Thermally and electrically enhanced PBGA package

• US 5,977,626 A
• Filed: 08/12/1998
• Issued: 11/02/1999
• Est. Priority Date: 08/12/1998
• Status: Expired due to Term

• Current Assignee: Acer, Inc.
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Pou-Huang, Wang, Hsing-Seng, Lee, Rong-Shen
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US09/133,483
• Time in Patent Office: 447 Days
• Field of Search: 257/787, 257/796, 257/706, 257/707, 257/718, 257/778, 257/719, 257/691
• US Class Current: 257/707
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

The present invention includes a substrate having a die adhered thereon. The die and the substrate are interconnected by means of signal transferring means. Solder bumps are formed on the bottom side surface of the substrate. Molding compound is encapsulated among the substrate, the die and a heat spreader. A heat spreader is arranged over the top surface of the substrate. The heat spreader includes a plane having four supporting members that are set on the bottom side of the plane and at the corners of the plane. The supporting members are protruded from the plane to connect the heat spreaders and the substrate. The heat spreader further includes a protruded portion. A further supporting member is formed on the central portion of the protruded portion. The substrate has a die paddle formed thereon for receiving the die. A power ring is formed around the die paddle on the surface of the substrate for power input. A ground ring formed around the power ring on the substrate has ground pads. The supporting members of the heat spreader are connected on the ground pads by using the heat spreader attach material.

Claims

1. A semiconductor package, said package comprising:

a substrate having a die paddle for receiving a die adhered thereon, a ground ring formed around said die paddle, wherein said ground ring has ground pads;

a heat spreader having supporting members formed over on said substrate and said die, said supporting members being connected to said ground pads;

signal transferring means for electrically connecting between said substrate and said die, said heat spreader comprising a plane, wherein said supporting members are set on a bottom surface and at corners of said plane, a protruded portion shaped to prevent said heat spreader from contacting with said die and said signal transferring means;

encapsulating material filling among said substrate, said die, and said heat spreader; and

a first ball grid array (BGA) formed on a bottom surface of said substrate.

2. The package of claim 1, wherein said supporting members are connected to said ground pads by means of conductive glue.

3. The package of claim 1, wherein said signal transferring means comprises bonding wires.

4. The package of claim 3, wherein said bonding wires include gold wires.

5. The package of claim 1, wherein said signal transferring means comprises conductive tape.

6. The package of claim 1, wherein said signal transferring means comprises a second ball grid array (BGA).

7. A semiconductor package, said package comprising:

a substrate having ground pads;

a die adhered on said substrate;

a heat spreader having supporting members formed over on said substrate and said die by means for said supporting members connecting to said ground pads;

signal transferring means for electrically connecting between said substrate and said die, said heat spreader comprising a plane, wherein said supporting members are set on a bottom surface and at corners of said plane, a protruded portion shaped to prevent said heat spreader from contacting with said die and said signal transferring means;

encapsulating material filling among said substrate, said die, and said heat spreader; and

a first ball grid array (BGA) formed on a bottom surface of said substrate.

8. The package of claim 7, wherein said supporting members are connected to said ground pads by means of conductive glue.

9. The package of claim 7, wherein said signal transferring means comprises bonding wires.

10. The package of claim 9, wherein said bonding wires include gold wires.

11. The package of claim 7, wherein said signal transferring means comprises conductive tape.

12. The package of claim 7, wherein said signal transferring means comprises a second ball grid array (BGA).

13. The package of claim 7, wherein said substrate further includes a ground ring formed around said die paddle, wherein said ground pads are connected to said ground ring.

14. A semiconductor package, said package comprising:

a substrate having a die paddle for receiving a die adhered thereon, a ground ring formed around said die paddle, wherein said ground ring has ground pads;

signal transferring means for electrically connecting between said substrate and said die;

a heat spreader having first supporting members formed over on said substrate and said die, said first supporting members being connected to said ground pads, said heat spreader comprising a plane, wherein said first supporting members are set on a bottom surface and at corners of said plane, a protruded portion shaped to prevent said heat spreader from contacting with said signal transferring means, a second supporting member formed on a central portion of said protruded portion;

encapsulating material filling among said substrate, said die, and said heat spreader; and

a first ball grid array (BGA) formed on a bottom surface of said substrate.

15. The package of claim 14, wherein said supporting members are connected to said ground pads by means of conductive glue.

16. The package of claim 14, wherein said signal transferring means comprises bonding wires.

17. The package of claim 16, wherein said bonding wires include gold wires.

18. The package of claim 14, wherein said signal transferring means comprises conductive tape.

19. The package of claim 14, wherein said signal transferring means comprises a second ball grid array (BGA).

20. A semiconductor package, said package comprising:

a substrate having ground pads;

a die adhered on said substrate;

signal transferring means for electrically connecting between said substrate and said die;

a heat spreader having first supporting members formed over on said substrate and said die by means of said first supporting members connecting to said ground pads, said heat spreader comprising a plane, wherein said first supporting members are set on a bottom surface and at corners of said plane, a protruded portion shaped to prevent said heat spreader from contacting with said signal transferring means, a second supporting member formed on a central portion of said protruded portions;

encapsulating material filling among said substrate, said die, and said heat spreader; and

a first ball grid array (BGA) formed on a bottom surface of said substrate.

21. The package of claim 20, wherein said supporting members are connected to said ground pads by means of conductive glue.

22. The package of claim 20, wherein said signal transferring means comprises bonding wires.

23. The package of claim 22, wherein said bonding wires include gold wires.

24. The package of claim 20, wherein said signal transferring means comprises conductive tape.

25. The package of claim 20, wherein said signal transferring means comprises a second ball grid array (BGA).

26. The package of claim 20, wherein said substrate further includes a ground ring formed around said die paddle, wherein said ground pads are connected to said ground ring.

27. A semiconductor package, said package comprising:

a substrate having a die adhered thereon, a ground ring formed around said die paddle, wherein said ground ring has ground pads;

signal transferring means for electrically connecting between said substrate and said die;

a heat spreader having first supporting members formed over on said substrate and said die, said first supporting members being connected to said ground pads, said heat spreader comprising a plane, wherein said first supporting members are set on a bottom surface and at corners of said plane, a protruded portion shaped to prevent said heat spreader from contacting with said signal transferring means, wherein said ground ring and said heat spreader construct an electric and magnetic (EM) shielding to suppress the EM effect and reduce the I inductance impedance;

encapsulating material filling among said substrate, said die, and said heat spreader; and

a first ball grid array (BGA) formed on a bottom surface of said substrate.

28. The package of claim 27, wherein said substrate further includes a second supporting member formed on a central portion of said protruded portion.