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High pressure fitting

  • US 5,975,590 A
  • Filed: 02/17/1998
  • Issued: 11/02/1999
  • Est. Priority Date: 02/17/1998
  • Status: Expired due to Fees
First Claim
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1. A system for conducting high pressure fluid from a source of high pressure fluid to a semiconductor processing chamber, the system having:

  • a plurality of tubes through which the high pressure fluid flows; and

    at least one fitting body for connecting the tubes and changing a direction in which the fluid flows, the fitting body comprising;

    an outer surface;

    an inner surface;

    a passageway defined by the inner surface through which high pressure fluid is conducted, the passageway having at least a first end and a second end; and

    a material thickness between the inner and outer surfaces of the fitting body sufficient to withstand the forces exerted thereon by the chance of direction of the high pressure fluid, wherein the inner and outer surfaces of at least one of the first and second ends of the passageway are welding surfaces.

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