dryer, the first wafer transport comprising an arm and finger means on the arm, the first wafer transport and wafer picker being relatively movable to position said finger means of the first wafer transport under said finger means of the wafer picker, said finger means of the first wafer transport being offset from said finger means of the wafer picker whereby upon relative vertical movement between the wafer picker and first wafer transport said one wafer is transferred to said finger means of the wafer transport, said second wafer transport comprising an arm and finger means on the arm, the first and second wafer transports being relatively movable to position said finger means of the second wafer transport under said finger means of the first wafer transport where upon relative vertical movement between the first and second wafer transports said one wafer is transferred to said finger means of the second wafer transport.

5. Apparatus as set forth in claim 4 wherein the spin dryer comprises first and second jaws and a plurality of pegs connected to the first and second jaws, the jaws being pivotable between an open position and a closed position in which the pegs are adapted to grip said one wafer and hold said one wafer for spinning, the second wafer transport being movable to bring said one wafer into the jaws in their open position, said finger means of the second wafer transport being offset from the pegs to permit the pegs to move past said finger means to the closed position for gripping said one wafer.

6. Apparatus as set forth in claim 5 wherein said second wafer transfer means comprises a wafer take-off transport for taking said one wafer out of the spin dryer, the wafer take-off transport comprising an arm and finger means on the arm, the wafer take-off transport and spin dryer being relatively movable to position said finger means of the wafer take-off transport under the pegs of the spin dryer in the closed position, said finger means of the wafer take-off transport being offset from the pegs of the spin dryer whereby upon movement of the jaws to the open position said one wafer is transferred to said finger means of the wafer take-off transport.

7. Apparatus as set forth in claim 6 wherein said second wafer transfer means further comprises a wafer placer including an arm and finger means on an end of the arm, the wafer take-off transport and wafer placer being relatively movable to position said finger means of the wafer take-off transport under said finger means of the wafer placer, said finger means of the wafer take-off transport being offset from said finger means of the wafer placer whereby upon relative vertical movement between the wafer placer and wafer take-off transport said one wafer is transferred to said finger means of the wafer placer, the wafer placer being movable generally vertically downwardly to deposit said one wafer in the wafer exit station.

8. Apparatus as set forth in claim 1 wherein the spin dryer is located above the wafer entry station.

9. Apparatus as set forth in claim 8 further comprising opposing wafer scrubber rollers located between the wafer entry station and the spin dryer for scrubbing said one wafer, the wafer scrubber rollers being located above the wafer entry station and the spin dryer being located above the wafer scrubber rollers.

10. Apparatus as set forth in claim 9 further comprising wafer spin pins disposed generally below the scrubbing rollers for holding said one wafer and rotating the wafer as it is engaged by the scrubbing rollers, the wafer spin pins being constructed for holding said one wafer in a vertically upright position by engagement only along its peripheral edge margin.

11. Apparatus as set forth in claim 9 further comprising a wafer rinsing device for rinsing the wafer, the rinsing device comprising a spray nozzle adapted to continuously deliver a stream of rinsing liquid in a direction to engage a face of the wafer, and a deflector for deflecting the stream of water away from the wafer.

12. Apparatus as set forth in claim 11 wherein the deflector comprises a splash box having first and second compartments separated by a wall, a plurality of substantially aligned openings, the spray nozzle being constructed for delivering said stream of rinsing liquid through the aligned openings, and deflector shields mounted for being selectively interposed in the stream of rinsing liquid to deflect the liquid from the wafer.

13. Apparatus as set forth in claim 8 wherein the spin dryer comprises first and second jaws and a plurality of pegs connected to the first and second jaws, the jaws being pivotable between an open position and a closed position in which the pegs are adapted to grip said one wafer and hold said one wafer for spinning.

14. Apparatus as set forth in claim 13 wherein the jaws are constructed to surround the wafer in the closed position of the jaws, each jaw having an arcuate channel which is curved in cross section and includes a radially inwardly extending portion to capture liquid thrown off of the wafer and prevent liquid from dripping back onto the wafer.

15. Apparatus as set forth in claim 14 further comprising an annular outer splash shield surrounding the jaws, the splash shield having an annular channel which is curved in cross section and includes a radially inwardly extending portion to capture liquid and prevent liquid from dripping back onto the wafer.

16. Apparatus as set forth in claim 1 wherein the spin dryer comprises first and second jaws and a plurality of pegs connected to the first and second jaws, the jaws being pivotable between an open position and a closed position in which the pegs are adapted to grip said one wafer and hold said one wafer for spinning.

17. Apparatus as set forth in claim 16 wherein the jaws are constructed to surround the wafer in the closed position of the jaws, each jaw having an arcuate channel which is curved in cross section and includes a radially inwardly extending portion to capture liquid thrown off of the wafer and prevent liquid from dripping back onto the wafer.

18. Apparatus as set forth in claim 17 further comprising an annular outer splash shield surrounding the jaws, the splash shield having an annular channel which is curved in cross section and includes a radially inwardly extending portion to capture liquid and prevent liquid from dripping back onto the wafer.

19. Apparatus as set forth in claim 1 further comprising:

a compartment substantially enclosing a volume to be isolated;

a wafer entry station for receiving wafers;

paid first wafer transfer means comprising means for holding wafers and means for actuating movement of said holding means, said holding means being disposed within the compartment and said means for actuating movement of said holding means being disposed outside the housing, said holding means extending through the compartment to connect to said actuating means outside the compartment;

said second wafer transfer means comprising means for holding wafers and means for actuating movement of said holding means, said holding means being disposed within the compartment and said means for actuating movement of said holding means being disposed outside the compartment, said holding means extending through the compartment to connect to said actuating means outside the compartment.

20. Apparatus as set forth in claim 19 wherein the dryer comprises a wafer holding mechanism located inside the compartment and means for actuating rotation of said wafer holding mechanism located outside of the compartment.

21. Apparatus as set forth in claim 20 wherein the compartment comprises at least one double wall including an inner panel and an outer panel, said holding means of said first and second wafer transfer means extending through the double wall to connect to said actuating means of said first and second wafer transfer means.

22. Apparatus as set forth in claim 21 wherein the inner and outer panels of the double wall are spaced apart, the apparatus further comprising a drain disposed for draining liquid trapped between the inner and outer panels.

23. Apparatus as set forth in claim 21 wherein said holding means of said first and second wafer transfer means is made of non-metallic material.

24. Apparatus as set forth in claim 23 wherein said wafer holding means are made of a fluorinated plastic.